公开(公告)号：US20050074578A1

公开(公告)日：2005-04-07

申请号：US10648322

申请日：2003-08-27

Applicant: Miho Yamaguchi ,  Yuji Hotta

Inventor： Miho Yamaguchi ,  Yuji Hotta

IPC: C09J7/00 ,  C09J7/02 ,  H01L21/56 ,  H01L21/60 ,  H01L23/14 ,  H01L23/31 ,  H01R4/04 ,  B32B3/10

CPC classification number: H01R4/04 ,  C09J7/10 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/602 ,  C09J2203/326 ,  H01L21/563 ,  H01L23/145 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/27438 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/249953 ,  Y10T428/249982 ,  Y10T428/249983 ,  Y10T428/249984 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00

Abstract: A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.

Abstract translation: 一种多孔粘合片1，其具有在粘合有机膜3的厚度方向A上彼此平行的多个通孔2，其中通孔具有从一个开口2a到另一个开口2b的直径方向上的大致相等的部分 及其制造方法以及具有多孔粘合片31的半导体晶片，其包括具有电极33的半导体晶片32，粘附到半导体晶片的多孔粘合片1和通过填充通孔形成的导电部34 2，其具有导电材料的电极33及其制造方法。

公开(公告)号：US20040241417A1

公开(公告)日：2004-12-02

申请号：US10449679

申请日：2003-05-30

Inventor： Patrick J. Fischer ,  James J. Kobe ,  Cameron T. Murray

IPC: B32B007/12

CPC classification number: B32B5/18 ,  B32B5/20 ,  B32B7/06 ,  B32B27/205 ,  B32B2037/1215 ,  B32B2038/0028 ,  B32B2307/3065 ,  B32B2310/08 ,  C09J5/08 ,  C09J7/10 ,  C09J7/22 ,  C09J7/38 ,  C09J11/04 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2201/618 ,  C09J2421/00 ,  C09J2423/00 ,  C09J2433/00 ,  C09J2453/00 ,  F28F2013/006 ,  H01L2924/0002 ,  Y10T428/249983 ,  Y10T428/249986 ,  Y10T428/249987 ,  Y10T428/249991 ,  Y10T428/249992 ,  Y10T428/28 ,  Y10T428/2891 ,  H01L2924/00

Abstract: In one aspect, the invention provides a foam thermal interface material comprising a foamed film, the film comprising a blend of polymeric hot melt pressure sensitive adhesive having a number average molecular weight of greater than 25,000 and at least 25 percent by weight of thermally conductive filler, said film having a void volume of at least 5 percent of the volume of said foamed film.

Abstract translation: 在一个方面，本发明提供一种泡沫热界面材料，其包括泡沫膜，所述膜包含数均分子量大于25,000和至少25重量％的导热填料的聚合物热熔压敏粘合剂的共混物 所述膜具有至少占所述泡沫膜体积的5％的空隙体积。

公开(公告)号：US20040094264A1

公开(公告)日：2004-05-20

申请号：US10250709

申请日：2003-07-08

Inventor： Hiroaki Yamaguchi ,  Tetsu Kitamura

IPC: B32B031/00

CPC classification number: H01L24/27 ,  B32B7/12 ,  C08J5/128 ,  C08L63/00 ,  C09J5/00 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/602 ,  C09J2463/00 ,  H01L24/28 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/7565 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0129 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The present invention provides a method of connecting substrates using light activatable film while preventing the deterioration of the substrate in the process. The present invention also provides a method for connecting circuits which includes irradiating a light activatable adhesive film, contacting the first surface of the activated anisotropically conductive adhesive film with the circuit on a first substrate, contacting the circuit on a second substrate with the second surface of said activated anisotropically conductive adhesive film, and compression bonding these substrates.

Abstract translation: 本发明提供一种使用可光活化膜连接基板的方法，同时防止在该过程中基板的劣化。 本发明还提供了一种用于连接电路的方法，其包括照射可光活化的粘合剂膜，使活化的各向异性导电粘合剂膜的第一表面与第一基底上的电路接触，将第二基底上的电路与第二基底 所述活化的各向异性导电粘合剂膜，并且压缩这些基材。

公开(公告)号：US20030051807A1

公开(公告)日：2003-03-20

申请号：US10239375

申请日：2002-09-19

Inventor： Hiroaki Yamaguchi ,  Yuji Hiroshige ,  Michiru Hata ,  Tetsu Kitamura

IPC: B32B031/00 ,  B32B031/26

CPC classification number: H01B1/24 ,  C08G59/226 ,  C08G59/24 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/602 ,  C09J2463/00 ,  H01B1/22 ,  H05K3/323

Abstract: To provide an anisotropically conductive adhesive composition that can be rapidly cured at a low temperature during thermocompression bonding and has a sufficiently long working life, while also exhibiting excellent mutual connection stability after connection between substrates. The anisotropically conductive adhesive composition comprises an epoxy resin comprising a cycloaliphatic epoxy resin and a glycidyl group-containing epoxy resin, an ultraviolet activatable cationic polymerization catalyst and a cationic polymerization retarder, and conductive particles.

Abstract translation: 提供可以在热压接期间在低温下快速固化并具有足够长的工作寿命的各向异性导电粘合剂组合物，同时在基材连接之后也表现出优异的相互连接稳定性。 各向异性导电性粘合剂组合物包含环氧树脂，其包含环脂族环氧树脂和含缩水甘油基的环氧树脂，可紫外线活化的阳离子聚合催化剂和阳离子聚合缓凝剂，以及导电颗粒。

公开(公告)号：US20020111423A1

公开(公告)日：2002-08-15

申请号：US10068878

申请日：2002-02-11

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

Inventor： Kyung wook Paik ,  Myung jin Yim ,  Woon seong Kwon

IPC: H01L021/44 ,  H01L021/48

CPC classification number: H01L24/83 ,  C08L63/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  C09J2463/00 ,  H01L24/28 ,  H01L2224/2919 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H05K3/323 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/10674 ,  H05K2203/0783 ,  H01L2924/00

Abstract: Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.

Abstract translation: 公开了适用于射频封装应用的低介电常数导电粘合剂的制造方法。 该方法的特征在于将热固性树脂与表面处理的导电颗粒和非导电颗粒混合以防止凝集，从而形成导电粘合剂。 所制造的导电粘合剂可用于射频包装的接合材料。 根据本发明，与传统的倒装芯片接合技术相比，可以获得具有优异的机械和电气性能的倒装芯片接合。 此外，由于粘合剂具有低的高频损耗和低介电常数，所以可以实现具有优异的电性能的倒装芯片封装。 导电粘合剂对于具有微波和毫米波带宽的器件的倒装芯片封装特别有用。

公开(公告)号：US06344156B1

公开(公告)日：2002-02-05

申请号：US09460389

申请日：1999-12-13

Applicant: Yukio Yamada ,  Mikio Sakairi ,  Yasushi Akutsu ,  Tomoyuki Ishimatsu

Inventor： Yukio Yamada ,  Mikio Sakairi ,  Yasushi Akutsu ,  Tomoyuki Ishimatsu

IPC: H01B122

CPC classification number: H01L24/83 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/602 ,  H01B1/22 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/2919 ,  H01L2224/29399 ,  H01L2224/73204 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2203/0307 ,  Y10T428/2991 ,  Y10T428/2998 ,  H01L2924/00

Abstract: An anisotropic conductive adhesive film capable of maintaining a high connection reliability on connection electrodes with a fine pitch on which an oxide film is formed. The anisotropic conductive adhesive film 1 comprises conductive particles 7 dispersed in an insulating binder 6. Each conductive particle 7 consists of a styrene resin particle 71 and a thin metal film 72 formed on the surface thereof by gold-plating, etc. Projections 72a are formed on the surface of the thin metal film 72 of the conductive particle 7.

Abstract translation: 一种各向异性导电粘合膜，其能够在形成有氧化膜的细间距的连接电极上保持高的连接可靠性。各向异性导电粘合膜1包括分散在绝缘粘合剂6中的导电粒子7.每个导电粒子7由 通过镀金等形成在其表面上的苯乙烯树脂颗粒71和薄金属膜72.在导电颗粒7的薄金属膜72的表面上形成有突起72a。

公开(公告)号：US5939190A

公开(公告)日：1999-08-17

申请号：US946551

申请日：1997-10-07

Applicant: Ronald Pfaff ,  Claus Meyer

Inventor： Ronald Pfaff ,  Claus Meyer

IPC: C09J7/02 ,  C09J7/04 ,  C09J9/02 ,  C09J133/06 ,  D04H13/00 ,  H01B1/22 ,  B32B7/12

CPC classification number: C09J7/04 ,  C09J7/0296 ,  C09J9/02 ,  C09J2201/602 ,  C09J2400/163 ,  C09J2400/263 ,  Y10T428/2804 ,  Y10T428/2848 ,  Y10T442/2418 ,  Y10T442/2754 ,  Y10T442/655 ,  Y10T442/657 ,  Y10T442/681

Abstract: The use of a spunbonded nonwoven as backing material for an electrically conductive transfer tape, where the nonwoven is metallized by the application of at least one layer of metal, the nonwoven is provided on both sides with an adhesive coating, the mean thickness of the nonwoven being at least as great as the sum of the two thicknesses of the adhesive coats.

Abstract translation: 使用纺粘非织造材料作为导电转移带的背衬材料，其中非织造材料通过施加至少一层金属被金属化，非织造材料在两侧上设置有粘合剂涂层，非织造材料的平均厚度 至少与粘合剂涂层的两个厚度的总和一样大。

公开(公告)号：US20180273809A1

公开(公告)日：2018-09-27

申请号：US15854935

申请日：2017-12-27

Applicant: ASIA ELECTRONIC MATERIAL CO., LTD.

Inventor： Chih-Ming Lin ,  Chien-Hui Lee

IPC: C09J7/38 ,  H01B1/02 ,  C25D5/12 ,  C25D3/02 ,  C09J7/28 ,  C09J9/02 ,  C09J7/40

CPC classification number: C09J7/385 ,  C08K3/08 ,  C08K7/00 ,  C08K2201/001 ,  C09J7/28 ,  C09J7/29 ,  C09J7/30 ,  C09J7/401 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2400/163 ,  C09J2400/263 ,  C09J2433/00 ,  C09J2467/005 ,  C25D3/02 ,  C25D5/12 ,  H01B1/026 ,  H01B1/22

Abstract: The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 40 to 60 μm. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.

公开(公告)号：US10040979B2

公开(公告)日：2018-08-07

申请号：US14911451

申请日：2014-09-10

Applicant: Dexerials Corporation

Inventor： Junichiro Sugita

IPC: C09J7/20 ,  C09J133/08 ,  C09J133/06 ,  C09J9/00 ,  C09J11/04 ,  C09J11/06 ,  C08K3/20 ,  C08K3/08 ,  C08K3/04 ,  H01L23/373 ,  C09J7/38 ,  C09J7/24 ,  C08K3/32 ,  C08K5/3492

CPC classification number: C09J133/08 ,  C08K3/041 ,  C08K3/08 ,  C08K3/20 ,  C08K5/34924 ,  C08K2003/328 ,  C09J7/241 ,  C09J7/245 ,  C09J7/385 ,  C09J9/00 ,  C09J11/04 ,  C09J11/06 ,  C09J133/06 ,  C09J2201/122 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/106 ,  C09J2400/10 ,  C09J2400/20 ,  C09J2413/006 ,  C09J2433/00 ,  H01L23/3737 ,  H01L2924/0002 ,  C08F2220/1858 ,  C08F2222/1013 ,  H01L2924/00

Abstract: A thermally conductive sheet having an adhesive layer and a non-adhesive layer laminated together. The adhesive layer contains an acrylic resin formed from an acrylic compound and a thermally conductive filler, and has a tack property higher than a tack property of the non-adhesive layer. The non-adhesive layer is formed from a resin having a glass transition temperature of 10° C. or more and at least one functional group selected from a hydroxy, a carboxyl and a glycidyl, a curing agent and a flame retardant filler. The tack property of the non-adhesive layer is from 6 to 30 kN/m2 measured by pressing and then peeling an aluminum cylindrical probe from the non-adhesive layer with a pressing speed of 30 mm/min, peeling speed of 120 mm/min, load of 196 g, pressing time of 5.0 sec, pulling distance of 5 mm, probe heating of 40° C. and sheet stage heating of 40° C.

公开(公告)号：US20180218994A1

公开(公告)日：2018-08-02

申请号：US15926210

申请日：2018-03-20

Applicant: DEXERIALS CORPORATION

Inventor： Kouichi SATO ,  Yasushi AKUTSU

IPC: H01L23/00 ,  B29C59/02 ,  G02F1/1345 ,  C09J9/02 ,  C09J7/00 ,  B32B33/00 ,  B32B27/38 ,  B32B27/36 ,  B32B27/30 ,  B32B27/20 ,  B32B27/08 ,  B32B7/12 ,  B32B3/30 ,  B32B3/08 ,  B29C71/04 ,  C08K3/08 ,  B29L31/34 ,  B29L9/00 ,  B29C35/08

CPC classification number: H01L24/28 ,  B29C59/02 ,  B29C71/04 ,  B29C2035/0827 ,  B29C2059/028 ,  B29K2063/00 ,  B29L2009/003 ,  B29L2031/34 ,  B32B3/08 ,  B32B3/30 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B27/308 ,  B32B27/36 ,  B32B27/38 ,  B32B33/00 ,  B32B2255/205 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2307/706 ,  B32B2457/00 ,  B32B2457/202 ,  C08K3/08 ,  C08K2201/001 ,  C09J7/00 ,  C09J7/10 ,  C09J9/02 ,  C09J2201/36 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2205/102 ,  G02F1/13452 ,  G02F1/13454 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/2712 ,  H01L2224/27334 ,  H01L2224/29076 ,  H01L2224/2908 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2224/29195 ,  H01L2224/2929 ,  H01L2224/29311 ,  H01L2224/29316 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29371 ,  H01L2224/29387 ,  H01L2224/29388 ,  H01L2224/2939 ,  H01L2224/29391 ,  H01L2224/29393 ,  H01L2224/29394 ,  H01L2224/29395 ,  H01L2224/294 ,  H01L2224/29486 ,  H01L2224/29494 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75301 ,  H01L2224/81488 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83488 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2224/83862 ,  H01L2224/83871 ,  H01L2224/83874 ,  H01L2224/83885 ,  H01L2224/83907 ,  H01L2924/01006 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0549 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/381 ,  Y10T156/1039 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/0635 ,  H01L2924/069 ,  H01L2924/07025 ,  H01L2924/066 ,  H01L2924/06 ,  H01L2924/00014 ,  H01L2924/0615

Abstract: To reduce substrate warp occurring after connection an anisotropic conductive film is used. An anisotropic conductive film has: a first insulating adhesive layer; a second insulating adhesive layer; and a conductive particle-containing layer sandwiched by the first insulating adhesive layer and the second insulating adhesive layer and having conductive particles contained in an insulating adhesive, wherein air bubbles are contained between the conductive particle-containing layer and the first insulating adhesive layer, and, the conductive particle-containing layer, a portion thereof below the conductive particles and in contact with the second insulating adhesive layer has a lower degree of cure than other portions thereof.