公开(公告)号：US20010052659A1

公开(公告)日：2001-12-20

申请号：US09881769

申请日：2001-06-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD

Inventor： Izuru Nakai ,  Toshiharu Okada ,  Haruhiro Yuki

IPC: B29C035/08 ,  B23K026/38

CPC classification number: B23K26/361 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  H05K3/0038 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2203/1476

Abstract: When drilling a multi layered sheet-like material, drilling is first made with pulses having energy that generates an inter-layer pull-off force smaller than the adhesion force between the layers. Then pulses with higher energy are radiated for trimming the shape of the holes, and thus through-holes having a desired shape are drilled without causing delamination of the layers.

Abstract translation: 当钻多层片状材料时，首先用具有生成小于层之间的粘附力的层间拉拔力的能量的脉冲进行钻孔。 然后照射具有较高能量的脉冲以修整孔的形状，因此钻出具有期望形状的通孔而不会引起层的分层。

公开(公告)号：US20010031567A1

公开(公告)日：2001-10-18

申请号：US09753986

申请日：2001-01-03

Applicant: Fujitsu Limited, Fujisu Takamisawa, & Honda Tsushin Kogyo

Inventor： Kazuya Orui ,  Yasuhiro Nagashima ,  Toshiaki Harigaya ,  Manabu Shimizu ,  Chiharu Nunokawa

IPC: H05K001/00

CPC classification number: H05K3/368 ,  H01L2924/00013 ,  H01R12/523 ,  H01R12/585 ,  H01R43/205 ,  H05K3/308 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10856 ,  H05K2201/10863 ,  H05K2201/2036 ,  H01L2224/29099

Abstract: An interposition structure interposed between substrates and capable of guiding the insertion of a connection pin for electrically connecting the substrates to each other, whereby the connection pin can be inserted properly even in cases where the substrates to be connected or other members have a dimensional error caused during production thereof, a positioning error or the like. The interposition structure has an interposition body in which a through hole is formed such that connection pin inlet and outlet portions thereof each have an inner diameter gradually increasing in a direction from the inner part to the corresponding outer open end thereof, and also has a positioning protuberance provided on the underside of the interposition body. The interposition structure is interposed between upper and lower substrates with the positioning protuberance received in a recess formed in the upper surface of the lower substrate, and the connection pin is inserted through a hole in the upper substrate, the through hole, and a hole in the lower substrate.

Abstract translation: 插入在基板之间并且能够引导用于将基板彼此电连接的连接销的插入结构，从而即使在要连接的基板或其他构件具有尺寸误差的情况下也可以适当地插入连接销 在其生产期间，定位误差等。 插入结构具有插入体，其中形成通孔，使得连接针入口和出口部分的内径在从内部到其对应的外部开口端的方向上具有逐渐增加的内径，并且还具有定位 设置在插入体下面的凸起。 插入结构插入在上下基板之间，定位突起容纳在形成在下基板的上表面中的凹部中，并且连接销穿过上基板，通孔和孔中的孔 下基板。

公开(公告)号：US06266874B1

公开(公告)日：2001-07-31

申请号：US09118735

申请日：1998-07-17

Applicant: Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

Inventor： Thomas H. DiStefano ,  John W. Smith ,  Konstantine N. Karavakis ,  Zlata Kovac ,  Joseph Fjelstad

IPC: H05K310

CPC classification number: H01R13/2414 ,  H01R12/714 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/445 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0382 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of making a microelectronic component by providing a conductive element, providing a resist at selected locations on said conductive element and electrophoretically depositing an uncured dielectric material on the conductive element, wherein the uncured material will be deposited on the conductive element except at locations covered by the resist. The deposited material is cured to form a dielectric layer and the resist is removed so that the dielectric layer has openings extending to the conductive element at locations the locations which were covered by the resist.

Abstract translation: 一种通过提供导电元件制造微电子元件的方法，在所述导电元件上的选定位置提供抗蚀剂并在导电元件上电泳沉积未固化的介电材料，其中未固化的材料将沉积在导电元件上，除了覆盖的位置 由抗蚀剂。 固化沉积的材料以形成电介质层，并且去除抗蚀剂，使得电介质层具有在被抗蚀剂覆盖的位置的位置处延伸到导电元件的开口。

公开(公告)号：US06201213B1

公开(公告)日：2001-03-13

申请号：US08821934

申请日：1997-03-21

Applicant: Hidekazu Sawai ,  Miki Kurosawa ,  Masato Matsubara

Inventor： Hidekazu Sawai ,  Miki Kurosawa ,  Masato Matsubara

IPC: B23K2606

CPC classification number: H05K3/0026 ,  B23K26/066 ,  B23K26/389 ,  H05K2201/09827 ,  H05K2203/0557

Abstract: A wiring board is machined by providing a light shielding body for shielding a portion of a laser beam in a light path between a laser oscillator and a machining lens, irradiating the laser beam onto the light shielding body, and introducing a non-shielded portion of the laser beam having passed through the light shielding body to the machining lens.

Abstract translation: 通过在激光振荡器和加工用透镜之间的光路中设置用于遮蔽激光束的一部分的遮光体，将激光束照射到遮光体上，并且将非屏蔽部分 激光束已经穿过遮光体到达加工透镜。

公开(公告)号：US6097089A

公开(公告)日：2000-08-01

申请号：US237840

申请日：1999-01-27

Applicant: Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

Inventor： Morio Gaku ,  Nobuyuki Ikeguchi ,  Toshihiko Kobayashi

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H05K1/02 ,  H05K1/05 ,  H05K1/00 ,  H01L23/12 ,  H01L23/52 ,  H05K1/14

CPC classification number: H01L21/486 ,  H01L21/481 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/32 ,  H05K1/0204 ,  H05K1/0206 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/10158 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/056 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/09827 ,  H05K2203/0369

Abstract: There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.

Abstract translation: 提供了一种半导体塑料封装，其中至少一个半导体芯片安装在小型印刷线路板，用于上述封装的金属板和用于制造用于上述封装的铜包覆板的方法中。 更具体地，提供了适用于诸如微处理器，微控制器，ASIC和图形的相对高瓦特，多端子和高密度半导体塑料封装的半导体塑料封装及其制造方法。

公开(公告)号：US6091027A

公开(公告)日：2000-07-18

申请号：US994937

申请日：1997-12-19

Applicant: Hjalmar Hesselbom ,  Peter Bodo

Inventor： Hjalmar Hesselbom ,  Peter Bodo

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/48 ,  H01L23/52 ,  H01L23/538 ,  H01L23/66 ,  H01L25/065 ,  H05K3/40 ,  H05K3/46 ,  H05K1/03

CPC classification number: H01L23/5384 ,  H01L21/486 ,  H01L23/481 ,  H01L23/5389 ,  H01L23/66 ,  H01L25/0652 ,  H05K3/403 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/3011 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K3/4644

Abstract: A via structure is obtained by etching a through-hole in a substrate on the via location and placing transmission lines on declining or sloping sidewalls of the hole. The lines continue to conductors on the other surface of the substrate through vias located in a free portion of a thin film structure at the bottom side of the substrate. The free portion is so strong and large, that several vias can be made therein for connection to a plurality of parallel lines forming e.g. a bus structure. The large free portion can be additionally supported by a thick support layer applied on top of the layers in the hole. By applying an isolated ground plane and a dielectric layer between the substrate and the transmission lines, the transmission lines on the sloping sidewalls of the via hole structure can be made impedance matched. The sloping sidewalls of the via hole can easily be obtained using a V-groove etch for a monocrystalline Si-substrate. The via structure obtained is especially well suited for data transmission buses, which do not need to reduce their transmission line density through the via structure.

Abstract translation: 通过蚀刻通孔位置上的衬底中的通孔并将传输线放置在孔的下降或倾斜的侧壁上来获得通孔结构。 这些线通过位于衬底底部的薄膜结构的自由部分中的通孔继续导通在衬底的另一表面上。 自由部分是如此强大和大，可以在其中制造若干通孔，以连接到多条平行线， 总线结构。 大的自由部分可以另外由施加在孔中的层的顶部上的厚的支撑层支撑。 通过在衬底和传输线之间施加隔离的接地平面和电介质层，可以使通孔结构的倾斜侧壁上的传输线阻抗匹配。 通孔的倾斜侧壁可以使用用于单晶Si衬底的V沟槽蚀刻来获得。 获得的通孔结构特别适用于不需要通过通孔结构降低其传输线密度的数据传输总线。

公开(公告)号：US6054761A

公开(公告)日：2000-04-25

申请号：US203126

申请日：1998-12-01

Applicant: Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

Inventor： Mark Thomas McCormack ,  Hunt Hang Jiang ,  Solomon I. Beilin ,  Albert Wong Chan ,  Yasuhito Takahashi

IPC: C08K3/00 ,  C08L63/00 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H01L23/04

CPC classification number: H05K3/363 ,  H01L23/49883 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H01L2224/16503 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10666 ,  H05K2203/0425 ,  H05K2203/0455 ,  H05K3/321 ,  H05K3/4623

Abstract: Printed circuit substrates and electrical assemblies including a conductive composition are disclosed. The printed circuit substrate and the electrical assembly embodiments comprise a first conducting region and a second conducting region. A dielectric layer is disposed between the first and second conducting regions. An aperture is disposed in the dielectric layer and a via structure including the conductive composition is disposed in the aperture. The conductive composition is preferably in a cured state and electrically communicates with the first and second conducting regions. In preferred embodiments, the conductive composition comprises conductive particles in an amount of at least about 75 wt. % based on the weight of the composition. At least 50% by weight of the conductive particles have melting points of less than about 400.degree. C. The composition further includes a carrier including an epoxy-functional resin in an amount of at least about 50 wt. % based on the weight of the carrier, and a fluxing agent in an amount of at least about 0.1 wt % based on the weight of the carrier. The epoxy functional resin can have a viscosity of less than about 1000 centipoise at 25.degree. C.

Abstract translation: 公开了印刷电路基板和包括导电组合物的电气组件。 印刷电路基板和电组件实施例包括第一导电区域和第二导电区域。 电介质层设置在第一和第二导电区域之间。 在电介质层中设置孔，并且包括导电组合物的通孔结构设置在孔中。 导电组合物优选处于固化状态并与第一和第二导电区域电连通。 在优选的实施方案中，导电组合物包含至少约75wt。 基于组合物的重量％。 至少50重量％的导电颗粒具有小于约400℃的熔点。该组合物还包括载体，其包含至少约50重量％的量的环氧官能树脂。 基于载体的重量，以及基于载体重量的至少约0.1重量％的助熔剂。 环氧官能树脂在25℃下的粘度可以小于约1000厘泊

公开(公告)号：US6053397A

公开(公告)日：2000-04-25

申请号：US935170

申请日：1997-09-24

Applicant: Janusz Kaminski

Inventor： Janusz Kaminski

IPC: B23K33/00 ,  B23K35/14 ,  H01L21/48 ,  H01L21/60 ,  H05K3/00 ,  H05K3/34 ,  B23K35/12 ,  B23K1/20 ,  B23K31/02

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H05K3/0035 ,  H05K2201/09827 ,  H05K2203/043 ,  H05K2203/056 ,  H05K2203/0568 ,  H05K2203/0594 ,  H05K3/3452

Abstract: Method for the manufacture of micro solder bumps, in which holes are structured by means of laser ablation in a mask, in order to produce solder bumps higher than the mask thickness. Through the additional use of a wobble plate in the production of trough-like stepped holes, micro solder bumps with an even larger volume can be produced.

Abstract translation: 用于制造微焊料凸块的方法，其中通过掩模中的激光烧蚀来构造空穴，以便产生高于掩模厚度的焊料凸块。 通过在生产槽状阶梯孔中额外使用摆盘，可以生产出具有更大体积的微型焊料凸块。

公开(公告)号：US5923535A

公开(公告)日：1999-07-13

申请号：US959270

申请日：1997-10-28

Applicant: Yuzo Shimada ,  Takayuki Suyama ,  Shinichi Hasegawa

Inventor： Yuzo Shimada ,  Takayuki Suyama ,  Shinichi Hasegawa

IPC: H01L23/498 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K1/03

CPC classification number: H01L23/4985 ,  H05K3/3436 ,  H05K3/363 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K1/141 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/0058 ,  H05K3/3457 ,  H05K3/368 ,  Y02P70/613

Abstract: An electronic device assembly includes a rigid, first substrate and a second substrate. The first substrate has a first pad on the upper surface, and a through-hole at a position of the first pad. The second substrate has a second pad on the upper surface thereof. The first and second pads are connected via solder. At least a part of the solder is positioned in the through-hole of the first substrate. The first substrate may include a flexible substrate and a rigid plate. The through-hole is provided in the flexible substrate. The first pad is provided on the lower surface of the flexible substrate. The rigid plate is attached to the flexible substrate. The plate has a hole at a position of the through-hole to make the first pad reachable.

Abstract translation: 电子设备组件包括刚性的第一衬底和第二衬底。 第一基板在上表面具有第一焊盘，在第一焊盘的位置具有通孔。 第二衬底在其上表面上具有第二衬垫。 第一和第二焊盘通过焊料连接。 焊料的至少一部分位于第一基板的通孔中。 第一基板可以包括柔性基板和刚性板。 通孔设置在柔性基板中。 第一衬垫设置在柔性衬底的下表面上。 刚性板附着在柔性基板上。 该板在通孔的位置处具有孔，以使第一垫可达。

公开(公告)号：US5896655A

公开(公告)日：1999-04-27

申请号：US834749

申请日：1997-04-03

Applicant: Dieter Knodler

Inventor： Dieter Knodler

IPC: H01R43/20 ,  H05K1/11 ,  H05K3/04 ,  H05K3/30 ,  H05K3/34 ,  H05K3/42 ,  H05K9/00 ,  H01R43/00

CPC classification number: H05K1/116 ,  H01R43/20 ,  H05K3/045 ,  H05K9/0018 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2201/10871 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/426 ,  Y10T29/49139 ,  Y10T29/49153 ,  Y10T29/49211 ,  Y10T29/49222

Abstract: A method for the manufacture of electrically conductive lead-throughs for metallized plastic housings. Elevations around the lead-through holes in the housing part are formed at the time of making the housing part (e.g. by injection molding). The entire surface of the housing part is then metallized and the metallization on the elevations around the lead-through holes is removed by mechanical processes that act in one plane and where the lower metallization areas remain unaffected on account of the difference in level. Finally, the metal pins are attached in the lead-through holes by soldering or glueing.

Abstract translation: 一种用于制造用于金属化塑料外壳的导电引线的方法。 在制造壳体部分时（例如通过注模）形成壳体部分中的引导孔周围的高度。 然后将壳体部分的整个表面进行金属化，并且通过在一个平面中起作用的机械工艺去除引线通孔周围的高度上的金属化，并且由于水平差异，下部金属化区域保持不受影响。 最后，金属销通过焊接或胶合连接在导通孔中。