公开(公告)号：US20050212439A1

公开(公告)日：2005-09-29

申请号：US11087724

申请日：2005-03-24

Applicant: Thomas Zampini ,  Thomas Zampini ,  Mark Zampini

Inventor： Thomas Zampini ,  Thomas Zampini ,  Mark Zampini

IPC: F21K99/00 ,  G09G3/32 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/021 ,  F21K9/00 ,  F21V29/80 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09018 ,  H05K2201/10106

Abstract: A flex circuit, rigid-flex circuit at least one high brightness light emitting diode (HBLED) or multiple high brightness light emitting diodes which can be connected either in series or in parallel within the circuit and are soldered to the circuit. The circuit includes one or multiple through hole cut-outs for the LED slug to sit through and attach to a heat sink substrate beneath the LEDs.

Abstract translation: 柔性电路，刚柔柔性电路至少一个高亮度发光二极管（HBLED）或多个高亮度发光二极管，可以在电路内串联或并联连接并焊接到电路。 该电路包括一个或多个通孔切口，用于LED芯片穿过并连接到LED下方的散热基板。

公开(公告)号：US06905911B2

公开(公告)日：2005-06-14

申请号：US10614525

申请日：2003-07-08

Applicant: Tsuneo Hamaguchi ,  Kenji Kagata

Inventor： Tsuneo Hamaguchi ,  Kenji Kagata

IPC: H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H01L27/146 ,  H05K3/34 ,  H01L21/58

CPC classification number: H05K3/3436 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14609 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/09018 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.

Abstract translation: 半导体器件包括形成在布线基板的一个表面上以具有规定高度的突出电极，厚度小于突出电极的高度的半导体芯片，以及厚度大于半导体的厚度的电子部件 并且安装在布线基板的另一个表面上，使得布线基板在一个表面处翘曲成凹陷。 因此，确保半导体芯片和安装板之间的刚性以及间隔。 此外，具有安装在布线基板的两个表面上的逻辑LSI的半导体器件安装在具有插入其中具有规定高度的突出电极的外壳中的安装板上，其中布线基板翘曲以在具有 投影电极。

公开(公告)号：US06778389B1

公开(公告)日：2004-08-17

申请号：US10613447

申请日：2003-07-03

Applicant: Andrew Z. Glovatsky ,  Vladimir Stoica

Inventor： Andrew Z. Glovatsky ,  Vladimir Stoica

IPC: H05K720

CPC classification number: H01L25/065 ,  H01L2924/0002 ,  H05K1/148 ,  H05K1/189 ,  H05K7/1434 ,  H05K2201/064 ,  H05K2201/09018 ,  H05K2201/09809 ,  H01L2924/00

Abstract: A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

Abstract translation: 微电子封装包括管状壳体和固定到容纳在壳体中的支撑件的微电子组件。 支撑件可以是笼状结构，其包括微电子组件附接到的轴向肋。 或者，支撑件可以包括用于固定柔性基板的固体表面。 微电子组件布置成具有面向并与壳体的内壁间隔开的主表面。 因此，微电子组件靠近壁以提供用于包装其他部件的最佳体积。 移动时，微电子组件和管状壳体之间的间隔在使用期间促进冷却剂气体流动以增强散热。

公开(公告)号：US06369383B1

公开(公告)日：2002-04-09

申请号：US09639145

申请日：2000-08-16

Applicant: Timothy J. Cornish ,  Harry K. Charles ,  Paul D. Wienhold

Inventor： Timothy J. Cornish ,  Harry K. Charles ,  Paul D. Wienhold

IPC: H01J4940

CPC classification number: H01J49/405 ,  G21K1/06 ,  H05K1/118 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1327

Abstract: A novel technique utilizing the precision of printed circuit board design and the physical versatility of thin, flexible substrates is disclosed to produce a new type of ion reflector. A precisely defined series of thin conductive strips (traces) are etched onto a flat, flexible circuit board substrate. Preferably, the thin conductive strips are further apart at one end of the substrate and get increasingly closer towards the other end of the substrate. The flexible substrate is then rolled into a tube to form the reflector body, with the conductive strips forming the rings of the ion reflector. The spacing between the traces, and hence the ring spacing, can be readily varied by adjusting the conductor pattern on the substrate sheet during the etching process. By adjusting the spacing between the rings, the characteristics of the field created by the reflectron can be easily customized to the needs of the user.

Abstract translation: 公开了一种利用印刷电路板设计的精确性和薄的柔性基板的物理通用性的新技术，以产生新型的离子反射器。 将精确定义的一系列薄导电条（迹线）蚀刻到平坦，柔性的电路板基板上。 优选地，薄导电条在衬底的一端处进一步分开，并且越来越靠近衬底的另一端。 然后将柔性基材卷成管以形成反射体，导电条形成离子反射体的环。 通过在蚀刻工艺期间调节衬底片上的导体图案，可以容易地改变迹线之间的间隔以及因此的环间隔。 通过调整环之间的间距，可以根据用户的需要轻松定制由反射镜产生的场的特性。

公开(公告)号：US06345437B1

公开(公告)日：2002-02-12

申请号：US09055881

申请日：1998-04-07

Applicant: Jurgen Schulz-Harder ,  Karl Exel

Inventor： Jurgen Schulz-Harder ,  Karl Exel

IPC: H01R4300

CPC classification number: H01L23/13 ,  C04B37/001 ,  C04B37/021 ,  C04B37/023 ,  C04B2235/6562 ,  C04B2235/6565 ,  C04B2237/124 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/407 ,  C04B2237/54 ,  C04B2237/70 ,  C04B2237/76 ,  C04B2237/82 ,  H01L21/4807 ,  H01L23/3735 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/09018 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49158 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A process for manufacturing a metal ceramic substratum for use as a substrate in electrical or electronic circuits or components which includes utilizing an unique form mold process. At least one blank ceramic plate is shaped in a form mold through a desired set of process steps. The steps include heating and cooling to desired temperatures at desired heat and cool rates.

Abstract translation: 一种制造用作电气或电子电路或部件中的基板的金属陶瓷基底的方法，其包括利用独特的成型模制工艺。 至少一个空白陶瓷板通过所需的一组工艺步骤成型成模具。 这些步骤包括以所需的加热和冷却速率加热和冷却至所需温度。

公开(公告)号：US6020862A

公开(公告)日：2000-02-01

申请号：US057676

申请日：1998-04-09

Applicant: Charles M. Newton ,  William D. Killen ,  Thomas P. Smyth

Inventor： Charles M. Newton ,  William D. Killen ,  Thomas P. Smyth

IPC: H01Q1/38 ,  H01Q9/04 ,  H01Q9/27 ,  H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/20 ,  H05K3/12 ,  H01Q1/24

CPC classification number: H01Q1/38 ,  H01Q9/0471 ,  H01Q9/27 ,  H05K3/207 ,  H05K1/0284 ,  H05K1/0366 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2201/09018 ,  H05K2203/0156 ,  Y10T29/49155 ,  Y10T29/49158

Abstract: A method for making an RF device, such as an antenna, having a non-planar shape with a high degree of accuracy includes the steps of forming an electrical conductor pattern on a flexible substrate, and positioning the flexible substrate onto the mold having the non-planar shape so that the electrical conductor pattern is exposed. The method also includes forming a rigid layer on the flexible substrate so that the exposed electrical conductor pattern will be transferred to the rigid layer upon separation from the flexible substrate. The rigid layer is separated from the flexible substrate with the electrical conductor pattern remaining on the rigid layer. The method preferably further includes forming an additional thickness of conductive material onto the electrical conductor pattern remaining on the rigid layer. The electrical conductor pattern may be a metal pattern which may be printed onto the substrate. In other embodiments, the electrical conductor pattern on the flexible substrate may be replaced by a seed material that will later be receptive to metal deposition to the define the conductive portions.

Abstract translation: 制造具有高精度非平面形状的RF器件的RF器件的方法包括以下步骤：在柔性衬底上形成电导体图案，并将柔性衬底定位在具有非平面形状的模具上， 平面形状，使得电导体图案露出。 该方法还包括在柔性基底上形成刚性层，使得暴露的电导体图案在与柔性基底分离时将被转移到刚性层。 刚性层与柔性基板分离，电导体图案保留在刚性层上。 该方法优选还包括在残留在刚性层上的电导体图案上形成附加厚度的导电材料。 电导体图案可以是可以印刷到基板上的金属图案。 在其他实施例中，柔性基板上的电导体图案可以由稍后将接受金属沉积的种子材料代替以限定导电部分。

公开(公告)号：US5876789A

公开(公告)日：1999-03-02

申请号：US747930

申请日：1996-11-12

Applicant: Taihei Nakada

Inventor： Taihei Nakada

IPC: B29C69/00 ,  B29C45/14 ,  H01Q3/26 ,  H01Q15/14 ,  H05K3/00 ,  H05K3/02 ,  H05K3/40 ,  H05K3/46 ,  B05D5/12 ,  B28B7/22

CPC classification number: B29C45/14778 ,  H01Q15/141 ,  H05K3/0014 ,  H05K3/4046 ,  B29C2045/14237 ,  B29L2031/3456 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2201/10416 ,  H05K2203/0228 ,  H05K3/0044 ,  H05K3/025 ,  H05K3/4644 ,  H05K3/4647

Abstract: In a first step, a conductive layer a1 is formed on a three-dimensionally curved upper surface of a main mold. In a second step, a peripheral surface mold is attached to the outer peripheral surface of the main mold, and a liquid dielectric of an age hardening type is cast onto the conductor layer, and hardened. In a third step, the peripheral surface mold is detached from the main mold, and an unnecessary portion of the hardened dielectric is cut to thereby form a dielectric layer. In a fourth step, another conductor layer is formed on the dielectric layer. A method comprising these steps enables a dielectric board with a voluntary three-dimensionally curved surface to be manufactured with high accuracy.

Abstract translation: 在第一步骤中，在主模具的三维弯曲的上表面上形成导电层a1。 在第二步骤中，将外周表面模具附接到主模具的外周表面，并将时效硬化型液体电介质浇铸到导体层上并硬化。 在第三步骤中，将外周表面模具与主模具分离，并且切割硬化电介质的不需要部分从而形成电介质层。 在第四步骤中，在电介质层上形成另一导体层。 包括这些步骤的方法使得能够以高精度制造具有自愿的三维曲面的电介质板。

公开(公告)号：US5738797A

公开(公告)日：1998-04-14

申请号：US649377

申请日：1996-05-17

Applicant: Robert E. Belke, Jr. ,  Michael G. Todd ,  Andrew Z. Glovatsky ,  Alice D. Zitzmann

Inventor： Robert E. Belke, Jr. ,  Michael G. Todd ,  Andrew Z. Glovatsky ,  Alice D. Zitzmann

IPC: C23F1/02 ,  H05K3/00 ,  H05K3/06 ,  H05K3/20 ,  H05K3/46 ,  B44C1/22 ,  C23F1/00

CPC classification number: H05K3/4685 ,  C23F1/02 ,  H05K3/062 ,  H05K3/205 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2201/09018 ,  H05K2201/09118 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376 ,  H05K3/0014

Abstract: A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut. The molded circuit structure is then removed from the mold and the metallic foil is further etched to complete the forming of the circuit.

Abstract translation: 通过部分蚀刻具有涂层的箔形成三维多层电路结构。 通过提供金属箔，在金属箔的每一侧上施加可光限定的光致抗蚀剂，选择性地暴露和显影光致抗蚀剂以形成暴露区域和未曝光区域，以及用第二金属镀覆未曝光区域来形成预制电路。 将预电路放置在蚀刻溶液中，并且在蚀刻溶液部分蚀刻金属箔以切割第二金属之后移除。 然后将部分蚀刻的预循环弯曲成预定的形状。 然后将部分蚀刻的预制电路插入模腔中，使得电路结构的至少一个表面与模具相邻。 模具填充有聚合物树脂，使得聚合物树脂封装部分蚀刻的预循环的至少一部分并且基本上填充底切。 然后将模制电路结构从模具中取出，并且金属箔被进一步蚀刻以完成电路的形成。

公开(公告)号：US5686230A

公开(公告)日：1997-11-11

申请号：US423243

申请日：1995-04-13

Applicant: Antonius J. M. Nellissen

Inventor： Antonius J. M. Nellissen

IPC: H05K3/06 ,  G03F7/20 ,  G03F7/24 ,  H01L21/60 ,  H05K1/00 ,  H05K3/00 ,  H05K3/02 ,  H05K3/40

CPC classification number: G03F7/703 ,  G03F7/24 ,  H05K3/0082 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K2203/135 ,  H05K3/064 ,  H05K3/403

Abstract: A method of manufacturing a device provided with a body with a surface, at least a portion of the surface being provided with a radiation-sensitive layer, after which portions of the radiation-sensitive layer are exposed to radiation through a mask, a first portion of the layer being irradiated directly using a first part of a radiation beam projected through the mask and a second portion of the layer being irradiated indirectly using a second part of the radiation beam projected through the mask and reflected onto the second portion, the radiation beam being substantially collimated.

Abstract translation: 一种制造具有表面的主体的装置的方法，所述表面的至少一部分设置有辐射敏感层，之后辐射敏感层的一部分通过掩模暴露于辐射，第一部分 使用投射穿过掩模的辐射束的第一部分直接照射该层，并且该层的第二部分被间接照射，该辐射束的第二部分通过掩模投射并反射到第二部分上，辐射束 基本准直。

公开(公告)号：US5552249A

公开(公告)日：1996-09-03

申请号：US315993

申请日：1994-09-30

Applicant: David G. Jensen ,  Daniel R. Tichenor

Inventor： David G. Jensen ,  Daniel R. Tichenor

IPC: G03F1/68 ,  G03F7/00 ,  G03F7/24 ,  H01Q1/42 ,  H01Q15/00 ,  H01Q15/14 ,  H05K1/00 ,  H05K3/00 ,  H05K3/06 ,  G03F9/00

CPC classification number: H05K3/0082 ,  G03F1/68 ,  G03F7/00 ,  G03F7/24 ,  H01Q1/422 ,  H01Q1/425 ,  H01Q15/0013 ,  H01Q15/141 ,  H05K1/0284 ,  H05K2201/09018 ,  H05K2203/056 ,  H05K3/0002 ,  H05K3/0032 ,  H05K3/064 ,  H05K3/067

Abstract: Parts having complexly curved, frequency selective surfaces can be manufactured with a high degree of precision using a three-dimensional conformal mask. The mask has a transparent substrate and a patterned opaque layer on the substrate. The layer may be patterned by laser ablation. Alternatively, the patterning of the opaque layer can be accomplished by applying a layer of photosensitive material over the opaque layer and then defining temporary and permanent areas thereof. The temporary areas of the photosensitive layer and the opaque layer are removed sequentially to define the transparent portions of the mask. Parts are made by intimately mating the mask and a part body to which a layer of metal and a layer of photosensitive material have been applied, and exposing the part to radiation through the mask. The exposed part is then chemically developed, the layer of metal is etched, and the remainder of the layer of photosensitive material is removed to complete the patterning of the part body surface. The mask is preferably made using a high precision laser etch system to sharply define the transparent portions of the mask and maximize the precision of the patterning on the subsequently made parts.

Abstract translation: 可以使用三维适形掩模以高精度制造具有复弯曲频率选择性表面的部件。 掩模在基底上具有透明基底和图案化不透明层。 该层可以通过激光烧蚀来图案化。 或者，不透明层的图案化可以通过在不透明层上施加一层感光材料，然后限定其临时和永久的区域来实现。 依次除去感光层和不透明层的临时区域以限定掩模的透明部分。 部件通过将掩模和已经施加有金属层和感光材料层的部件体紧密地配合并且将部件暴露于通过掩模的辐射而制成。 然后将暴露的部分化学显影，蚀刻金属层，除去感光材料层的其余部分以完成部件体表面的图案化。 该掩模优选地使用高精度激光蚀刻系统来制造，以锐利地限定掩模的透明部分，并使后续制造的部件上的图案化的精度最大化。