公开(公告)号：US20170135200A1

公开(公告)日：2017-05-11

申请号：US15296051

申请日：2016-10-18

Applicant: Sercomm Corporation

Inventor： Cheng-Chung Chang ,  Yuan-Long Li

IPC: H05K1/02 ,  F16B2/22

CPC classification number: H05K1/0216 ,  F16B2/22 ,  H05K3/301 ,  H05K3/3447 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: A shielding clip and an electronic device are provided. The electronic device includes a circuit board, an electronic element, a shielding cover and the shielding clip. The shielding clip comprises a bottom plate parallel to the circuit board. The bottom plate has a first side region and a second side region. The first side region has a first pin extending into the circuit board and a first buckle plate extending away from the circuit board to buckle the shielding cover. The second side region has a second pin extending into the circuit board and a second buckle plate extending away from the circuit board to buckle the shielding cover.

公开(公告)号：US09642256B2

公开(公告)日：2017-05-02

申请号：US14503451

申请日：2014-10-01

Applicant: Deere & Company

Inventor： Pablo G. Olivieri ,  Sushil Khandelwal ,  Stephen Piltingsrud ,  Mark D. Schmaltz

IPC: H05K1/00 ,  H05K7/20 ,  H05K1/14

CPC classification number: H05K1/144 ,  H05K7/20445 ,  H05K2201/042 ,  H05K2201/10166 ,  H05K2201/2018

Abstract: An electronic assembly comprises a first circuit board with a first substrate having an inner side and an outer side opposite the inner side. A plurality of primary components are mounted on the inner side of the first circuit board. A frame (e.g., or heat-sinking spacer) is secured to the first circuit board. A second circuit board comprises a second substrate having an inner side and an outer side opposite the first side. The second circuit board is secured to the frame and separated from the first circuit board in at least one spatial dimension. At least one secondary component is mounted on the second circuit board. A first housing section is adapted for mating with a second housing section. The first housing section and the second housing section collectively enclose the first circuit board and the second circuit board.

公开(公告)号：US20170105278A1

公开(公告)日：2017-04-13

申请号：US14881915

申请日：2015-10-13

Applicant: GOOGLE INC.

Inventor： James Cooper ,  Joshua Norman Lilje

IPC: H05K1/02 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

公开(公告)号：US09552848B2

公开(公告)日：2017-01-24

申请号：US14182303

申请日：2014-02-18

Applicant: Rogelio Gazmen Mangay-Ayam, Jr. ,  Elbert Castro Esguerra ,  Jerico Alge Parazo ,  Christopher Dayego Galvez ,  Allan Famitanco Cruz

Inventor： Rogelio Gazmen Mangay-Ayam, Jr. ,  Elbert Castro Esguerra ,  Jerico Alge Parazo ,  Christopher Dayego Galvez ,  Allan Famitanco Cruz

IPC: H05K5/00 ,  H05K7/00 ,  H05K1/14 ,  G11C5/04 ,  H05K7/14 ,  H05K9/00

CPC classification number: G11C5/04 ,  H05K1/144 ,  H05K5/0008 ,  H05K5/0069 ,  H05K7/1417 ,  H05K9/0066 ,  H05K2201/2018

Abstract: The present invention pertains to a hard disk drive form factor compatible solid-state storage device enclosure assembly that protects circuit boards contained within the enclosure from environmental disruption, such as mechanical stress, vibration, external electronic disruption, or any combination of these, while allowing for a variable number of circuit boards in the SSD enclosure. In another embodiment, the solid-state storage device enclosure assembly, or a similar circuit board assembly, includes an alignment guide that precludes a circuit board from being misaligned within the enclosure.

Abstract translation: 本发明涉及一种硬盘驱动器形状因素兼容的固态存储设备外壳组件，其保护包含在外壳内的电路板免受诸如机械应力，振动，外部电子破坏或这些的任何组合之类的环境破坏，同时允许 适用于SSD外壳中可变数量的电路板。 在另一个实施例中，固态存储设备外壳组件或类似的电路板组件包括排除电路板在外壳内不对准的对准引导件。

公开(公告)号：US09474179B2

公开(公告)日：2016-10-18

申请号：US14821680

申请日：2015-08-07

Applicant: Panasonic Corporation

Inventor： Yukitoshi Ota ,  Fumito Itou ,  Kiyomi Hagihara

IPC: H05K5/02 ,  H05K5/00 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K5/0247 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/5384 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H05K1/141 ,  H05K1/181 ,  H05K5/0004 ,  H05K2201/2018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is an electronic component package that does not lower reliability while enabling miniaturization and high performance of the electronic component package. The electronic component package includes a main substrate, a first electronic component provided on a main surface of the main substrate, a frame body disposed so as to face the main surface of the main substrate, and a first connection terminal and a second connection terminal disposed on the main surface of the main substrate along a first side of the frame body. The second connection terminal is disposed on the first side of the frame body at a position facing a vicinity of a midpoint of a side of the first electronic component, and the second connection terminal has an area larger than an area of the first connection terminal.

Abstract translation: 提供一种电子部件封装，其不会降低可靠性，同时能够实现电子部件封装的小型化和高性能化。 电子部件封装包括主基板，设置在主基板的主表面上的第一电子部件，与主基板的主面相对配置的框体，以及设置在第一连接端子和第二连接端子 在主体基板的主表面上沿着框体的第一侧。 第二连接端子在面向第一电子部件侧的中点附近的位置处配置在框体的第一侧，第二连接端子的面积大于第一连接端子的面积。

公开(公告)号：US09462709B2

公开(公告)日：2016-10-04

申请号：US14407557

申请日：2013-09-26

Applicant: KYOCERA Corporation

Inventor： Yoshiki Kawazu

IPC: H01L23/055 ,  H05K1/18 ,  H05K5/02 ,  H05K5/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K5/0091 ,  H01L23/055 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/115 ,  H05K1/116 ,  H05K1/181 ,  H05K5/0239 ,  H05K5/0247 ,  H05K2201/093 ,  H05K2201/09627 ,  H05K2201/09718 ,  H05K2201/2018 ,  H01L2924/00

Abstract: An element housing package includes a substrate, a frame body, and an input-output terminal. The input-output terminal has a wiring conductor formed in a stacked body consisting of dielectric layers and ground layers which are alternately laminated, to extend through an inside of the stacked body, and a lead terminal connected to the wiring conductor. A non-formation region is provided in the ground layers around the wiring conductor, which passes through the inside of the input-output terminal in a vertical direction of the stacked body. The non-formation region has, in order from an upper side toward a lower side, a first non-formation section, a second non-formation section having an area smaller than that of the first non-formation section, and a third non-formation section having an area larger than that of the second non-formation section.

Abstract translation: 元件外壳包装件包括基板，框体和输入 - 输出端子。 输入输出端子具有形成在层叠体中的布线导体，该堆叠体由交替层叠的电介质层和接地层构成，以延伸穿过层叠体的内部，以及引线端子与布线导体连接。 在布线导体周围的接地层中设置非形成区域，该布线导体在层叠体的垂直方向上穿过输入输出端子的内部。 非形成区域具有从上侧朝向下侧的顺序，具有第一非形成部，具有比第一非成形部的面积小的面积的第二非成形部， 形成部具有比第二非成形部的面积大的面积。

公开(公告)号：US20160286648A1

公开(公告)日：2016-09-29

申请号：US15180101

申请日：2016-06-13

Applicant: E Ink Holdings Inc.

Inventor： Chun-Wei CHU

IPC: H05K1/14 ,  H05K5/03 ,  H05K7/14 ,  H05K5/00

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/028 ,  H05K2201/042 ,  H05K2201/10128 ,  H05K2201/2018

Abstract: An electronic apparatus includes a frame, at least one circuit board, at least one hardware device, and at least one first connector. The frame includes a first frame body and a second frame body. The first frame body includes a first wire therein. The circuit board includes a first edge and a second, and at least a portion of the circuit board is flexible. The first edge is connected to the first frame body. The second edge is connected to the second frame body. The circuit board is electrically connected to the first wire. The hardware device is disposed on the circuit board. The first frame body includes a first inner surface, and the first connector is disposed on the first inner surface and electrically connected to the first wire, and the first edge of the circuit board is plugged in the first connector.

Abstract translation: 电子设备包括框架，至少一个电路板，至少一个硬件设备和至少一个第一连接器。 框架包括第一框体和第二框体。 第一框体包括第一线。 电路板包括第一边缘和第二边缘，并且电路板的至少一部分是柔性的。 第一边缘连接到第一框架体。 第二边缘连接到第二框体。 电路板电连接到第一线。 硬件设备设置在电路板上。 第一框体包括第一内表面，第一连接器设置在第一内表面上并电连接到第一线，并且电路板的第一边缘插入第一连接器中。

公开(公告)号：US09433095B2

公开(公告)日：2016-08-30

申请号：US14482498

申请日：2014-09-10

Applicant: International Business Machines Corporation

Inventor： Aaron M. Hegrenes ,  Nathan D. Karl ,  Robert J. Monahan ,  Stephen P. Mroz ,  Christopher L. Tuma

IPC: H05K5/00 ,  H05K1/14 ,  H05K3/36 ,  H05K13/00 ,  G06F1/18 ,  H05K7/14

CPC classification number: H05K1/144 ,  G06F1/18 ,  G06F1/183 ,  H05K3/36 ,  H05K7/142 ,  H05K7/1487 ,  H05K13/00 ,  H05K2201/042 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49828

Abstract: A method and apparatus are provided for implementing simultaneously connecting of multiple devices in a multi-tiered, multi-directional, enhanced tolerance system with mechanical support structures. A main system planar assembly and an elevated planar assembly share a direct connection provided by a plurality of connectors with no cables. A mechanical support bracket is attached to a top surface of the main system planar assembly positioning and supporting the elevated planar assembly spaced appropriately for accurately connecting respective connectors with respective chassis connectors. The elevated planar assembly includes a stiffening component to facilitate proper spacing between upper and lower levels of respective connectors and tool-less insertion and extraction of the elevated planar assembly.

Abstract translation: 提供了一种方法和装置，用于在具有机械支撑结构的多层，多方向，增强的公差系统中同时连接多个装置。 主系统平面组件和升高的平面组件共享由没有电缆的多个连接器提供的直接连接。 机械支撑支架附接到主系统平面组件的顶表面，其定位和支撑提升的平面组件，适当地间隔开以将相应的连接器精确地连接到相应的底盘连接器。 升高的平面组件包括加强部件，以促进相应连接器的上层和下层之间的适当间隔，并且无需工具的插入和拔出升高的平面组件。

公开(公告)号：US20160165755A1

公开(公告)日：2016-06-09

申请号：US14561663

申请日：2014-12-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Paul F. BODENWEBER ,  Kenneth C. MARSTON ,  Kamal K. SIKKA ,  Hilton T. TOY ,  Randall J. WERNER ,  Jeffrey A. ZITZ

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  G06F1/203 ,  H01L23/34 ,  H01L23/3672 ,  H01L23/46 ,  H01L23/467 ,  H01L23/473 ,  H01L35/30 ,  H05K1/181 ,  H05K7/20254 ,  H05K7/20272 ,  H05K2201/2018

Abstract: A cooling structure for large electronic boards with closely-spaced heterogeneous die and packages is disclosed. The assembly includes a frame having a plurality of openings. The assembly further includes a cold plate mounted to the frame. The cold plate includes at least one inlet and at least one outlet and fluid channels in communication with the at least one inlet and the at least one outlet. The assembly further includes a heat sink mounted within each of the plurality of openings which in combination with sidewalls of the openings of the frame and the cold plate form individual compartments each of which are in fluid communication with the fluid channels.

Abstract translation: 公开了一种具有紧密间隔异种模具和封装的大型电子板的冷却结构。 组件包括具有多个开口的框架。 组件还包括安装到框架的冷板。 冷板包括与至少一个入口和至少一个出口连通的至少一个入口和至少一个出口和流体通道。 组件还包括安装在多个开口中的每一个内的散热器，其结合框架的开口的侧壁和冷板形成各自与流体通道流体连通的各个隔室。

公开(公告)号：US09363884B2

公开(公告)日：2016-06-07

申请号：US14072199

申请日：2013-11-05

Applicant: Huawei Device Co., Ltd.

Inventor： Jun Yang ,  Liechun Zhou ,  Hualin Li ,  Xijie Wu

IPC: H05K7/20 ,  H05K1/02 ,  H05K9/00 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/0204 ,  H01L23/552 ,  H01L24/18 ,  H05K1/0216 ,  H05K7/20472 ,  H05K9/003 ,  H05K2201/0715 ,  H05K2201/2018 ,  Y02D70/122 ,  Y10T428/264 ,  Y10T428/30 ,  Y10T428/31504 ,  Y10T428/31678

Abstract: A composite material and an electronic device are disclosed in embodiments of the present invention, relating to the field of electronic assembly technologies. The technical problem of the existing electronic device with an excessively complicated internal structure is solved. The composite material includes an electrically and thermally conductive layer, a viscose glue layer, and an insulating layer, where the electrically and thermally conductive layer and the insulating layer are pasted at two sides of the viscose glue layer; the viscose glue layer is electrically conductive. The electronic device includes a circuit board and the composite material. Gaps are formed at the insulating layer in positions corresponding to electronic components and/or shielding frames, with the viscose glue layer exposed, the composite material is pasted onto the electronic components and/or the shielding frames via the viscose glue layer. The present invention is applied to simplify the structure of an electronic device.

Abstract translation: 在本发明的实施例中公开了与电子组装技术领域有关的复合材料和电子装置。 解决了内部结构过于复杂的现有电子设备的技术问题。 复合材料包括导电导热层，粘胶层和绝缘层，其中导电层和绝缘层粘贴在粘胶层的两侧; 粘胶胶层是导电的。 电子设备包括电路板和复合材料。 在对应于电子部件和/或屏蔽框架的位置的绝缘层处形成间隙，粘胶层露出，复合材料通过粘胶胶层粘贴到电子部件和/或屏蔽框架上。 本发明应用于简化电子设备的结构。