公开(公告)号：US20160255728A1

公开(公告)日：2016-09-01

申请号：US14976266

申请日：2015-12-21

Applicant: FUJITSU LIMITED

Inventor： Takashi KANDA

IPC: H05K3/30 ,  H05K1/18 ,  B23K1/00 ,  H05K1/11

CPC classification number: B23K1/0016 ,  H01L23/15 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09036 ,  H05K2201/09136 ,  H05K2201/094 ,  H05K2201/09572 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10734 ,  Y02P70/613

Abstract: A semiconductor package includes: a first substrate, disposed so as to be opposed to a second substrate, on which a semiconductor chip is mounted; and a solder ball formed on the first substrate, wherein the solder ball is joined to a pin that penetrates through the second substrate.

Abstract translation: 半导体封装包括：第一衬底，被布置成与其上安装有半导体芯片的第二衬底相对; 以及形成在所述第一基板上的焊球，其中所述焊球与穿过所述第二基板的销接合。

公开(公告)号：US20160157346A1

公开(公告)日：2016-06-02

申请号：US14571621

申请日：2014-12-16

Applicant: BOE Technology Group Co., Ltd.

Inventor： Yue Wu

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02

CPC classification number: H05K1/113 ,  H05K1/112 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/10734 ,  Y02P70/613

Abstract: A printed circuit board, a ball grid array package and a wiring method of a printed circuit board are provided. The printed circuit board comprises: a substrate, the substrate including a plurality of insulating layers stacked and a plurality of conductive layers disposed between adjacent insulating layers; a plurality of pads, disposed in a two-dimensional matrix on a surface of the substrate; and a plurality of via holes, disposed corresponding to each pad and running through the substrate and the corresponding pad. The ball grid array package according to an embodiment of the invention comprises the above-described printed circuit board.

Abstract translation: 提供印刷电路板，球栅阵列封装和印刷电路板的布线方法。 印刷电路板包括：基板，所述基板包括堆叠的多个绝缘层，以及设置在相邻绝缘层之间的多个导电层; 多个衬垫，设置在所述衬底的表面上的二维矩阵中; 以及多个通孔，对应于每个焊盘设置并穿过衬底和相应的焊盘。 根据本发明的实施例的球栅阵列封装包括上述印刷电路板。

公开(公告)号：US20150092374A1

公开(公告)日：2015-04-02

申请号：US14044135

申请日：2013-10-02

Applicant: International Business Machines Corporation

Inventor： Phillip D. Isaacs

IPC: H05K3/42 ,  H05K1/02

CPC classification number: H05K1/181 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0209 ,  H05K1/0215 ,  H05K1/114 ,  H05K1/116 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/429 ,  H05K2201/09572 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2203/0207 ,  H05K2203/176 ,  Y10T29/49144

Abstract: A method includes fabricating a printed circuit board. The fabricating includes forming at least one conductive layer on top a first dielectric layer, wherein the at least one conductive layer comprises at least one of a ground plane and a power plane. The fabricating includes forming a second dielectric layer on top of the at least one conductive layer. The fabricating includes forming a thermal pad on top of the second dielectric layer. The fabricating includes forming at least one plated through hole for electrically coupling the thermal pad to the at least one conductive layer. The fabricating includes backdrilling the at least one plated through hole to remove a portion of the conductive material, wherein subsequent to the backdrilling the conductive material remaining in the at least one plated through hole electrically couples one or more of the at least one conductive layer to the thermal pad.

Abstract translation: 一种方法包括制造印刷电路板。 该制造包括在第一介电层的顶部上形成至少一个导电层，其中至少一个导电层包括接地层和电源层中的至少一个。 该制造包括在至少一个导电层的顶部上形成第二电介质层。 该制造包括在第二介电层的顶部上形成热垫。 该制造包括形成至少一个电镀通孔，用于将热垫电耦合到至少一个导电层。 所述制造包括对所述至少一个电镀通孔进行后钻，以去除所述导电材料的一部分，其中在所述反向钻削之后，保留在所述至少一个电镀通孔中的所述导电材料将所述至少一个导电层中的一个或多个电耦合到 散热垫。

公开(公告)号：US20110279981A1

公开(公告)日：2011-11-17

申请号：US12818211

申请日：2010-06-18

Applicant: Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung

Inventor： Alex Horng ,  Chi-Hung Kuo ,  Chih-Hao Chung

IPC: H05K7/20

CPC classification number: H01L23/3677 ,  F21V29/673 ,  F21V29/677 ,  F21V29/773 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K3/0061 ,  H05K2201/09027 ,  H05K2201/09572 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A heat dissipating assembly includes a circuit board having opposite first and second faces. The circuit board further includes a through-hole extending from the first face through the second face. A heat generating element is mounted on the first face of the circuit board and electrically coupled to the circuit board. The heat generating element includes a heat conducting portion aligned with the through-hole. A heat dissipating unit includes a base having an engaging face in contact with the second face of the circuit board. A metal solder is filled in the through-hole. The metal solder is engaged with the engaging face of the base and the heat conducting portion of the heat generating element. The heat generating element is directly engaged with the heat dissipating unit by the metal solder to effectively enhance the overall heat dissipating efficiency while reducing the number of members to lower the manufacturing costs.

Abstract translation: 散热组件包括具有相对的第一和第二面的电路板。 电路板还包括从第一面延伸穿过第二面的通孔。 发电元件安装在电路板的第一面上并电耦合到电路板。 发热元件包括与通孔对准的导热部分。 散热单元包括具有与电路板的第二面接触的接合面的基座。 金属焊料填充在通孔中。 金属焊料与基座的接合面和发热元件的导热部分接合。 发热元件通过金属焊料直接与散热单元接合，从而有效地提高总的散热效率，同时减少构件的数量以降低制造成本。

公开(公告)号：US08026584B2

公开(公告)日：2011-09-27

申请号：US12251534

申请日：2008-10-15

Applicant: Hye-jin Kim

Inventor： Hye-jin Kim

IPC: H01L21/00

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/10666 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/32225 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package structure having a solder ball coupled to a chip pad and a manufacturing method thereof, a semiconductor package module, and a system. A circuit board includes a through hole therein, and a conductor is formed on a sidewall of the through hole. A first semiconductor chip including a first chip pad is mounted on the circuit board. A solder ball is disposed in the through hole and is bonded to the conductor and the first chip pad. Therefore, an underfill can be removed from a semiconductor package, and thus, the semiconductor package can be reduced in thickness.

Abstract translation: 一种具有耦合到芯片焊盘的焊球的半导体封装结构及其制造方法，半导体封装模块和系统。 电路板在其中包括通孔，并且导体形成在通孔的侧壁上。 包括第一芯片焊盘的第一半导体芯片安装在电路板上。 焊球设置在通孔中并且接合到导体和第一芯片焊盘。 因此，可以从半导体封装中去除底部填充物，因此可以减小半导体封装的厚度。

公开(公告)号：US07834462B2

公开(公告)日：2010-11-16

申请号：US11856652

申请日：2007-09-17

Applicant: Stephan Dobritz ,  Christoph Polaczyk ,  Roland Irsigler

Inventor： Stephan Dobritz ,  Christoph Polaczyk ,  Roland Irsigler

IPC: H01L23/48 ,  H01L23/02

CPC classification number: H05K3/3436 ,  H01L23/3128 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/112 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.

Abstract translation: 根据本发明的一个实施例，电气设备包括：顶表面和底表面; 从所述顶表面穿过所述装置延伸到所述底表面的接触孔; 导电密封元件，其在底表面处或附近密封接触孔; 导电连接，其连接到导电密封元件并且延伸穿过接触孔到达顶表面; 以及设置在导电性密封元件的底面上的焊料。

公开(公告)号：US07524024B2

公开(公告)日：2009-04-28

申请号：US11220766

申请日：2005-09-07

Applicant: Michiaki Murata

Inventor： Michiaki Murata

IPC: B41J2/14

CPC classification number: H05K1/115 ,  B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1646 ,  B41J2002/14241 ,  B41J2002/14491 ,  B41J2202/18 ,  B41J2202/20 ,  B41J2202/21 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/09827

Abstract: An electrical connection substrate includes a substrate main body in which an electrical connection through port is formed, and connection target members arranged on both sides of the substrate main body, respectively. The connection target members are electrically connected to each other through the electrical connection through port, and the electrical connection through port is filled with a fluidized conductive material. The fluidized conductive material thus filled can satisfactorily keep connection of the connection target members to each other through the electrical connection through port.

Abstract translation: 电连接基板包括其中形成有电连接通孔的基板主体和分别布置在基板主体两侧的连接对象部件。 连接目标构件通过电连接通孔彼此电连接，并且通过端口的电连接填充有流化的导电材料。 如此填充的流化的导电材料可以令人满意地通过端口连接到连接目标构件彼此之间。

公开(公告)号：US20090008128A1

公开(公告)日：2009-01-08

申请号：US12184119

申请日：2008-07-31

Applicant: Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

Inventor： Takehiko Hasebe ,  Takehide Yokozuka ,  Nobuyuki Ushifusa ,  Masahide Harada ,  Eiji Matsuzaki ,  Hiroshi Hozoji

IPC: H05K1/00

CPC classification number: H01L24/16 ,  H01L23/142 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29139 ,  H01L2224/2929 ,  H01L2224/32057 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/021 ,  H05K1/056 ,  H05K1/144 ,  H05K3/384 ,  H05K3/4608 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/10734 ,  H01L2924/05432 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.

Abstract translation: 本发明提供一种电子设备，其具有包括金属板的金属芯基板，形成在金属板上的绝缘层和形成在绝缘层上的导电层，以及电子部件，并且导电层和导体层的端子 电子部件连接。 在电子设备中，具有高导热性的部件被布置成与金属板和电子部件都接触。 因此，电子设备的散热性提高。

公开(公告)号：US20080170374A1

公开(公告)日：2008-07-17

申请号：US11910433

申请日：2006-04-03

Applicant: Christian Val

Inventor： Christian Val

IPC: H05K7/00

CPC classification number: H01L23/4985 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/09663 ,  H05K2203/041 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an electronic module (100) comprising a stack of n packages (10, 10a, 10b) of predetermined thickness E, which are provided on a lower surface with connection balls (12) of predetermined thickness eb, said connection balls being connected to a printed circuit (20, 20a, 20b) for interconnecting the package. The printed circuit is placed on the lower surface of the package level with the balls, is drilled with metallized holes (23), in which the balls (12) are located and to which they are connected, and has a thickness eci less than eb so as to obtain a module with a total thickness not exceeding n (E+10% eb).

Abstract translation: 本发明涉及一种电子模块（100），其包括具有预定厚度E的n个封装（10,10a，10b）的堆叠，其被设置在具有预定厚度E的连接球（12）的下表面上， b，所述连接球连接到印刷电路（20,20a，20b），用于互连所述封装。 印刷电路被放置在具有球的包装水平的下表面上，钻有金属孔（23），其中球（12）位于其中并且它们被连接，并且具有厚度e 以获得总厚度不超过n（E + 10％e B b）的模块。

公开(公告)号：US20070257355A1

公开(公告)日：2007-11-08

申请号：US11797458

申请日：2007-05-03

Applicant: Norihito Suzuki ,  Akihiro Minoura

Inventor： Norihito Suzuki ,  Akihiro Minoura

IPC: H01L23/04

CPC classification number: H05K3/3447 ,  H05K1/0201 ,  H05K1/116 ,  H05K3/3468 ,  H05K2201/09572 ,  H05K2201/09636 ,  H05K2201/09781 ,  H05K2203/045

Abstract: In the vicinity of soldering through holes of lands for soldering a lead terminal in a multilayer printed board, electrically isolated lands are provided to form a thermal through hole. In the soldering, by the radiation and supply of heat of a lead-free solder filled in the thermal through hole, it is possible to suppress the radiation of heat of the soldering through hole. Thus, it is possible to achieve a sufficient solder rise and to obtain an excellent soldering property.

Abstract translation: 在用于焊接多层印刷电路板中的引线端子的焊盘通孔附近，设置电隔离焊盘以形成热通孔。 在焊接中，通过填充在热通孔中的无铅焊料的放射和供热，可以抑制焊接通孔的热辐射。 因此，可以实现足够的焊料上升并获得优异的焊接性能。