公开(公告)号：US07586187B2

公开(公告)日：2009-09-08

申请号：US11473271

申请日：2006-06-23

Applicant: Yung-Yu Hsu ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

Inventor： Yung-Yu Hsu ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

IPC: H01L23/04

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/111 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10265 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

Abstract translation: 公开了具有应力缓冲能力的互连结构，其包括：第一表面，连接到由基板和电子器件组成的组中选择的器件; 第二表面，连接到从由所述基板和所述电子装置组成的组中选择的装置; 支撑部分，夹持在第一和第二表面之间并互相连接，同时使得支撑部分的两个端部的区域相对于第一和第二表面的面积小; 以及缓冲器，其布置成围绕所述支撑部分以吸收和缓冲应力。

公开(公告)号：US20080207018A1

公开(公告)日：2008-08-28

申请号：US11679177

申请日：2007-02-26

Applicant: Cheng-Lien Chiang

Inventor： Cheng-Lien Chiang

IPC: H05K1/00

CPC classification number: H05K3/32 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/4015 ,  H05K2201/10265 ,  H05K2201/10318 ,  H05K2201/1059 ,  H05K2201/10946 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: A contact lead for engaging with an aperture lead of a circuit carrier, including a substrate contact portion electrically connected to a pad on a substrate a chip contact portion extending from the substrate contact portion and forming an angle with the substrate contact portion raising from the substrate. The contact lead chip contact portion may also be of a cylindrical shape vertically extending from the substrate contact portion. The present invention also provides a module including a printed circuit board having a plurality of pad thereon, the contact lead electrically connected to the pad, an integrated circuit carrier having a plurality of aperture leads, the aperture leads passing through the contact leads and contacting respectively thereof, and a housing structure for housing the module and providing access for the user to assemble the integrated circuit carrier.

Abstract translation: 一种用于与电路载体的孔径引线接合的接触引线，包括基板接触部分，电连接到基板上的焊盘，该芯片接触部分从基板接触部分延伸并与基板接触部分形成一角度， 。 接触引线芯片接触部分也可以是从基板接触部分垂直延伸的圆柱形形状。 本发明还提供了一种模块，其包括其上具有多个焊盘的印刷电路板，所述触点引线电连接到所述焊盘，集成电路载体，具有多个孔径引线，所述孔引线通过所述接触引线并分别接触 以及用于容纳模块并提供用于组装集成电路载体的接口的壳体结构。

公开(公告)号：US20080192451A1

公开(公告)日：2008-08-14

申请号：US11792906

申请日：2005-03-09

Applicant: Jay C. Sinnett ,  Cameron E. Smith ,  John David Adamson

Inventor： Jay C. Sinnett ,  Cameron E. Smith ,  John David Adamson

IPC: H01R9/00 ,  H01Q1/36

CPC classification number: B60C23/0493 ,  B60C23/0452 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  Y02P70/613

Abstract: A strain-resistant electrical connection and a method of making the same is provided. An antenna (36, 38) or other conductive lead is connected to a circuit (32) in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the antenna (36, 38) or conductive lead relative to the circuit (32). The antenna (36, 38) or conductive lead is at least partially coiled to provide additional ability to withstand mechanical stresses. The antenna (36, 38) or conductive lead may be encase along with is connected circuit in an elastomeric material.

Abstract translation: 提供耐应变电气连接及其制造方法。 天线（36,38）或其他导电引线以使得连接更能抵抗诸如天线（36,38）或导电引线相对于所述天线（36,38）或其他导电引线的机械应力例如天线（36,38）或导电引线的移动或旋转的方式连接到电路 电路（32）。 天线（36,38）或导电引线至少部分盘绕，以提供额外的承受机械应力的能力。 天线（36,38）或导电引线可以与壳体一起被连接在弹性体材料中。

公开(公告)号：US20080123017A1

公开(公告)日：2008-05-29

申请号：US11939607

申请日：2007-11-14

Applicant: Young-Min LEE

Inventor： Young-Min LEE

IPC: G02F1/1333

CPC classification number: H05K3/325 ,  G02F1/13452 ,  H05K2201/10136 ,  H05K2201/10265

Abstract: Disclosed is an LCD module and a liquid crystal imaging means using the same. The LCD module includes an LCD panel, a circuit board on which the LCD panel is mounted, and a plurality of pogo pins electrically connected to the circuit board. The liquid crystal imaging means include an LCD module having a circuit board, an LCD panel seated on the circuit board, and a plurality of pogo pins electrically connected to the circuit board; and a main board having a plurality of contact members corresponding to the pogo pins so that the pogo pins are connected to respective contact members.

Abstract translation: 公开了一种LCD模块和使用该模块的液晶成像装置。 LCD模块包括LCD面板，安装有LCD面板的电路板和电连接到电路板的多个弹簧针。 液晶成像装置包括具有电路板的LCD模块，坐在电路板上的LCD面板和电连接到电路板的多个弹簧销; 以及具有与弹簧销对应的多个接触构件的主板，使得弹簧销连接到相应的接触构件。

公开(公告)号：US20070228549A1

公开(公告)日：2007-10-04

申请号：US11473271

申请日：2006-06-23

Applicant: Yung-Yu Hsu ,  Shyi- Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

Inventor： Yung-Yu Hsu ,  Shyi- Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

IPC: H01L23/04

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/111 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10265 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

Abstract translation: 公开了具有应力缓冲能力的互连结构，其包括：第一表面，连接到由基板和电子器件组成的组中选择的器件; 第二表面，连接到从由所述基板和所述电子装置组成的组中选择的装置; 支撑部分，夹持在第一和第二表面之间并互相连接，同时使得支撑部分的两个端部的区域相对于第一和第二表面的面积小; 以及缓冲器，其布置成围绕所述支撑部分以吸收和缓冲应力。

公开(公告)号：US20070125571A1

公开(公告)日：2007-06-07

申请号：US11292694

申请日：2005-12-02

Applicant: Anthony Casasnovas ,  Scott Dukes

Inventor： Anthony Casasnovas ,  Scott Dukes

IPC: H05K1/16

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49222 ,  Y10T29/53174 ,  H01L2924/00

Abstract: A method for forming interconnections within a column grid array is provided. The method involves casting one or more columns with at least a compliant core material that increases flexibility between an electronic component and a printed wiring board by at least a factor of two over metallic-based solder columns, and forming the one or more columns to length for interconnecting between the electronic component and the printed wiring board. The method also involves forming a conductive material for the one or more columns to provide electrical interconnection between the electronic component and the printed wiring board.

Abstract translation: 提供了一种用于在列网格阵列内形成互连的方法。 该方法包括用至少一种柔性芯材料铸造一个或多个柱，其在金属基焊料柱上增加电子部件和印刷线路板之间的至少两倍的柔性，并且将一个或多个柱形成长度 用于在电子部件和印刷电路板之间互连。 该方法还涉及形成用于一个或多个列的导电材料以提供电子部件和印刷线路板之间的电互连。

公开(公告)号：US07192806B2

公开(公告)日：2007-03-20

申请号：US10992384

申请日：2004-11-18

Applicant: Robert L. Canella

Inventor： Robert L. Canella

IPC: H01L23/48

CPC classification number: G01R1/0466 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/325 ,  H05K3/42 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0242 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/01004

Abstract: A spring contact for establishing electrical contact between a lead element of an IC device and a substrate. The spring contact generally comprises a contact portion and a base portion. The contact portion, which generally comprises a coil-type compression spring, is configured to engage and resiliently bias against a lead element of the IC device. The spring contact is disposed in a mating aperture formed in the substrate. The base portion of the spring contact is configured to secure the spring contact within the mating aperture and to establish electrical contact with the substrate. A plurality of such spring contacts and mating apertures may be arranged on the substrate in an array corresponding to the pin-out of the IC device. A clamping element secures the IC device to the substrate and biases the IC device against the spring contacts.

Abstract translation: 用于在IC器件的引线元件和衬底之间建立电接触的弹簧触点。 弹簧接触件通常包括接触部分和基部。 通常包括线圈型压缩弹簧的接触部分构造成与IC器件的引线元件接合并弹性偏压。 弹簧触点设置在形成在基板中的配合孔中。 弹簧触点的基部构造成将弹簧触头固定在配合孔内并与基底建立电接触。 多个这样的弹簧触点和配合孔可以以对应于IC器件引脚的阵列布置在衬底上。 夹紧元件将IC器件固定到基板上，并使IC器件抵抗弹簧触点偏压。

公开(公告)号：US20060281341A1

公开(公告)日：2006-12-14

申请号：US11421720

申请日：2006-06-01

Applicant: Kaoru Soeta

Inventor： Kaoru Soeta

IPC: H01R12/00

CPC classification number: H01R13/2421 ,  H01L24/95 ,  H01L2224/73204 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01R12/7076 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10083 ,  H05K2201/10106 ,  H05K2201/10265 ,  H05K2201/10977 ,  H01L2924/00

Abstract: An electronically functioning device module, an input device having the electronically functioning device module, and electronic equipment having the input device is provided. LEDs or a microphone device are mounted to a back surface of a seat member on which reversing plates are mounted.

Abstract translation: 提供电子功能装置模块，具有电子功能装置模块的输入装置和具有输入装置的电子设备。 LED或麦克风装置安装到座椅构件的背面上，在其上安装有反转板。

公开(公告)号：US07131848B2

公开(公告)日：2006-11-07

申请号：US11237091

申请日：2005-09-27

Applicant: Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

Inventor： Scott E. Lindsey ,  Charles A. Miller ,  David M. Royster ,  Stuart W. Wenzel

IPC: H01R12/00

CPC classification number: G01R1/06733 ,  G01R1/06711 ,  G01R1/06744 ,  G01R31/2884 ,  H01L21/4853 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2924/00014 ,  H01R4/4863 ,  H01R12/57 ,  H01R13/035 ,  H01R13/2421 ,  H01R13/33 ,  H01R43/16 ,  H05K3/326 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/10265 ,  H05K2203/308 ,  H01L2224/0401

Abstract: A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device in a coil pattern over the compliant pad to its end area, forming a helix. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. In an alternative embodiment, the pad is removed to leave a freestanding helical contact.

Abstract translation: 公开了一种用于在器件和匹配衬底之间进行电接触的微电子弹簧触点及其制造方法。 弹簧触点具有粘附到装置的基板并与装置的端子间隔开的柔性衬垫。 柔性衬垫具有粘附到衬底的基底，以及远离衬底延伸的侧表面，并且逐渐变细到远离衬底的较小端部区域。 迹线从器件的端子以柔性衬垫的线圈图案延伸到其端部区域，形成螺旋线。 柔性焊盘端部区域的至少一部分被迹线覆盖，并且位于柔性焊盘上方的迹线的一部分由柔性焊盘支撑。 在替代实施例中，去除垫以留下独立的螺旋接触。

公开(公告)号：US20060243480A1

公开(公告)日：2006-11-02

申请号：US11116066

申请日：2005-04-27

Applicant: Eiji Kasahara ,  Hiroshi Katoh

Inventor： Eiji Kasahara ,  Hiroshi Katoh

IPC: H01R12/04 ,  H01L23/50

CPC classification number: H05K3/325 ,  H01L24/13 ,  H01L24/16 ,  H01L24/72 ,  H01L24/73 ,  H01L24/90 ,  H01L24/91 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73251 ,  H01L2224/81901 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  H01R12/57 ,  H05K2201/10265 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/72 ,  H01L2224/0401

Abstract: Methods and apparatus provide for connecting an integrated circuit having a ball grid array to a printed circuit board having a matrix of contact pads for electrical connection to the ball grid array.

Abstract translation: 方法和装置提供了将具有球栅阵列的集成电路连接到具有用于电连接到球栅阵列的接触焊盘矩阵的印刷电路板。