公开(公告)号：US20140182932A1

公开(公告)日：2014-07-03

申请号：US14115091

申请日：2012-04-17

Applicant: Harald Cholewa ,  Christoph Degen ,  Bernhard Reul ,  Mitja Rateiczak ,  Andreas Schlarb ,  Lothar Lesmeister

Inventor： Harald Cholewa ,  Christoph Degen ,  Bernhard Reul ,  Mitja Rateiczak ,  Andreas Schlarb ,  Lothar Lesmeister

IPC: H01R4/02

CPC classification number: H01R4/02 ,  H01L2924/0002 ,  H05B3/84 ,  H05B2203/016 ,  H05K3/3463 ,  H05K3/3494 ,  H05K3/4015 ,  H05K2201/1028 ,  H05K2201/1031 ,  H05K2203/0465 ,  Y02P70/611 ,  H01L2924/0001

Abstract: A disk having at least one electric connecting element is described. The disk has a substrate, an electrically conductive structure on a region of the substrate, a connecting element containing at least chromium-containing steel, and a layer of a soldering compound that electrically connects the connecting element to sub-regions of the electrically conductive structure.

Abstract translation: 描述具有至少一个电连接元件的盘。 盘具有基板，在基板的区域上的导电结构，至少含有含铬钢的连接元件和将连接元件电连接到导电结构的子区域的焊料化合物层 。

公开(公告)号：US08717525B2

公开(公告)日：2014-05-06

申请号：US14045391

申请日：2013-10-03

Applicant: NLT Technologies, Ltd.

Inventor： Youichirou Kamon ,  Hiroshi Haga ,  Tetsuroh Asakura

IPC: G02F1/1345 ,  G02F1/133 ,  H05K1/00 ,  H05K1/03 ,  H05K1/11 ,  H05K3/36

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: A connecting structure of the present invention includes a first substrate, a second substrate on which the first substrate is laminated, and a sheet like connection body having one end connected to one principal surface of the first substrate and another end connected to one principal surface of the second substrate, wherein a lengthwise direction of the sheet like connection body is parallel to a perimeter part of the first substrate, and the sheet like connection body has a slit part extending from one of end portions thereof to a part thereof along the lengthwise direction, and has a first end and a second end divided by the slit part at one of end portions, the first end is connected to a principal surface of the first substrate in vicinity of a peripheral part of the first substrate, and the second end is connected to a principal surface of the second substrate in vicinity of a peripheral part of the first substrate.

Abstract translation: 本发明的连接结构包括第一基板，层叠有第一基板的第二基板以及与第一基板的一个主面连接的一端的片状连接体， 第二基板，其中片状连接体的长度方向平行于第一基板的周边部分，并且片状连接体具有从其一个端部沿其长度方向延伸到其一部分的狭缝部分 并且具有在一个端部处被狭缝部分分割的第一端和第二端，所述第一端在所述第一基板的周边部分附近与所述第一基板的主表面连接，并且所述第二端是 在第一基板的周边部分附近与第二基板的主表面连接。

公开(公告)号：US20140065851A1

公开(公告)日：2014-03-06

申请号：US13601884

申请日：2012-08-31

Applicant: Taylor H. Gilbert ,  Sean S. Corbin

Inventor： Taylor H. Gilbert ,  Sean S. Corbin

IPC: H01R12/52

CPC classification number: H01R12/52 ,  H01R4/04 ,  H01R12/00 ,  H01R12/62 ,  H01R43/26 ,  H05K1/00 ,  H05K3/361 ,  H05K2201/0281 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/1034

Abstract: Electronic devices may be provided with electronic components and electrical connectors coupled between the electronic components. A connector may be formed in a small gap between the electronic components. The connector may be a thin sheet of flexible conductive material with a conductive adhesive on one surface. The connector may be installed between the components using an applicator that is attached to the connector. The applicator may be a pull-tab liner having a first surface that is tacky and a second opposing surface that is non-stick. The applicator may have an extended portion that can be held by a technician while installing the connector. The connector may be installed by inserting the connector and applicator between the components, pinching the components against the connector and applicator, and removing the applicator by pulling the extended portion to peel the applicator from the connector.

Abstract translation: 电子设备可以设置有电子部件和耦合在电子部件之间的电连接器。 连接器可以形成在电子部件之间的小间隙中。 连接器可以是在一个表面上具有导电粘合剂的柔性导电材料薄片。 可以使用附接到连接器的施加器将连接器安装在组件之间。 施用器可以是具有粘性的第一表面和不粘的第二相对表面的拉片衬里。 涂抹器可以具有在安装连接器的同时由技术人员保持的延伸部分。 连接器可以通过将连接器和施加器插入到部件之间，将部件夹持在连接器和施加器上，并且通过拉动延伸部分从连接器剥离施加器来移除施加器来安装。

公开(公告)号：US20140036181A1

公开(公告)日：2014-02-06

申请号：US14045391

申请日：2013-10-03

Applicant: NLT Technologies, Ltd.

Inventor： Youichirou KAMON ,  Hiroshi HAGA ,  Tetsuroh ASAKURA

IPC: H05K1/11 ,  G02F1/1345

CPC classification number: G02F1/13458 ,  G02F1/1345 ,  G02F1/13452 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K3/361 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/0382 ,  H05K2201/09845 ,  H05K2201/10136 ,  H05K2201/1028

Abstract: A connecting structure of the present invention includes a first substrate, a second substrate on which the first substrate is laminated, and a sheet like connection body having one end connected to one principal surface of the first substrate and another end connected to one principal surface of the second substrate, wherein a lengthwise direction of the sheet like connection body is parallel to a perimeter part of the first substrate, and the sheet like connection body has a slit part extending from one of end portions thereof to a part thereof along the lengthwise direction, and has a first end and a second end divided by the slit part at one of end portions, the first end is connected to a principal surface of the first substrate in vicinity of a peripheral part of the first substrate, and the second end is connected to a principal surface of the second substrate in vicinity of a peripheral part of the first substrate.

Abstract translation: 本发明的连接结构包括第一基板，层叠有第一基板的第二基板以及与第一基板的一个主面连接的一端的片状连接体， 第二基板，其中片状连接体的长度方向平行于第一基板的周边部分，并且片状连接体具有从其一个端部沿其长度方向延伸到其一部分的狭缝部分 并且具有在一个端部处被狭缝部分分割的第一端和第二端，所述第一端在所述第一基板的周边部分附近与所述第一基板的主表面连接，并且所述第二端是 在第一基板的周边部分附近与第二基板的主表面连接。

公开(公告)号：US20130314849A1

公开(公告)日：2013-11-28

申请号：US13902311

申请日：2013-05-24

Applicant: Power Logic South Africa (Pty) Ltd

Inventor： Raymond Mazzullo ,  Adrian Mazzullo ,  Brian Van Zyl ,  Bastian Strauf ,  Nicholas Brear

IPC: H02B1/04 ,  H02B1/015

CPC classification number: H02B1/04 ,  H02B1/015 ,  H05K1/0225 ,  H05K1/0265 ,  H05K2201/09309 ,  H05K2201/09363 ,  H05K2201/1028

Abstract: A power supply system is disclosed which comprises a printed circuit board (10) having on one side of the substrate thereof a live track (58), a neutral track (54) and a switched live track (52). A switch (30) when closed connects the live track to the switched-live track (52). The tracks (52, 58) connect live input terminal (12) to a live output terminal (20) and a neutral input terminal (16) to a neutral output terminal (18). A second switched-live track connected to the track (58) is provided on the opposite side of the substrate.

Abstract translation: 公开了一种电源系统，其包括印刷电路板（10），该印刷电路板在其基板的一侧具有实时轨道（58），中性轨道（54）和切换实况轨道（52）。 闭合时的开关（30）将实况轨道连接到开关式实时轨道（52）。 轨道（52,58）将有源输入端子（12）连接到有源输出端子（20）和中性输入端子（16）到中性输出端子（18）。 连接到轨道（58）的第二转换轨迹设置在基板的相对侧上。

公开(公告)号：US20130220689A1

公开(公告)日：2013-08-29

申请号：US13881987

申请日：2012-05-21

Applicant: Tom Marttila

Inventor： Tom Marttila

IPC: H05K3/46

CPC classification number: H05K3/46 ,  G06K19/07749 ,  G06K19/07783 ,  H01L23/49855 ,  H01L2924/0002 ,  H05K3/4685 ,  H05K2201/0397 ,  H05K2201/1028 ,  Y10T29/49002 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A manufacturing method of electrical bridges, wherein a conductive pattern (2) from electroconductive material, such as metal foil, is applied over a substrate (1) made of electrically insulating material and the electroconductive material has at least one strip tongue (3) unattached to the substrate, one side of the tongue is attached to the conductive pattern (2), and the said strip tongue (3) is folded over an area insulated electrically from the conductive pattern (2), and the strip tongue (3) is connected electroconductively to a predetermined other part (5) of the conductive pattern (2).

Abstract translation: 电桥的制造方法，其中将导电材料（例如金属箔）的导电图案（2）施加在由电绝缘材料制成的基板（1）上，并且导电材料具有至少一个带状舌（3）未连接 在所述基板上，所述舌片的一侧与所述导电图案（2）连接，并且所述带状舌片（3）折叠在与所述导电图案（2）电绝缘的区域上，并且所述带状舌片（3）为 电连接到导电图案（2）的预定的另一部分（5）。

公开(公告)号：US20130149564A1

公开(公告)日：2013-06-13

申请号：US13759694

申请日：2013-02-05

Applicant: LG Chem, Ltd.

Inventor： Youngsun PARK ,  Jeongsuk LEE ,  Keunpyo AHN ,  Chunyeon KIM ,  Joung Ho HA ,  Masayuki WAKEBE

IPC: H01M10/42

CPC classification number: H01M2/34 ,  H01M2/0404 ,  H01M10/0525 ,  H01M10/425 ,  H01M10/4257 ,  H01M2010/4271 ,  H01M2200/00 ,  H01M2200/103 ,  H01M2200/106 ,  H01M2220/30 ,  H05K1/0201 ,  H05K3/222 ,  H05K3/341 ,  H05K2201/10022 ,  H05K2201/10181 ,  H05K2201/1028 ,  Y02E60/122

Abstract: A battery pack including a battery cell having an electrode assembly of a cathode/separator/anode structure mounted in a battery case together with an electrolyte in a sealed state, and a protection circuit module (PCM) electrically connected to the battery cell. The PCM includes a protection circuit board (PCB) electrically connected to the battery cell, the PCB being provided on a region where a circuit is connected with a conductive pattern including a fusing part, having relatively high resistance, configured to fuse itself for interrupting the flow of current when a large amount of current is conducted.

公开(公告)号：US08441797B2

公开(公告)日：2013-05-14

申请号：US12868798

申请日：2010-08-26

Applicant: Ryo Mochizuki

Inventor： Ryo Mochizuki

IPC: H05K1/14

CPC classification number: H05K1/141 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/142 ,  H05K1/181 ,  H05K3/0061 ,  H05K3/3405 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10189 ,  H05K2201/1028 ,  H05K2201/10409 ,  H05K2201/10446

Abstract: According to one embodiment, a module connection structure designed to connect a module to other modules. The module includes a dielectric layer, a micro-strip path, a projection, and a plurality of gain adjusting lands. The dielectric layer is formed on a substrate. The micro-strip path is provided on the dielectric layer and configured to transmit a transmission signal input to one end portion, to the other end portion. The projection is formed at edges of the substrate, which are adjacent to the other modules, and protruding from the micro-strip path and the dielectric layer toward the other modules. The plurality of gain adjusting lands is formed adjacent to the micro-strip path, for use in adjusting an input/output gain of the module. The gain adjusting lands uncouple from the micro-strip path or other gain adjusting lands couple to the micro-strip path, thereby to adjust the input/output gain of the module.

Abstract translation: 根据一个实施例，设计用于将模块连接到其他模块的模块连接结构。 该模块包括电介质层，微带路径，投影和多个增益调整区域。 介电层形成在基板上。 微带路径设置在电介质层上，并被配置为将输入到一个端部的传输信号传输到另一端部。 突起形成在与其他模块相邻的基板的边缘处，并且从微带路径和介电层向另一个模块突出。 多个增益调整区域形成为与微带路径相邻，用于调整模块的输入/输出增益。 增益调整平台从微带路径分离或其他增益调整平台耦合到微带路径，从而调整模块的输入/输出增益。

公开(公告)号：US08430690B2

公开(公告)日：2013-04-30

申请号：US13365004

申请日：2012-02-02

Applicant: Chun-Nan Su ,  Chun-Ching Peng

Inventor： Chun-Nan Su ,  Chun-Ching Peng

IPC: H01R13/65802

CPC classification number: H05K5/0278 ,  H01R13/6658 ,  H01R24/62 ,  H01R43/20 ,  H05K3/4015 ,  H05K2201/09754 ,  H05K2201/1028 ,  H05K2201/1056 ,  Y10T29/49139

Abstract: The present invention discloses a USB application device including a body, a circuit board, a plurality of first electrical pins and a plurality of electrical elements. The circuit board is disposed in the body. The plurality of first electrical pins are disposed on the circuit board and expended to the body such that the plurality of first electrical pins are partly exposed to the body. A space is formed between the plurality of first electrical pins and circuit board such that the plurality of electrical elements can be disposed on the space. The length of the circuit board therefore becomes shorter, and the volume of the USB application device is reduced.

Abstract translation: 本发明公开了一种USB应用设备，包括主体，电路板，多个第一电引脚和多个电元件。 电路板设置在体内。 多个第一电引脚设置在电路板上并消耗到主体，使得多个第一电引脚部分地暴露于主体。 在多个第一电引脚和电路板之间形成空间，使得多个电气元件可以设置在该空间上。 因此，电路板的长度变短，并且USB应用装置的体积减小。

公开(公告)号：US08256113B2

公开(公告)日：2012-09-04

申请号：US12467535

申请日：2009-05-18

Applicant: Peter A. Hochstein

Inventor： Peter A. Hochstein

IPC: H01R43/00 ,  H05K13/00

CPC classification number: F21V29/70 ,  F21K9/00 ,  F21V23/00 ,  F21V29/89 ,  G09F9/33 ,  H05K1/0203 ,  H05K1/053 ,  H05K1/056 ,  H05K3/202 ,  H05K3/305 ,  H05K2201/10106 ,  H05K2201/1028 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169

Abstract: A method of manufacturing an electrically driven L.E.D. lamp assembly (20) comprises disposing an electrically insulative coating (24) on a thermally conductive substrate (22). A plurality of light emitting diodes (26) is secured to the coating (24). A coupling agent is disposed on a tape portion (48) of a foil tape (46), and the foil tape (46) is secured to the coating (24) with the coupling agent in predetermined spaced lengths (42) along the coating (24) to establish discrete and electrically conductive spaced lengths (42) with the light emitting diodes (26) disposed between the spaced lengths (42). Each light emitting diode (26) includes a pair of electrical leads (32) which are secured to the spaced lengths (42) to electrically interconnect the light emitting diodes (26).

Abstract translation: 一种制造电驱动的L.E.D.的方法。 灯组件（20）包括在导热基板（22）上设置电绝缘涂层（24）。 多个发光二极管（26）固定到涂层（24）上。 耦合剂设置在箔带（46）的带部分（48）上，并且箔带（46）用耦合剂以沿着涂层的预定间隔长度（42）固定到涂层（24） 24），其中所述发光二极管（26）设置在所述间隔的长度（42）之间，以建立离散且导电的间隔的长度（42）。 每个发光二极管（26）包括一对电引线（32），其固定到间隔开的长度（42）以电连接发光二极管（26）。