公开(公告)号：US20080189943A1

公开(公告)日：2008-08-14

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K3/42 ,  H01L21/306

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20080173473A1

公开(公告)日：2008-07-24

申请号：US11875486

申请日：2007-10-19

Applicant: Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro HIROSE ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01R12/04

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口部20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US07307022B2

公开(公告)日：2007-12-11

申请号：US11327493

申请日：2006-01-09

Applicant: Frank D. Egitto ,  Stephen Krasniak ,  John M. Lauffer ,  Voya R. Markovich ,  Luis J. Matienzo

Inventor： Frank D. Egitto ,  Stephen Krasniak ,  John M. Lauffer ,  Voya R. Markovich ,  Luis J. Matienzo

IPC: H01L21/44 ,  C25D5/02

CPC classification number: H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

Abstract: A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.

Abstract translation: 一种处理导电层以确保该层对用于形成电路化基底的所选电介质层的附着力的方法。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。 该方法可扩展到形成这种衬底，包括形成具有许多导电和电介质层的多层衬底。 这样的基板可以包括安装在其上的一个或多个电气部件（例如，半导体芯片），并且也可以将它们本身安装到其它基板上。

公开(公告)号：US07293356B2

公开(公告)日：2007-11-13

申请号：US11325557

申请日：2006-01-03

Applicant: Seung Hyun Sohn ,  Yul Kyo Chung ,  Hyun Ju Jin ,  Eun Tae Park

Inventor： Seung Hyun Sohn ,  Yul Kyo Chung ,  Hyun Ju Jin ,  Eun Tae Park

IPC: H01K3/10

CPC classification number: H05K1/162 ,  H05K3/025 ,  H05K3/381 ,  H05K3/429 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4661 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/09309 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention relates to a method of fabricating a printed circuit board having embedded multi-layer passive devices, and particularly, to a method of fabricating a printed circuit board having an embedded multi-layer capacitor, in which a capacitor is formed to have multiple layers in the PCB to increase capacitance.

Abstract translation: 本发明涉及一种制造具有嵌入式多层无源器件的印刷电路板的方法，特别涉及一种制造具有嵌入式多层电容器的印刷电路板的方法，其中形成电容器以具有多个 PCB中的层增加电容。

公开(公告)号：US07230187B2

公开(公告)日：2007-06-12

申请号：US10743527

申请日：2003-12-22

Applicant: Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

Inventor： Liangfeng Xu ,  Tommi Reinikainen ,  Arni Kujala ,  Wei Ren ,  Ian Niemi ,  Ilkka Kartio

IPC: H05K1/03

CPC classification number: H05K1/0265 ,  H05K3/4641 ,  H05K2201/0352 ,  H05K2201/0358

Abstract: A multi-layer printed wire board (PWB) structure optimized for improved drop reliability, reliable electrical connections under thermal load, and minimal thickness is provided, along with a mobile terminal, including the PWB. The PWB includes alternating conductive layers and insulative layers. The outermost three layers form an interconnect structure constructed of two conductive layers surrounding an insulative-coated conductive layer. The thicknesses of the various layers are optimized to have an increased resistance to mechanical shock resulting from, for instance, a drop onto a hard surface. In addition, the optimized PWB structure has a minimized thickness and an improved resistance to connection failures resulting from cyclical thermal loads.

Abstract translation: 提供了一种多层印刷线路板（PWB）结构以及包括PWB在内的移动终端，优化了降低可靠性，热负载下的可靠电气连接和最小厚度。 PWB包括交替的导电层和绝缘层。 最外面的三层形成由围绕绝缘涂覆的导电层的两个导电层构成的互连结构。 各层的厚度被优化以具有增加的抗机械冲击的抵抗力，例如由硬质表面上的液滴引起的机械冲击。 此外，优化的PWB结构具有最小化的厚度和改善的耐循环热负载引起的连接故障。

公开(公告)号：US20050170077A1

公开(公告)日：2005-08-04

申请号：US11090685

申请日：2005-03-25

Applicant: Joseph Montano ,  James Shelnut

Inventor： Joseph Montano ,  James Shelnut

IPC: B05D7/14 ,  C08L63/00 ,  C09J5/02 ,  C23C22/52 ,  C23C22/83 ,  C23F1/18 ,  H05K3/38 ,  H05K3/46 ,  B05D3/00

CPC classification number: B05D7/14 ,  B05D7/148 ,  C08L63/00 ,  C09J5/02 ,  C09J2400/163 ,  C09J2463/00 ,  C23C22/52 ,  C23C22/83 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A primer composed of a polymer solution is applied to a roughened metal surface, and a polymer material such as a pre-preg is applied to the treated metal surface to form a bond between the metal and the polymer material.

Abstract translation: 将由聚合物溶液组成的底漆施加到粗糙化的金属表面上，并且将预聚物等聚合物材料施加到经处理的金属表面上以在金属和聚合物材料之间形成结合。

公开(公告)号：US06902949B2

公开(公告)日：2005-06-07

申请号：US10109680

申请日：2002-04-01

Applicant: Hiroshi Yamazaki ,  Mineyoshi Hasegawa ,  Satoshi Tanigawa

Inventor： Hiroshi Yamazaki ,  Mineyoshi Hasegawa ,  Satoshi Tanigawa

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H01L21/44

CPC classification number: H05K3/4691 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/002 ,  H05K3/281 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H01L2924/00

Abstract: First and second metal foil layers are laminated on opposite surfaces of a first insulating layer to form a first board. Then, the first and second metal foil layers are formed into predetermined conductor patterns respectively. Then, second and third insulating layers of second and third boards formed separately from the first board are laminated on the first and second metal foil layers through first and second adhesive layers respectively. Then, a thin layer portion is removed and thick layer portions are formed into predetermined conductor patterns respectively in third and fourth metal foil layers of the second and third boards.

Abstract translation: 第一和第二金属箔层层叠在第一绝缘层的相对表面上以形成第一板。 然后，第一和第二金属箔层分别形成预定的导体图案。 然后，分别与第一基板形成的第二和第三板的第二绝缘层和第三绝缘层分别通过第一和第二粘合剂层层压在第一和第二金属箔层上。 然后，去除薄层部分，并且将厚层部分分别形成为第二和第三板的第三和第四金属箔层中的预定导体图案。

公开(公告)号：US20040161545A1

公开(公告)日：2004-08-19

申请号：US10620893

申请日：2003-07-16

Applicant: Shipley Company, L.L.C.

Inventor： Joseph R. Montano ,  James G. Shelnut

IPC: B05D001/36 ,  B05D007/00

CPC classification number: B05D7/14 ,  B05D7/148 ,  C08L63/00 ,  C09J5/02 ,  C09J2400/163 ,  C09J2463/00 ,  C23C22/52 ,  C23C22/83 ,  C23F1/18 ,  H05K3/383 ,  H05K3/385 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K2203/124

Abstract: A primer composed of a polymer solution is applied to a roughened metal surface, and a polymer material such as a pre-preg is applied to the treated metal surface to form a bond between the metal and the polymer material.

Abstract translation: 将由聚合物溶液构成的底漆施加到粗糙化的金属表面上，并且将诸如预浸渍物之类的聚合物材料施加到经处理的金属表面以在金属和聚合物材料之间形成结合。

公开(公告)号：US06716530B2

公开(公告)日：2004-04-06

申请号：US09996802

申请日：2001-11-30

Applicant: Tetsuro Sato ,  Tsutomu Asai

Inventor： Tetsuro Sato ,  Tsutomu Asai

IPC: B32B2738

CPC classification number: H05K3/4655 ,  C08G59/4042 ,  C08L63/00 ,  H05K3/4652 ,  H05K2201/0358 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/16

Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound further has composition which is free of halogen elements.

Abstract translation: 本发明提供一种不含卤素元素，具有高阻燃性，优异的耐水性，耐热性以及基材和铜箔之间良好剥离强度的树脂涂布铜箔。 为了提供用于制造印刷电路板的层间电介质的树脂化合物，树脂化合物包括环氧树脂，其包括：具有5至25重量％的氮的环氧树脂固化剂; 和具有热固性的马来酰亚胺化合物，并且该树脂化合物还具有不含卤素元素的组成。

公开(公告)号：US20020185221A1

公开(公告)日：2002-12-12

申请号：US10155559

申请日：2002-05-24

Applicant: Sumitomo Bakelite Company Limited

Inventor： Takahisa Iida

IPC: B65C009/25

CPC classification number: B32B15/14 ,  B32B7/14 ,  B32B15/04 ,  B32B15/20 ,  B32B27/08 ,  B32B37/203 ,  B32B38/0036 ,  B32B2038/0076 ,  B32B2305/076 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2398/10 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0129 ,  H05K2201/0358 ,  H05K2203/1545

Abstract: A method for manufacturing a laminated board having high quality with high productivity is disclosed. In this manufacturing method, a prepreg 2 that has been supplied from a prepreg supply section 1 is fed vertically using feed rolls. Further, metal foils 4 are supplied from a metal foil supply section 3 using feed rolls. The prepreg 2 and the metal foil 4 are heated at a heating section 7, and then they pass through between the rolls 5 so that the metal foils are bonded to the prepreg. Thus obtained laminated board is fed to a rolling section 6 using feed rolls, and the laminated is continuously rolled up at the rolling section 6, thereby continuously manufacturing the laminated board.

Abstract translation: 公开了一种生产高品质的层压板的制造方法。 在该制造方法中，从预浸料供给部1供给的预浸料坯2使用进给辊进行垂直供给。 此外，使用进给辊从金属箔供给部3供给金属箔4。 预浸料坯2和金属箔4在加热部7被加热，然后通过辊5之间通过，使得金属箔与预浸料坯接合。 将这样得到的层叠基板通过进给辊供给到轧制部6，在轧制部6上连续卷起层压体，从而连续地制造层压板。