公开(公告)号：US20020126460A1

公开(公告)日：2002-09-12

申请号：US10085302

申请日：2002-02-28

Inventor： Bjorn Heismann ,  Quirin Spreiter ,  Helmut Winkelmann

IPC: H05K001/00

CPC classification number: H05K1/112 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/12043 ,  H01L2924/3025 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/09472 ,  H05K2203/049 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A printed circuit board arrangement with a flexible layer arrangement of at least one electrically conductive layer with a large number of conductor tracks lying next to one another and surrounded by electrically isolating layers has at least one printed circuit board firmly connected to a portion of the flexible layer arrangement and accommodating a component. To form a connection between the component and the conductor tracks of the flexible layer, an opening through the printed circuit board to the conductor tracks is provided, which opening may be stepped, so that different conductor tracks and different layers can be reached.

Abstract translation: 具有柔性层布置的印刷电路板布置具有至少一个具有彼此相邻并被电绝缘层包围的多个导体轨道的导电层的导电层，至少一个印刷电路板牢固地连接到柔性的一部分 层布置和容纳部件。 为了形成柔性层的部件和导体轨道之间的连接，提供通过印刷电路板到导体轨道的开口，该开口可以是阶梯状的，使得可以达到不同的导体轨迹和不同的层。

公开(公告)号：US20020113312A1

公开(公告)日：2002-08-22

申请号：US10132960

申请日：2002-04-26

Applicant: 3M Innovative Properties Company

Inventor： William J. Clatanoff ,  Gayle R.T. Schueller ,  Robert J. Schubert ,  Yusuke Saito ,  Hideo Yamazaki ,  Hideaki Yasui

IPC: H01L023/48

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/10681 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract translation: 电路包括具有第一表面和第二表面的电介质层的衬底。 导电层形成在第一表面上。 在基板的电介质层中形成斜面通孔。 通孔具有第一表面中的第一宽度的第一开口和第二表面中的第二宽度的第二开口，第二宽度大于第一宽度。 导电插头连接到导电层。 插塞形成在通孔中并且从邻近第一开口朝向第二开口延伸并且在插头接口表面处邻近第二开口终止。 导电焊球连接到插头接口表面并延伸以从第二表面突出。

公开(公告)号：US20020100610A1

公开(公告)日：2002-08-01

申请号：US10040804

申请日：2001-11-08

Inventor： Masao Yasuda ,  Masato Sumikawa

IPC: H01L029/43 ,  H05K001/16

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/013

Abstract: An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are provided. The semiconductor device includes, on electrodes, connection materials connecting the semiconductor device and a substrate. The connection materials include a composite connection material formed of a core and a conductor covering the core, the core having an a low modulus of elasticity at room temperature smaller than that of the conductor at room temperature, and a single-layer connection material formed of a conductor.

Abstract translation: 提供了具有用于增加安装过程中的容许位置偏差的电极结构的电子部件以及用于安装半导体器件的方法和结构。 半导体器件在电极上包括连接半导体器件和衬底的连接材料。 连接材料包括由芯体和覆盖芯部的导体形成的复合连接材料，该芯在室温下的室温下的弹性模量低于室温下的导体的低弹性模量;以及单层连接材料，由 指挥

公开(公告)号：US06417747B1

公开(公告)日：2002-07-09

申请号：US09935496

申请日：2001-08-23

Applicant: Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

Inventor： Timothy E. Dearden ,  Jeffrey J. Stitt ,  Clifton Quan

IPC: H01P100

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/305 ,  H05K3/306 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09809 ,  H05K2201/10348 ,  H05K2201/10371 ,  H05K2201/10575 ,  H05K2201/10689 ,  H05K2203/1147

Abstract: An RF interconnect is incorporated in RF module packages for direct attachment onto a multi-layer PWB using compressible center conductor (fuzz button) interconnects. The module has circuitry operating at microwave frequencies. The module package includes a metal housing including a metal bottom wall structure. The module includes a plurality of RF interconnects, which provide RF interconnection between the package and the PWB. Each interconnect includes a feedthrough center pin protruding through an opening formed in the metal bottom wall, with isolation provided by a dielectric feedthrough insulator. The center pin is surrounded with a ring of shield pins attached to the external surface of the bottom wall of the module housing. The pins are insertable in holes formed in the PWB, and make contact with fuzz button interconnects disposed in the holes. Circuitry connects the fuzz button interconnects to appropriate levels of the PWB for grounding and RF signal conduction.

Abstract translation: RF互连结合在RF模块封装中，以使用可压缩中心导体（Fuzz按钮）互连直接连接到多层PWB上。 该模块具有以微波频率工作的电路。 模块封装包括金属外壳，其包括金属底壁结构。 该模块包括多个RF互连，其在封装和PWB之间提供RF互连。 每个互连件包括穿过形成在金属底壁中的开口突出的馈通中心销，由隔离绝缘子提供隔离。 中心销被围绕着一个安装在模块壳体底壁外表面的屏蔽销圈。 销可插入形成在PWB中的孔中，并与布置在孔中的绒头按钮互连接触。 电路将毛绒按钮互连连接到PWB的适当级别，用于接地和RF信号传导。

公开(公告)号：US20020084308A1

公开(公告)日：2002-07-04

申请号：US09811573

申请日：2001-03-20

Applicant: Fujitsu Limited, Kawasaki, Japan

Inventor： Kanako Imai ,  Nobutaka Ito ,  Fumihiko Ando

IPC: B23K001/00 ,  B23Q015/00 ,  B23K031/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L2224/11334 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2203/163 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A method of evaluating configuration of solder external terminals of a BGA-type tape-based semiconductor device mounted on a board such that the external terminals are joined to lands provided on the mounting board is provided. The method includes the step of obtaining geometric data related to opening of a tape substrate of the semiconductor device, solder balls to be placed at positions corresponding to the openings, and the lands of the mounting board and the step of deribing configuration of the solder external terminal based on the geometric date. The method further includes the step of calculating the volume of voids to be produced in the external terminals, so as to compensate for the geometric data related to the tape substrate.

Abstract translation: 提供了一种评估安装在板上的BGA型带基半导体器件的焊接外部端子的配置，使得外部端子接合到设置在安装板上的焊盘的方法。 该方法包括以下步骤：获得与半导体器件的带基板的开口有关的几何数据，放置在与开口相对应的位置的焊球和安装板的焊盘以及焊接外部的起弧构造的步骤 终端基于几何日期。 该方法还包括计算在外部端子中产生的空隙体积的步骤，以补偿与带基板有关的几何数据。

公开(公告)号：US06408511B1

公开(公告)日：2002-06-25

申请号：US09643387

申请日：2000-08-21

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01R900

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/245 ,  H05K3/321 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/072 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a bottom formed by a termination pad over a via in a first tape layer and side walls formed by termination sides formed over side walls of a via in a second tape layer. A diffusion layer is formed over the termination cup. The diffusion layer helps to reduce the oxidation of the termination cup and to provide greater mechanical attachment strength. An electrically conductive adhesive may be used to connect a solder ball to the diffusion layer. Reflow then is used to complete the solder ball connection process.

Abstract translation: 提供了一种用于在低温共烧陶瓷（LTCC）衬底中提供增强的球栅阵列附件的方法。 终端杯形成在基板中。 终端杯具有由第一带层中的通孔上的终端焊盘形成的底部，并且由在第二带层中的通孔的侧壁上形成的端接端形成的侧壁。 在终端杯上形成扩散层。 扩散层有助于减少端接杯的氧化并提供更大的机械附着强度。 可以使用导电粘合剂将焊球连接到扩散层。 回流则用于完成焊球连接过程。

公开(公告)号：US20020066584A1

公开(公告)日：2002-06-06

申请号：US10002198

申请日：2001-12-05

Inventor： Yoichiro Kurita

IPC: H02G003/08 ,  H05K005/00 ,  H02G003/00

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/10125 ,  H01L2224/10126 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/351 ,  H04W8/20 ,  H05K3/3426 ,  H05K2201/0367 ,  H05K2201/09472 ,  Y02P70/613 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05099

Abstract: An electric terminal of an electronic device includes an external electrode, a flexible lead member for connecting the external electrode to a pad of the electronic device, and a support member for surrounding the lead member and mechanically supporting the external electrode when the lead member is deformed by a heat stress applied to the external electrode. By separating the electric connection function from the supporting function in the electric terminal, a reliable connection can be achieved after a heat cycle test of the electronic device.

Abstract translation: 电子设备的电气端子包括外部电极，用于将外部电极连接到电子设备的焊盘的柔性引线部件和用于围绕引线部件并在引线部件变形时机械地支撑外部电极的支撑部件 通过施加到外部电极的热应力。 通过将电连接功能与电气端子中的支撑功能分离，在电子设备的热循环测试之后可以实现可靠的连接。

公开(公告)号：US06392165B1

公开(公告)日：2002-05-21

申请号：US09939234

申请日：2001-08-24

Applicant: Sheng-Ji Liao

Inventor： Sheng-Ji Liao

IPC: H01R909

CPC classification number: H01R12/526 ,  H05K1/112 ,  H05K1/141 ,  H05K3/368 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2203/0455

Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes and are coaxial therewith. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.

Abstract translation: 提供了一种适配器，用于将球栅阵列装置安装在针式集成电路插座上，并且包括基板和接口板。 基板具有在其上形成有多个焊盘的器件安装侧。 基板还形成有多个上通孔，每个上通孔对应于焊盘之一。 接口板形成有分别对应于上通孔并与其同轴的多个下通孔。 接口板还具有一个与其相对的多个插入销的面对面的插座。 电导体设置在基板和接口板上，用于经由上和下通孔电连接和分别焊接焊盘和插入销。

公开(公告)号：US06373267B1

公开(公告)日：2002-04-16

申请号：US09070339

申请日：1998-04-30

Applicant: Hajime Hiroi

Inventor： Hajime Hiroi

IPC: G01R3102

CPC classification number: H05K1/112 ,  G01R1/0483 ,  H05K3/325 ,  H05K2201/09472 ,  H05K2201/09827 ,  H05K2201/10734

Abstract: A measuring mechanism for a BGA-IC capable of facilitating and assuring the contact between a soldering ball of a BGA-IC and a BGA contact seat even if a foreign matter is sandwiched therebetween, and also capable of saving time involved in recontact therebetween, and of shortening measuring time. The measuring mechanism for a BGA-IC comprising a substrate including a BGA contact seat which is embedded therein and has a conical contact surface, wherein the BGA contact seat is connected to a tester, and the BGA-IC has the soldering ball and wherein the soldering ball contacts the conical contact surface of the BGA contact seat when the BGA-IC is tested.

Abstract translation: 一种用于BGA-IC的测量机构，其能够有助于并确保BGA-IC的焊球与BGA接触座之间的接触，即使异物夹在其间，并且还能够节省涉及其之间的重新调整的时间，以及 缩短测量时间。 一种BGA-IC的测量机构，其特征在于：包括嵌入其中并具有锥形接触表面的BGA接触座的基板，其中所述BGA接触座连接到测试器，并且所述BGA-IC具有所述焊球， 当测试BGA-IC时，焊球与BGA接触座的锥形接触表面接触。

公开(公告)号：US20020029903A1

公开(公告)日：2002-03-14

申请号：US09939234

申请日：2001-08-24

Applicant: Witek Enterprise Co., Ltd. a Taiwan Corporation

Inventor： Sheng-Ji Liao

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H01R12/526 ,  H05K1/112 ,  H05K1/141 ,  H05K3/368 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2203/0455

Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.

Abstract translation: 提供了一种适配器，用于将球栅阵列装置安装在针式集成电路插座上，并且包括基板和接口板。 基板具有在其上形成有多个焊盘的器件安装侧。 焊盘对应于并适用于其上的球栅阵列器件的焊球的表面安装。 基板还形成有多个上通孔，每个上通孔对应于焊盘之一。 接口板形成有分别对应于上通孔的多个下通孔。 接口板还具有一个与其相对的多个插入销的面对面的插座。 插入销对应于并适于插入到集成电路插座中的针孔中，以便与设置在销孔中的板安装销建立电接触。 电导体设置在基板和接口板上，用于经由上和下通孔电连接和分别焊接焊盘和插入销。