公开(公告)号：US20050056457A1

公开(公告)日：2005-03-17

申请号：US10659884

申请日：2003-09-11

Applicant: Thomas Gall ,  Kevin Moore ,  Timothy Trento

Inventor： Thomas Gall ,  Kevin Moore ,  Timothy Trento

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: A flexible circuit board assembly comprising a flexible circuit board having a first portion and a second portion separated by a bendable region and a substantially rigid substrate having a first portion and a second portion separated by a bend region. The rigid substrate has an inside surface and an outside surface. The first and second portions of the circuit board are affixed to the respective first and second portions of the substrate such that when the substrate is bent the bendable region of the circuit board must also bend. The bend region has a recess extending outwardly from the inside surface of the substrate, and the recess is sized to accept the bendable region of the circuit board around a single bend axis when the substrate is bent. The recess provides for a larger bend radius of the circuit board reducing stress.

Abstract translation: 一种柔性电路板组件，包括具有第一部分和由可弯曲区域分开的第二部分的柔性电路板和具有由弯曲区域分开的第一部分和第二部分的基本上刚性的基板。 刚性基板具有内表面和外表面。 电路板的第一和第二部分固定到基板的相应的第一和第二部分，使得当基板弯曲时，电路板的可弯曲区域也必须弯曲。 弯曲区域具有从基板的内表面向外延伸的凹部，并且凹陷的尺寸设计成当基板弯曲时接受围绕单个弯曲轴线的电路板的可弯曲区域。 该凹槽提供了较大的电路板的弯曲半径以减小应力。

公开(公告)号：US06841739B2

公开(公告)日：2005-01-11

申请号：US10208942

申请日：2002-07-31

Applicant: Kevin D. Moore

Inventor： Kevin D. Moore

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K5/00

CPC classification number: H05K3/0014 ,  H05K1/0212 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09109 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract translation: 具有基本上刚性的基板（22）和电阻加热器迹线（24）的柔性电路板（20）。 基本刚性的基底（22）具有第一部分（26），第二部分（28）和弯曲区域（30）。 弯曲区域（30）将第一部分（26）和第二部分（28）互连。 电阻加热器迹线（24）形成在基板（22）的弯曲区域（30）上。 基板（22）的第一部分（26）能够相对于基板（22）的第二部分（28）折叠，以在弯曲区域（30）中形成至少一个弯曲部（72,172），当弯曲区域 向加热器迹线（24）施加电流。 还有一个包括柔性电路板（20）的电子控制单元（60,160）和组装电子控制单元（60,160）的方法。

公开(公告)号：US20040178486A1

公开(公告)日：2004-09-16

申请号：US10752521

申请日：2004-01-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takenobu Maeda

IPC: H01L023/02

CPC classification number: H05K1/0271 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/328 ,  H05K2201/10416 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2201/2045 ,  H05K2203/0285 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014

Abstract: In an electronic component device, electrodes of an electric component and respective wiring lines on a board are collectively bonded together via bumps using ultrasonic vibration. The wiring lines include wiring lines that are substantially parallel to the direction of ultrasonic vibration and wiring lines that are substantially perpendicularly to the direction of ultrasonic vibration. A displacement inhibiting layer is provided inside the board in a portion below the wiring lines that are substantially perpendicular to the direction of ultrasonic vibration.

Abstract translation: 在电子部件装置中，电子部件的电极和板上的各布线通过使用超声波振动的凸块共同地接合在一起。 布线包括基本上平行于超声波振动方向的布线和基本上垂直于超声波振动方向的布线。 在基板垂直于超声波振动的方向的布线下方的部分设置有位移抑制层。

公开(公告)号：US20040174663A1

公开(公告)日：2004-09-09

申请号：US10778167

申请日：2004-02-17

Inventor： Akinori Itokawa

IPC: H02B001/00

CPC classification number: H05K1/147 ,  H05K1/142 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/2009

Abstract: To provide a flexible wired circuit board having a fine-pitch conductor wiring pattern that can be produced with a high yield rates and improved productivity, a first flexible wired circuit board and a second flexible wired circuit board are disposed to be adjacent to each other on a supporting board so that a first connection terminal and a second connection terminal are connected to a same electronic component. This flexible wired circuit board can provide the result that when a defect incurs in the first flexible wired circuit board in the production process in which the first conductor wiring pattern of the first flexible wired circuit board is formed into the fine pitch, only the first flexible wired circuit board having the defect can be screened out as a defective product, in other words, the first flexible wired circuit board having no defects can be selected for combination with the second flexible wired circuit board. Thus, the flexible wired circuit board can be produced in a high yield rates of non-defective flexible wired circuit board and with improved productivity on the whole.

Abstract translation: 为了提供一种柔性布线电路板，具有可以以高产率和提高的生产率制造的细间距导体布线图案，第一柔性布线电路板和第二柔性布线电路板彼此相邻设置在 支撑板，使得第一连接端子和第二连接端子连接到相同的电子部件。 这种柔性布线电路板可以提供这样的结果：当在第一柔性布线电路板的第一导体布线图案形成为细间距的生产过程中，当第一柔性布线电路板出现缺陷时，只有第一柔性布线电路板 可以将具有缺陷的布线电路板作为缺陷产品进行筛选，换句话说，可以选择不具有缺陷的第一柔性布线电路板与第二柔性布线电路板组合。 因此，柔性布线电路板可以以高产率的无缺陷柔性布线电路板生产，并且整体上提高生产率。

公开(公告)号：US20040164429A1

公开(公告)日：2004-08-26

申请号：US10698452

申请日：2003-11-03

Applicant: ADVANCED DISPLAY INC.

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: H01L023/48

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

Abstract translation: 一种芯片载体膜，包括形成在基膜的表面上的金属布线，覆盖除了半导体芯片连接焊盘部分之外的金属布线的第一绝缘膜和端子连接焊盘部分，连接到半导体芯片连接焊盘部分的半导体芯片 的金属布线并安装在基膜上，第二绝缘膜形成在基膜的背面上，并且具有与第一绝缘膜的固化收缩率不同的固化收缩系数。 可以获得一种芯片载体膜，其能够防止当通过输送装置保持基膜时半导体芯片的自重产生基膜的悬浮，并且无障碍地进行安装。

公开(公告)号：US20040149489A1

公开(公告)日：2004-08-05

申请号：US10477277

申请日：2003-11-12

Inventor： Frederic Ferrando ,  Philippe Clot ,  Jean-Paul Racault

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H01L23/562 ,  H01L21/563 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/4611 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention concerns an electronic module comprising: a printed circuit (10) including a flexible or semirigid substrate (12) provided with an array of strip conductors (14) deposited on each of its sides and with a plurality of contact pads (16) deposited on its upper side and connected to its array of conductor strips; at least an electronic chip (18), provided on its active surface with conductive bumps (20) respectively pressed on the contact pads; and a non-conductive adhesive layer (22) assembling the substrate and the chip. To avoid deformation of the module when the chip is being fixed by application of temperature and pressure, the substrate (12) is provided, on its lower side, with a plurality of reinforcing regions (24) arranged each opposite the contact pads (16).

Abstract translation: 本发明涉及一种电子模块，包括：印刷电路（10），其包括柔性或半刚性衬底（12），其设置有沉积在其每一侧上的条状导体阵列（14）和多个沉积的接触焊盘（16） 在其上侧并连接到其阵列的导体条; 至少一个电子芯片（18），其在其有效表面上设置有分别压在接触垫上的导电凸块（20）; 和组装衬底和芯片的非导电粘合剂层（22）。 为了避免在通过施加温度和压力固定芯片时模块的变形，衬底（12）在其下侧上设置有与接触焊盘（16）相对布置的多个加强区域（24） 。

公开(公告)号：US06740966B2

公开(公告)日：2004-05-25

申请号：US09799550

申请日：2001-03-07

Applicant: Nakae Nakamura

Inventor： Nakae Nakamura

IPC: H01L23053

CPC classification number: H05K3/0097 ,  H01L21/4821 ,  H01L23/49565 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K3/007 ,  H05K2201/2009 ,  H05K2203/0156 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A semiconductor apparatus includes a thin film belt-like insulating tape having a plurality of predetermined wire patterns thereon, and a plurality of IC chips that are provided on a surface of the insulating tape at uniform spaces in a lengthwise direction and electrically connected with the wire patterns, and further includes thick film reinforcing tapes with sprocket holes for transport use provided at uniform spaces, the reinforcing tapes being provided on both side portions of the insulating tape, in the lengthwise direction.

Abstract translation: 半导体装置包括其上具有多个预定线图案的薄膜带状绝缘带，以及多个IC芯片，其沿长度方向均匀地设置在绝缘带的表面上并与导线电连接 并且还包括具有用于传送用途的链轮孔的厚膜加强带，其设置在均匀的空间处，加强带在长度方向上设置在绝缘带的两侧部分上。

公开(公告)号：US20040046244A1

公开(公告)日：2004-03-11

申请号：US10649745

申请日：2003-08-28

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Jyunichi Nakamura ,  Tadashi Kodaira ,  Shunichiro Matsumoto ,  Hironari Aratani ,  Takanori Tabuchi ,  Takeshi Chino

IPC: H01L023/053 ,  H01L023/12

CPC classification number: H05K3/0061 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/205 ,  H05K3/3457 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2203/1536

Abstract: A multilayered substrate for a semiconductor device, which has a multilayered substrate body formed of a plurality sets of a conductor layer and an insulation layer, and having a face for mounting a semiconductor element thereon and another face for external connection terminals, the face for mounting a semiconductor device being provided with pads through which the substrate is connected to a semiconductor element to be mounted thereon, and the face for external connection terminals being provided with pads through which the substrate is connected to an external electrical circuit, wherein a reinforcing sheet is respectively joined to the face for mounting a semiconductor element thereon and the face for external connection terminals of the multilayered substrate body.

公开(公告)号：US06700074B2

公开(公告)日：2004-03-02

申请号：US10012796

申请日：2001-10-19

Applicant: Kurt Michel ,  Stefan Ehmann ,  Roland Friedl ,  Günter Bauer

Inventor： Kurt Michel ,  Stefan Ehmann ,  Roland Friedl ,  Günter Bauer

IPC: H05K116

CPC classification number: H05K3/0064 ,  H05K1/141 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/09127 ,  H05K2201/10598 ,  H05K2201/2009 ,  H05K2201/2018 ,  H05K2203/1327 ,  H05K2203/167 ,  H05K2203/302

Abstract: The invention provides a carrier housing assembly holding a flexible foil having conductive tracks in which the housing assembly has a plurality of parts each having a respective securing mechanism, the securing mechanisms being mutually engageable to provide a predetermined spatial relationship between the part, thereby providing the flexible foil with a predetermined spatial arrangement. The housing assembly is particularly relevant to component housing assemblies where electrical components are held in place and connected to connecter pins via the flexible foil. In a further aspect of the invention, there is provided methods for manufacturing a foil carrier housing assembly out of a flexible foil comprising conductive tracks at least one electrical component, at least one electrical contact element, at least one component housing and a carrier housing.

Abstract translation: 本发明提供一种承载壳体组件，其保持具有导电轨道的柔性箔，其中壳体组件具有多个部件，每个部件各自具有相应的固定机构，所述固定机构可相互接合以在部件之间提供预定的空间关系， 具有预定空间布置的柔性箔。 壳体组件与部件壳体组件特别相关，其中电气部件保持就位并通过柔性箔片连接到连接器销。 在本发明的另一方面，提供了用于从柔性箔制造箔载体壳体组件的方法，所述柔性箔包括至少一个电气部件，至少一个电接触元件，至少一个部件壳体和载体壳体的导电轨道。

公开(公告)号：US20040020687A1

公开(公告)日：2004-02-05

申请号：US10208942

申请日：2002-07-31

Inventor： Kevin D. Moore

IPC: H05B001/00

CPC classification number: H05K3/0014 ,  H05K1/0212 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09109 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract translation: 具有基本上刚性的基板（22）和电阻加热器迹线（24）的柔性电路板（20）。 基本刚性的基底（22）具有第一部分（26），第二部分（28）和弯曲区域（30）。 弯曲区域（30）将第一部分（26）和第二部分（28）互连。 电阻加热器迹线（24）形成在基板（22）的弯曲区域（30）上。 基板（22）的第一部分（26）能够相对于基板（22）的第二部分（28）折叠，以在弯曲区域（30）中形成至少一个弯曲部（72,172），当弯曲区域 向加热器迹线（24）施加电流。 还有一个包括柔性电路板（20）的电子控制单元（60,160）和组装电子控制单元（60,160）的方法。