公开(公告)号：US20040085505A1

公开(公告)日：2004-05-06

申请号：US10691736

申请日：2003-10-23

Applicant: Advanced Display Inc.

Inventor： Hitoshi Morishita ,  Hiroshi Ueda

IPC: G02F001/1345

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/3511 ,  H05K3/3494 ,  H05K2203/0165 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01028 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/0401

Abstract: A display including: a scan line for driving pixels formed on an insulating substrate; a signal line which crosses the scan line; and a driving circuit connected to the signal line and, in a region other than a display region constructed by the pixels, directly mounted on the insulating substrate. A warp amount of a portion corresponding to the region in which the circuit is mounted, in a face opposite to the side of insulating substrate, on which the driving circuit is mounted, is 2 nullm or less. The warp amount of the insulating substrate, which occurs when the driving circuit is directly mounted on a terminal on the insulating substrate, is set to 2 nullm or less, and the display realizing suppressed luminance nonuniformity and high display quality can be obtained.

Abstract translation: 一种显示器，包括：用于驱动形成在绝缘基板上的像素的扫描线; 穿过扫描线的信号线; 以及连接到信号线的驱动电路，并且在由像素构成的显示区域以外的区域中直接安装在绝缘基板上。 与安装有电路的区域对应的部分的翘曲量为2μm以下，与绝缘基板的与安装驱动电路的面相反的面。 将驱动电路直接安装在绝缘基板的端子上时发生的绝缘基板的弯曲量设定为2μm以下，可以获得实现抑制的亮度不均匀性和高显示质量的显示。

公开(公告)号：US20040164429A1

公开(公告)日：2004-08-26

申请号：US10698452

申请日：2003-11-03

Applicant: ADVANCED DISPLAY INC.

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: H01L023/48

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

Abstract translation: 一种芯片载体膜，包括形成在基膜的表面上的金属布线，覆盖除了半导体芯片连接焊盘部分之外的金属布线的第一绝缘膜和端子连接焊盘部分，连接到半导体芯片连接焊盘部分的半导体芯片 的金属布线并安装在基膜上，第二绝缘膜形成在基膜的背面上，并且具有与第一绝缘膜的固化收缩率不同的固化收缩系数。 可以获得一种芯片载体膜，其能够防止当通过输送装置保持基膜时半导体芯片的自重产生基膜的悬浮，并且无障碍地进行安装。

公开(公告)号：US20020047133A1

公开(公告)日：2002-04-25

申请号：US09902154

申请日：2001-07-11

Applicant: ADVANCED DISPLAY INC.

Inventor： Kouki Nakahara ,  Hitoshi Morishita

IPC: H01L023/495 ,  H01L021/50 ,  H01L023/02

CPC classification number: H05K1/0281 ,  G02F1/13452 ,  H01L23/4985 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K3/28 ,  H05K3/361 ,  H05K2201/0125 ,  H05K2201/09909 ,  H05K2201/10681 ,  H05K2201/2009

Abstract: A chip carrier film comprising a metal wiring formed on a surface of a base film, a first insulating film covering the metal wiring excluding a semiconductor chip connecting pad portion and a terminal connecting pad portion, a semiconductor chip connected to the semiconductor chip connecting pad portion of the metal wiring and mounted on the base film, and a second insulating film formed on a back face of the base film and having a different coefficient of curing shrinkage from that of the first insulating film. It is possible to obtain a chip carrier film capable of preventing the suspension of the base film from being generated by the self weight of the semiconductor chip when holding the base film by the delivery device and of carrying out mounting without a hindrance.

Abstract translation: 一种芯片载体膜，包括形成在基膜的表面上的金属布线，覆盖除了半导体芯片连接焊盘部分之外的金属布线的第一绝缘膜和端子连接焊盘部分，连接到半导体芯片连接焊盘部分的半导体芯片 的金属布线并安装在基膜上，第二绝缘膜形成在基膜的背面上，并且具有与第一绝缘膜的固化收缩率不同的固化收缩系数。 可以获得一种芯片载体膜，其能够防止当通过输送装置保持基膜时半导体芯片的自重产生基膜的悬浮，并且无障碍地进行安装。

公开(公告)号：US20040207796A1

公开(公告)日：2004-10-21

申请号：US10821885

申请日：2004-04-12

Applicant: ADVANCED DISPLAY INC.

Inventor： Hitoshi Morishita ,  Hiroshi Ueda ,  Hirofumi Iwanaga ,  Shigeaki Noumi ,  Takehisa Yamaguchi

IPC: G02F001/1345

CPC classification number: G02F1/13452

Abstract: The display device includes the lead line connected to pixels, the line terminal connected to the lead line and connected to the terminal of the drive circuit mounted directly on the insulating substrate by the conductive material through the transparent conductive film, the external terminal to be connected to an external unit, an external line connected to the external terminal, and an external line terminal connected to the external line and connected directly to the terminal of the drive circuit by the conductive material. The surface of the line terminal to be connected to the transparent conductive film is formed by the high resistance conductive film, and the surface of the external line terminal to be connected to the terminal of the drive circuit by the conductive material is formed by the low resistance conductive film.

Abstract translation: 显示装置包括连接到像素的引线，线端子连接到引线并且通过导电材料通过透明导电膜直接连接到直接安装在绝缘基板上的驱动电路的端子，待连接的外部端子 连接到外部单元的外部线路和连接到外部线路并通过导电材料直接连接到驱动电路的端子的外部线路端子。 要连接到透明导电膜的线路终端的表面由高电阻导电膜形成，并且通过导电材料连接到驱动电路的端子的外部线路端子的表面由低 电阻导电膜。

公开(公告)号：US20040150765A1

公开(公告)日：2004-08-05

申请号：US10625511

申请日：2003-07-24

Applicant: ADVANCED DISPLAY INC.

Inventor： Hiroshi Ueda ,  Hitoshi Morishita

IPC: G02F001/1333

CPC classification number: G02F1/13452 ,  G02F1/1309

Abstract: A display apparatus has an insulating substrate, a signal line for transmitting a signal to a pixel formed in a display area on the insulating substrate, a driver integrated circuit (IC) mounted outside of the display area of the insulating substrate and electrically connected to the signal line, and an inspection pad formed outside of the display area and electrically connected to the signal line. The inspection pad is covered with resin.

Abstract translation: 显示装置具有绝缘基板，用于将信号发送到形成在绝缘基板上的显示区域中的像素的信号线，驱动器集成电路（IC），其安装在绝缘基板的显示区域的外部并电连接到 信号线，以及形成在显示区域外部并与信号线电连接的检查焊盘。 检查垫用树脂覆盖。

公开(公告)号：US20010020996A1

公开(公告)日：2001-09-13

申请号：US09778812

申请日：2001-02-08

Applicant: ADVANCED DISPLAY INC.

Inventor： Hiroshi Ueda ,  Hitoshi Morishita

IPC: G02F001/1345

CPC classification number: H05K3/361 ,  G02F1/1345 ,  H05K1/117 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427

Abstract: The present invention is directed to a liquid crystal display including: a plurality of electrode terminals arranged on one of end faces of a TFT glass substrate in such a manner as to be aligned on an imaginary line; and a plurality of lead terminals of a tape carrier package aligned on the electrode terminals, said plurality of lead terminals connected through an anisotropic conductive film; wherein the electrode terminals near the end face of the glass substrate is formed obliquely in such a manner as to be extended in the direction of both right and left with respect to the plurality of electrode terminals.

Abstract translation: 本发明涉及一种液晶显示器，它包括：多个电极端子，以在假想线上对齐的方式设置在TFT玻璃基板的一个端面上; 以及在所述电极端子上排列的带状载体封装体的多个引线端子，所述多个引线端子通过各向异性导电膜连接; 其中靠近玻璃基板的端面的电极端子以相对于多个电极端子在左右两个方向上延伸的方式倾斜地形成。