公开(公告)号：US09036364B1

公开(公告)日：2015-05-19

申请号：US12002361

申请日：2007-12-17

Applicant: Laurie P. Fung

Inventor： Laurie P. Fung

IPC: H05K1/02

CPC classification number: H05K1/0298 ,  H05K1/0243 ,  H05K1/025 ,  H05K2201/09336 ,  H05K2201/09727 ,  H05K2201/09972

Abstract: Electronic devices to output signals at different frequencies are mounted to a circuit board that has a group of layers, where the group of layers include reference plane layers and signal layers between the reference plane layers. A first signal layer has conductive traces having a first dimension to communicate the signals at a first frequency, and a second signal layer has conductive traces having a second, different dimension to communicate signals at a second, different frequency. The first and second signal layers are successive layers without any reference plane layer in between the first and second signal layers.

Abstract translation: 将以不同频率输出信号的电子设备安装到具有一组层的电路板，其中该组层包括参考平面层和参考平面层之间的信号层。 第一信号层具有导电迹线，其具有第一维度以在第一频率上传送信号，并且第二信号层具有导通迹线，具有第二不同维度以在第二不同频率传送信号。 第一和第二信号层是在第一和第二信号层之间没有任何参考平面层的连续层。

公开(公告)号：US20150131254A1

公开(公告)日：2015-05-14

申请号：US14228250

申请日：2014-03-28

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min-Sung KIM ,  Jun-Hyung SON

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/46 ,  H05K3/06 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/06 ,  H05K3/108 ,  H05K3/3436 ,  H05K3/4682 ,  H05K2201/0352 ,  H05K2201/09136 ,  H05K2201/094 ,  H05K2201/09736 ,  H05K2201/09972 ,  H05K2201/10674 ,  H05K2203/0353 ,  H05K2203/0574 ,  H05K2203/302 ,  Y02P70/611

Abstract: The present invention discloses a printed circuit board, a semiconductor package having the same, and a method for manufacturing the same. A printed circuit board according to an aspect of the present invention includes: a package board including a mounting area and a peripheral area, the mounting area having a semiconductor chip mounted therein, the peripheral area surrounding the mounting area; a first central circuit pattern formed in the mounting area on one surface of the package board; a second central circuit pattern formed in the mounting area on the other surface of the package board and having a greater thickness than the first central circuit pattern; a first peripheral circuit pattern formed in the peripheral area on the one surface of the package board; and a second peripheral circuit pattern formed in the peripheral area on the other surface of the package board and having a greater thickness than the second peripheral circuit pattern.

Abstract translation: 本发明公开了一种印刷电路板，具有该印刷电路板的半导体封装及其制造方法。 根据本发明的一个方面的印刷电路板包括：包括安装区域和周边区域的封装板，安装区域具有安装在其中的半导体芯片，围绕安装区域的周边区域; 形成在所述封装板的一个表面上的所述安装区域中的第一中心电路图案; 形成在所述封装板的另一表面上的所述安装区域中并且具有比所述第一中心电路图案更大的厚度的第二中心电路图案; 形成在所述封装板的一个表面上的周边区域中的第一外围电路图案; 以及第二外围电路图案，其形成在所述封装板的另一表面的周边区域中，并且具有比所述第二外围电路图案更大的厚度。

公开(公告)号：US09019779B2

公开(公告)日：2015-04-28

申请号：US14046756

申请日：2013-10-04

Applicant: Micron Technology, Inc.

Inventor： Terry R. Lee ,  Joseph Jeddeloh

IPC: G11C7/10 ,  G11C5/02 ,  H05K1/18 ,  H05K1/02

CPC classification number: G11C5/02 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/09972 ,  Y02P70/611

Abstract: A layout for simultaneously sub-accessible memory modules is disclosed. In one embodiment, a memory module includes a printed circuit board having a plurality of sectors, each sector being electrically isolated from the other sectors and having a multi-layer structure. At least one memory device is attached to each sector, the memory devices being organized into a plurality of memory ranks. A driver is attached to the printed circuit board and is operatively coupled to the memory ranks. The driver is adapted to be coupled to a memory interface of the computer system. Because the sectors are electrically-isolated from adjacent sectors, the memory ranks are either individually or simultaneously, or both individually and simultaneously accessible by the driver so that one or more memory devices on a particular sector may be accessed at one time. In an alternate embodiment, the printed circuit board includes a driver sector electrically isolated from the other sectors and having a multi-layer structure, the driver being attached to the driver sector.

Abstract translation: 公开了一种用于同时可辅助存储器模块的布局。 在一个实施例中，存储器模块包括具有多个扇区的印刷电路板，每个扇区与其它扇区电隔离并且具有多层结构。 至少一个存储器装置连接到每个扇区，存储器装置被组织成多个存储器等级。 驱动器连接到印刷电路板并且可操作地耦合到存储器等级。 驱动器适于耦合到计算机系统的存储器接口。 由于扇区与相邻扇区电隔离，所以存储器排列是单独地或同时地存在的，或者由驱动器单独地并且可以同时访问，使得一次可以访问特定扇区上的一个或多个存储器件。 在替代实施例中，印刷电路板包括与其他扇区电隔离并具有多层结构的驱动器扇区，该驱动器附接到驱动器扇区。

公开(公告)号：US20150049439A1

公开(公告)日：2015-02-19

申请号：US14090387

申请日：2013-11-26

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Masaya SHIMAMURA ,  Kenzo KITAZAKI ,  Eiji MUGIYA ,  Tatsuro SAWATARI ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15159 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/107 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09827 ,  H05K2201/09972 ,  H01L2924/00

Abstract: A circuit module includes a circuit substrate, a mount component, a sealing body, and a shield. The circuit substrate includes a mount surface. The mount component is mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench formed from a main surface of the sealing body to the mount surface. The trench includes side walls configured of a first side wall at a mount surface side and a second side wall at a main surface side. A straight line connecting the first point and the second point has a second slope gentler than the first slope against the mount surface. The shield covers the sealing body and has an inner shield section formed within the trench and an outer shield section disposed on the main surface and the inner shield.

Abstract translation: 电路模块包括电路基板，安装部件，密封体和屏蔽件。 电路基板包括安装表面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有从密封体的主表面到安装表面形成的沟槽。 沟槽包括由安装表面侧的第一侧壁和主表面侧的第二侧壁构成的侧壁。 连接第一点和第二点的直线具有比靠着安装表面的第一斜坡更缓和的第二斜率。 屏蔽罩覆盖密封体并具有形成在沟槽内的内屏蔽部分和设置在主表面和内屏蔽上的外屏蔽部分。

公开(公告)号：US20150043188A1

公开(公告)日：2015-02-12

申请号：US14452640

申请日：2014-08-06

Applicant: SMR Patents S.A.R.L.

Inventor： Andreas Herrmann

IPC: H05K1/14 ,  H05K3/10 ,  B60R1/12

CPC classification number: H05K1/142 ,  B60R1/12 ,  H05K1/0286 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/0014 ,  H05K3/10 ,  H05K3/105 ,  H05K2201/0187 ,  H05K2201/09027 ,  H05K2201/09118 ,  H05K2201/09963 ,  H05K2201/09972 ,  H05K2201/209 ,  H05K2203/107 ,  H05K2203/1453 ,  H05K2203/1461 ,  H05K2203/168 ,  Y10T29/49126

Abstract: The invention relates to a method for manufacturing a printed circuit board (10) having a substrate (2) and an electric circuit (8), in particular for a rear view device of a motor vehicle, the method comprising the following steps: manufacturing a plurality of substrate parts (2a, 2b); and selecting at least two of the substrate parts (2a, 2b), and connecting the selected substrate parts (2a, 2b) and providing the connected substrate parts (2a, 2b) with the circuit (8).

Abstract translation: 本发明涉及一种用于制造具有基板（2）和电路（8）的印刷电路板（10）的方法，特别是用于机动车辆的后视装置，该方法包括以下步骤： 多个基板部件（2a，2b）; 以及选择所述基板部分（2a，2b）中的至少两个，并且连接所选择的基板部分（2a，2b）并且将所连接的基板部分（2a，2b）提供给所述电路（8）。

公开(公告)号：US20150043172A1

公开(公告)日：2015-02-12

申请号：US14103601

申请日：2013-12-11

Applicant: Taiyo Yuden Co., Ltd.

Inventor： Eiji MUGIYA ,  Kenzo KITAZAKI ,  Masaya SHIMAMURA ,  Tetsuo SAJI ,  Hiroshi NAKAMURA

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/0218 ,  H01L2224/16225 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/0215 ,  H05K1/0216 ,  H05K3/284 ,  H05K3/303 ,  H05K9/0024 ,  H05K9/0045 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/108 ,  Y10T29/4913 ,  H01L2924/00012

Abstract: There is provided a circuit module and a method of producing the same where interlayer wirings of a circuit substrate are prevented from damaging by laser irradiation, and a shield is assuredly electrically connected to the superficial conductor of the circuit substrate. The circuit substrate includes mount components, a sealing body, and a shield. The circuit substrate is a multi-layer substrate on which interlayer wirings are formed, and includes a mount surface on which a superficial conductor is disposed. The mount components are mounted on the mount surface. The sealing body is formed on the mount surface, covers the mount component and has a trench including a first trench section reaching the superficial conductor and a second trench section not reaching the superficial conductor. The shield has an outer shield section and an inner shield section.

Abstract translation: 提供一种电路模块及其制造方法，可以防止电路基板的层间布线受到激光照射的损害，并且屏蔽层可靠地电连接到电路基板的表面导体。 电路基板包括安装部件，密封体和屏蔽件。 电路基板是形成有层间配线的多层基板，具有设置有表面导体的安装面。 安装部件安装在安装表面上。 密封体形成在安装表面上，覆盖安装部件，并且具有包括到达表面导体的第一沟槽部分和没有到达表面导体的第二沟槽部分的沟槽。 屏蔽件具有外屏蔽部分和内屏蔽部分。

公开(公告)号：US08952766B2

公开(公告)日：2015-02-10

申请号：US13386287

申请日：2010-12-20

Applicant: Makoto Hattori ,  Masahiko Asai

Inventor： Makoto Hattori ,  Masahiko Asai

IPC: H02K11/02 ,  H02M7/00 ,  H03H1/00 ,  H02K11/00

CPC classification number: H02K11/0073 ,  H02K11/33 ,  H02M1/44 ,  H02M7/003 ,  H03H1/0007 ,  H05K1/0231 ,  H05K1/0262 ,  H05K2201/09972 ,  H05K2201/10015

Abstract: An object is to provide a control board, an inverter device, and an integrated-inverter electric compressor that are capable of improving electromagnetic compatibility (EMC property) and improving reliability against input/output of electromagnetic noise, which shows a tendency towards greater complexity and intensity. A control board to which two power systems, that is, a low-voltage power system and a high-voltage power system, are inputs, comprising a low-voltage circuit and a high-voltage circuit, and a low-voltage-side ground region and a high-voltage-side ground region that are formed in correspondence with the circuits, respectively, wherein frame ground regions are provided at a plurality of positions on the control board, and a plurality of communication line patterns connected to the low-voltage circuit are respectively connected to both the low-voltage-side ground region and the frame ground region through capacitance elements with various capacitances.

Abstract translation: 本发明的目的是提供一种能够提高电磁兼容性（EMC性能）并且提高电磁噪声的输入/输出的可靠性的控制板，逆变器装置和集成逆变电动压缩机，其显示出更大复杂性的趋势， 强度。 两个电力系统，即低压电力系统和高压电力系统的控制板是输入，包括低压电路和高压电路以及低压侧接地 区域和与电路对应地形成的高压侧接地区域，其中在接地控制板上的多个位置设置有帧接地区域，以及多个与低电压连接的通信线路图形 电路分别通过具有各种电容的电容元件连接到低电压侧接地区域和框架接地区域两者。

公开(公告)号：US08952266B2

公开(公告)日：2015-02-10

申请号：US13813632

申请日：2011-08-26

Applicant: Hiroshi Toyao

Inventor： Hiroshi Toyao

IPC: H05K1/11 ,  H05K1/03 ,  H05K1/09 ,  H04B3/28 ,  H01P3/08 ,  H05K1/14 ,  H05K1/02 ,  H01P1/20 ,  H01Q15/00 ,  H05K1/16

CPC classification number: H05K1/0296 ,  H01P1/2005 ,  H01P3/085 ,  H01Q15/006 ,  H01Q15/0086 ,  H05K1/0236 ,  H05K1/165 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09972

Abstract: A structural body includes: a first conductor and a second conductor of which at least portions are opposite to each other; a third conductor, interposed between the first conductor and the second conductor, of which at least a portion is opposite to the first conductor and the second conductor, and has a first opening; an interconnect provided in the inside of the first opening; and a conductor via which is electrically connected to the first conductor and the second conductor and is electrically insulated from the third conductor, wherein the interconnect is opposite to the first conductor and the second conductor, one end thereof being electrically connected to the third conductor at an edge of the first opening and an other end thereof being formed as an open end.

Abstract translation: 结构体包括：至少部分彼此相对的第一导体和第二导体; 第三导体，插入在第一导体和第二导体之间，其中至少一部分与第一导体和第二导体相对，并具有第一开口; 设置在所述第一开口的内部的互连; 以及导体，其经由其电连接到第一导体和第二导体并与第三导体电绝缘，其中互连与第一导体和第二导体相对，其一端与第三导体电连接 第一开口的边缘和其另一端形成为开口端。

公开(公告)号：US08946566B2

公开(公告)日：2015-02-03

申请号：US13646610

申请日：2012-10-05

Applicant: Apple Inc.

Inventor： John J. Baker

IPC: H01L23/28

CPC classification number: H05K3/284 ,  H05K3/28 ,  H05K2201/09972 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2203/1327 ,  H05K2203/1476 ,  Y10T29/49146

Abstract: An improved method for producing a PCB assembly requiring at least two different encapsulants is disclosed. The PCB assembly may have two or more separate regions in which electronic devices are attached. In each region, a unique encapsulant with different mechanical, electrical, physical and or chemical properties is used according to the particular requirements of the electronic devices in that region.

Abstract translation: 公开了一种用于生产需要至少两种不同密封剂的PCB组件的改进方法。 PCB组件可以具有两个或更多个独立的区域，其中电子设备被附接。 在每个区域中，根据该区域的电子设备的特殊要求，使用具有不同机械，电学，物理和/或化学性质的独特的密封剂。

公开(公告)号：US20140378182A1

公开(公告)日：2014-12-25

申请号：US14472525

申请日：2014-08-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro Hara ,  Masahiko Ura ,  Takahiro Watanabe

IPC: H04B1/00 ,  H04B1/40

CPC classification number: H04B1/006 ,  H04B1/40 ,  H04W88/06 ,  H05K1/0216 ,  H05K1/0243 ,  H05K3/4629 ,  H05K2201/09972

Abstract: Provided is a technique capable of improving isolation characteristics between a plurality of signal paths through which RF signals pass, without using ground electrodes or the like. Wiring electrodes 10a and 20a through which RF signals do not pass simultaneously are formed so as to be adjacent to each other in a central region of a component mounting surface 2a of a circuit board 2, and wiring electrodes 11a and 21a through which RF signals pass simultaneously are formed so as to be distanced from transmission paths 10 and 20. Accordingly, the RF signals do not simultaneously pass through the transmission paths 10 and 20, which are disposed near each other, and thus there is no risk that the RF signal passing through one of the signal paths will interfere with the RF signal passing through the other signal path.

Abstract translation: 提供了能够改善RF信号通过的多个信号路径之间的隔离特性的技术，而不使用接地电极等。 在电路基板2的部件安装面2a的中央部以及射频信号通过的配线电极11a，21a中，不会同时通过RF信号的配线电极10a，20a彼此相邻地形成 同时形成为远离传输路径10和20.因此，RF信号不同时通过彼此靠近设置的传输路径10和20，因此不存在RF信号通过的风险 通过信号路径之一将干扰通过另一个信号路径的RF信号。