中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

402 records (took 0.013 seconds)

    Thermal stress resistant semiconductor device mounting arrangement
    141.
    发明授权
    Thermal stress resistant semiconductor device mounting arrangement 失效
    耐热应力半导体器件安装布置

    公开(公告)号：US5374848A

    公开(公告)日：1994-12-20

    申请号：US872032

    申请日：1992-04-23

    Applicant: Hiroshi Otani ,  Yoshiharu Takahashi ,  Yasuhiro Murasawa ,  Tadashi Ichimasa

    Inventor： Hiroshi Otani ,  Yoshiharu Takahashi ,  Yasuhiro Murasawa ,  Tadashi Ichimasa

    IPC: H01L23/12 ,  H05K1/18 ,  H05K3/34 ,  H01L23/02

    CPC classification number: H05K1/181 ,  H05K2201/097 ,  H05K2201/10522 ,  H05K2201/10689 ,  H05K2203/1572 ,  Y02P70/611

    Abstract: Cracks in solder connecting terminal leads of an IC to a circuit board are prevented by reducing the stress due to the difference in the coefficients of thermal expansion of a pair of IC packages mounted on opposite surfaces of a circuit board and the circuit board. In this invention, the position of an IC package mounted on the upper surface of a circuit board is spaced from the position of an IC package mounted on the lower surface of the circuit board. Alternatively, the IC packages are mounted on the upper and lower surfaces in directions which are substantially orthogonal. Alternatively, the IC packages are mounted such that the positions of lead portions of one of the upper IC packages are spaced from the positions of the lead portions of the other IC package by a distance which is at least 2.4 times the thickness of the circuit board.

    Abstract translation: 通过减少由于安装在电路板和电路板的相对表面上的一对IC封装的热膨胀系数的差异而导致的应力的降低，可以防止IC将电路板的引线焊接到电路板上。 在本发明中，安装在电路板的上表面上的IC封装的位置与安装在电路板的下表面上的IC封装的位置隔开。 或者，IC封装以基本正交的方向安装在上表面和下表面上。 或者，安装IC封装，使得上IC封装之一的引线部分的位置与另一IC封装的引线部分的位置间隔至少为电路板厚度的2.4倍 。

    Method and apparatus for screen printing
    142.
    发明授权
    Method and apparatus for screen printing 失效
    丝网印刷方法和装置

    公开(公告)号：US4953460A

    公开(公告)日：1990-09-04

    申请号：US415805

    申请日：1989-10-02

    Applicant: Thaddeus Wojcik

    Inventor： Thaddeus Wojcik

    IPC: B41C1/14 ,  B41M1/12 ,  H05K3/12 ,  H05K3/34

    CPC classification number: H05K3/3484 ,  B41C1/14 ,  B41M1/12 ,  H05K3/1225 ,  H05K2201/097 ,  H05K2203/0545 ,  H05K3/3421 ,  Y10T29/49124 ,  Y10T29/49144

    Abstract: An improved stencil (10), for screen printing a material (22) onto a substrate (20), comprises a sheet (12) provided with a plurality of trapezoidal openings (14) arranged in alternating fashion such that the taper of each opening is opposite to the taper of the opening adjacent thereto. Providing the stencil with alternating trapezoidal openings (14) improves the resolution of the pattern of material (22) printed on the substrate when the material is deposited on the stencil and a squeegee blade (24) is displaced thereacross to force the material into the openings (14). The quality of the pattern of the material (22) printed on the substrate (20) can be further improved by providing a friction-reducing coating (34) on the sheet (12) to reduce the drag of the squeegee blade (24) as it travels thereacross.

    Abstract translation: 用于将材料（22）丝网印刷到基材（20）上的改进的模板（10）包括设置有交替方式布置的多个梯形开口（14）的片材（12），使得每个开口的锥形为 与与其相邻的开口的锥度相反。 提供具有交替梯形开口（14）的模板改善了当材料沉积在模板上时打印在基板上的材料（22）图案的分辨率，并且刮刀（24）在其上移动以迫使材料进入开口 （14）。 印刷在基材（20）上的材料（22）的图案的质量可以通过在片材（12）上设置减摩擦涂层（34）来进一步改善，以减少刮刀（24）的阻力，如 它在那里传播。

    Printed board
    143.
    发明授权
    Printed board 失效
    印刷板

    公开(公告)号：US4772762A

    公开(公告)日：1988-09-20

    申请号：US939815

    申请日：1986-12-09

    Applicant: Masahiro Fukino

    Inventor： Masahiro Fukino

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

    CPC classification number: H05K1/111 ,  H05K3/3421 ,  H05K2201/09381 ,  H05K2201/097 ,  H05K2201/09772 ,  H05K2201/10689 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A printed board capable of permitting the passage of at least two wiring patterns between two adjacent mounting lands on the surface of the printed board even if a clearance between the adjacent mounting lands is limited. Mounted on the printed board is an electrical component having a plurality of leads extending in a parallel relation with each other with limited clearances formed between adjacent leads. The printed board has a plurality of mounting lands to which the respective leads of the electrical component are secured as by soldering, there being a limited clearance defined between adjacent ones of the lands such that only one wiring pattern printed on the printed board can run through the clearance in the direction parallel to that in which the leads extend. The adjacent two lands have two facing parallel sides which are disposed in parallel with each other at an angle relative to the direction in which the leads extend, so that at least two wiring patterns, printed on the surface of the printed board, can run through the clearance between the facing sides of the adjacent lands in a parallel relation therewith.

    Abstract translation: 即使相邻的安装台面之间的间隙受到限制，印刷电路板能够允许在印刷电路板的表面上的两个相邻的安装焊盘之间通过至少两个布线图案。 安装在印刷电路板上的是具有彼此平行关系延伸的多个引线的电气部件，并且在相邻导线之间形成有限的间隙。 印刷电路板具有多个安装平台，通过焊接固定电气部件的各个引线，在相邻的焊盘之间限定间隙，使印刷在印刷电路板上的仅一个布线图案可以穿过 在与引线延伸的方向平行的方向上的间隙。 相邻的两个平台具有相对于引线延伸的方向成一角度彼此平行设置的两个相对的平行侧，使得印刷在印刷电路板表面上的至少两个布线图案可以穿过 相邻焊盘的​​相对侧之间的间隙与其平行关系。

    Flat coil transformer for electronic circuit boards
    144.
    发明授权
    Flat coil transformer for electronic circuit boards 失效
    电子线路板用扁平线圈变压器

    公开(公告)号：US4080585A

    公开(公告)日：1978-03-21

    申请号：US786332

    申请日：1977-04-11

    Applicant: Edward Henry Molthen

    Inventor： Edward Henry Molthen

    IPC: H01F27/28 ,  H05K1/16 ,  H01F5/00

    CPC classification number: H05K1/165 ,  H01F27/2804 ,  H01F2017/004 ,  H05K2201/097

    Abstract: A flat coil transformer on an electronic circuit board. The primary winding consists of a first helical conductive pattern formed by alternately spaced straps of a first series of conductive straps on one surface of the circuit board, alternately spaced straps of a second series of straps on the opposite surface of the circuit board, and alternately spaced holes of first and second generally parallel series of conductive coated holes extending through the board and connecting together the alternately spaced straps of the first and second series of straps. The secondary winding consists of a second helical conductive pattern formed by the remaining alternately spaced straps of the first series of straps, the remaining alternately spaced straps of the second series of straps, and the remaining alternately spaced holes of the first and second series of holes connecting together the remaining alternately spaced straps of the first and second series of straps. The first and second helical patterns each have a longitudinal axis that is generally parallel to the first and second series of holes; and the holes in the first helical pattern are staggered laterally in relation to the holes in the second helical pattern.

    Abstract translation: 电子电路板上的扁平线圈变压器。 初级绕组由在电路板的一个表面上由第一系列导电带的交替间隔的带形成的第一螺旋导电图案组成，在电路板的相对表面上交替地间隔着第二系列带的条带， 第一和第二大致平行的一系列导电涂覆的孔的间隔开的孔延伸穿过板并将第一和第二系带的交替间隔的带连接在一起。 次级绕组包括由第一系列带的剩余交替间隔的带形成的第二螺旋导电图案，第二系列带的剩余的交替间隔的带，以及第一和第二系列孔的剩余交替间隔开的孔 将第一和第二系列带的剩余交替间隔的带连接在一起。 第一和第二螺旋图案各自具有大致平行于第一和第二系列孔的纵向轴线; 并且第一螺旋图案中的孔相对于第二螺旋图案中的孔横向交错。

    Electronic circuit board flat coil inductor
    145.
    发明授权
    Electronic circuit board flat coil inductor 失效
    电子电路板扁平线圈电感

    公开(公告)号：US3992691A

    公开(公告)日：1976-11-16

    申请号：US592389

    申请日：1975-07-02

    Applicant: Edward H. Molthen

    Inventor： Edward H. Molthen

    IPC: H01F17/00 ,  H01F27/28 ,  H05K1/16 ,  H01F5/00

    CPC classification number: H01F27/2804 ,  H01F17/0033 ,  H05K1/165 ,  H01F2017/004 ,  H05K2201/097

    Abstract: An inductor is developed on an electronic circuit board by forming plural parallel series of holes and plating a conductor pattern on both sides of the board in association with the holes. The holes are plated through with conductive material and are electrically connected by connective segments from the conductive pattern in the form of elongated straps. Each strap extends between a hole in a first series of holes to a hole in the second series of holes. The straps are arranged to produce a conductive pattern in a flattened generally helical form. The holes are drilled oversized so that, after plating, the remaining opening corresponds to a standard lead diameter. Connections may be made between a selected number of turns of the coil by inserting the leads of a circuit component in holes corresponding to the proper number of turns. The holes may be alternately staggered in relation to the control axis of the coil to maximize the number of turns in the coil for a given surface area of electronic circuit board.

    Abstract translation: 电感器通过形成多个平行的孔并且与孔相关联地在电路板的两侧上镀覆导体图案而在电子电路板上显影。 这些孔通过导电材料电镀，并且通过连接段以细长带形式从导电图案电连接。 每个条带在第一系列孔中的孔与第二系列孔中的孔之间延伸。 带子被布置成以扁平的大致螺旋形式产生导电图案。 钻孔过大，使得在电镀后，剩余的开口对应于标准的引线直径。 可以通过将电路元件的引线插入对应于适当匝数的孔中，在线圈的选定匝数之间进行连接。 这些孔可以相对于线圈的控制轴线交替地交错排列，以使电子电路板的给定表面积的线圈中的匝数最大化。

Patent Agency Ranking