公开(公告)号：US09105987B2

公开(公告)日：2015-08-11

申请号：US13917706

申请日：2013-06-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H05K1/09 ,  H01R4/02 ,  B23K35/02 ,  B23K35/26 ,  B23K35/30 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C19/03 ,  C22C22/00 ,  H05K3/34 ,  C22C1/04

CPC classification number: H01R4/02 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/36 ,  C22C1/0425 ,  C22C9/02 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C19/03 ,  C22C22/00 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A connection structure that includes a region where at least a Cu—Sn intermetallic compound, a M-Sn intermetallic compound and a Cu-M-Sn intermetallic compound (where M is Ni and/or Mn) exist in a cross-section of a connecting part when the cross-section of the connecting part is analyzed with a WDX. Further, the connection structure is configured so that when the cross-section of the connecting part is evenly divided into ten sections in a vertical direction and a lateral direction, respectively, to form 100 segmentalized squares in total, a ratio of the number of squares in which two or more kinds of intermetallic compounds having different constituent elements exist to the number of all the squares, except for squares in which only a Sn-based metal component exists, is 70% or more.

Abstract translation: 一种连接结构，其包括至少Cu-Sn金属间化合物，M-Sn金属间化合物和Cu-M-Sn金属间化合物（其中M为Ni和/或Mn）的区域存在于 用WDX分析连接部分的横截面时的连接部分。 此外，连接结构被构造成使得当连接部分的横截面分别在垂直方向和横向方向上被均匀地分成十个部分以形成总共100个分段平方时，平方的比例 除了存在仅Sn基金属成分的正方形以外，所有正方形的数量存在两种以上具有不同构成元素的金属间化合物的比例为70％以上。

公开(公告)号：US20150176147A1

公开(公告)日：2015-06-25

申请号：US14409621

申请日：2013-06-25

Applicant: INSTITUTT FOR ENERGITEKNIKK

Inventor： Henrik Høyer ,  Arne Torbørn Skjeltorp ,  Mark Buchanan ,  Matti Knaapila ,  Geir Helgesen

IPC: C25D13/00 ,  H05K1/03 ,  H05K1/09

CPC classification number: C25D13/00 ,  H01F1/28 ,  H01F1/375 ,  H01F1/447 ,  H01F7/0221 ,  H01F13/003 ,  H05K1/0353 ,  H05K1/092 ,  H05K2201/0272 ,  Y10T428/249921

Abstract: The invention relates to a method for forming a body comprising a particle structure fixated in a matrix material, comprising—Providing an amount of particles,—Providing a viscous matrix material to include said particles—Forming a particle structure of at least a portion of said amount of particles—Fixating said viscous matrix so as to fixate said particle structure in the matrix material characterised by at least a portion of said amount of particles being paramagnetic or ferromagnetic, and the formation of the particle structure includes the steps of: - Subjecting the particles to a first field, so as to arrange at least a portion of said particles into particle assemblies, each particle assembly comprising a plurality of particles and extending along a flux direction of said first field, and—Subjecting the particle assemblies to a second field, so as to move and/or rotate said particle assemblies along a flux direction of said second field,—wherein one of said first and second fields is a magnetic field, and the other of said first and second fields is an electric field, or a magnetic field having a different flux direction than said one magnetic field. The invention also relates to a body obtained by said method, and to the use of said method in various applications.

Abstract translation: 本发明涉及一种用于形成本体的方法，该方法包括固定在基质材料中的颗粒结构，包括 - 提供一定量的颗粒 - 提供粘性基质材料以包括所述颗粒 - 形成所述颗粒结构的至少一部分 颗粒数量 - 固定所述粘性基质以将所述颗粒结构固定在基质材料中，其特征在于所述量的至少一部分颗粒是顺磁性或铁磁性的，并且所述颗粒结构的形成包括以下步骤： - 使 颗粒到第一场，以便将至少一部分所述颗粒排列成颗粒组件，每个颗粒组件包括多个颗粒并沿着所述第一场的通量方向延伸，以及 - 将颗粒组件置于第二场 以便沿着所述第二场的磁通方向移动和/或旋转所述粒子组件，其中所述第一和第二磁场之一 第二场是磁场，并且所述第一和第二场中的另一场是电场或具有不同于所述一个磁场的通量方向的磁场。 本发明还涉及通过所述方法获得的身体以及在各种应用中使用所述方法。

公开(公告)号：US20150053753A1

公开(公告)日：2015-02-26

申请号：US14389668

申请日：2012-03-30

Applicant: Teruo Komatsu ,  Ryo Matsubayashi

Inventor： Teruo Komatsu ,  Ryo Matsubayashi

IPC: B23K35/02 ,  B23K35/36 ,  B23K1/20 ,  B23K35/30

CPC classification number: B23K35/025 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B23K1/20 ,  B23K35/302 ,  B23K35/3612 ,  H01B1/026 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0272

Abstract: The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property.The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

Abstract translation: 本发明解决了提供价格相对低廉并且在结合特性，导热性和电性能方面优异的复合纳米金属糊的问题。 本发明是一种含有铜填料的复合纳米金属浆料，其含有复合纳米金属颗粒，每个复合纳米金属颗粒均包含金属芯和形成在其上的有机涂层。 金属糊包含铜填料，在有机涂层的热分解温度中含有与第一复合纳米金属颗粒不同的第一复合纳米金属颗粒和第二复合纳米金属颗粒作为粘合剂，其中有机涂层的质量比例W1 第一复合纳米金属颗粒中的层在2-13质量％的范围内，第二复合纳米金属颗粒中的有机涂层的质量比例W2在5〜25质量％的范围内，并且这些颗粒满足关系 W1。

公开(公告)号：US20140368963A1

公开(公告)日：2014-12-18

申请号：US14374047

申请日：2013-01-22

Applicant: TDK CORPORATION

Inventor： Shingo Suzuki ,  Kensaku Asakura ,  Takahiro Fujimori

IPC: H05F3/04

CPC classification number: H05F3/04 ,  H01T4/08 ,  H01T4/10 ,  H05K1/026 ,  H05K2201/0175 ,  H05K2201/0272 ,  H05K2201/09736 ,  H05K2201/10196 ,  H05K2203/107

Abstract: An ESD countermeasure device is provided with (i) discharge electrodes that are positioned between first and second insulating substrates and are opposite to each other with a gap therebetween; and (ii) a discharge inducing portion that is disposed at opposing portions of the discharge electrodes and between the opposing portions, wherein a cross-sectional area of each of the opposing portions of the discharge electrodes that are opposite to each other is larger than that of each of lead portions of the discharge electrodes that are opposite to each other.

Abstract translation: ESD对策装置具备：（i）放电位于第一绝缘基板和第二绝缘基板之间并且彼此相对的电极，其间具有间隙; 和（ii）设置在放电电极的相对部分和相对部分之间的放电诱导部分，其中放电电极的彼此相对的每个相对部分的横截面面积大于 的放电电极的引线部分彼此相对。

公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。

公开(公告)号：US20140008104A1

公开(公告)日：2014-01-09

申请号：US14001517

申请日：2013-01-29

Applicant: Yasuhiro Sugaya ,  Hiroyuki Ishitomi ,  Tadashi Nakamura

Inventor： Yasuhiro Sugaya ,  Hiroyuki Ishitomi ,  Tadashi Nakamura

IPC: H05K3/30 ,  H05K1/16

CPC classification number: H05K3/303 ,  H05K1/116 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/465 ,  H05K3/4652 ,  H05K2201/0272 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0355 ,  H05K2203/0361 ,  Y10T29/49155

Abstract: A resistance-formed substrate includes a first insulating layer, a first wiring formed on a first surface of the first insulating layer, a thin-film resistance layer formed on a second surface of the first insulating layer, and a first via-hole conductor. The first via-hole conductor penetrates through the first insulating layer, and is electrically connected to the first wiring and the thin-film resistance layer. The first via-hole conductor includes a metal part including a low-melting point metal and a high-melting point metal, and a paste resin part. The low-melting point metal includes tin and bismuth, and has a melting point of 300° C. or lower. The high-melting point metal includes at least one of copper and silver, and has a melting point of 900° C. or higher. The first via-hole conductor is in contact with the thin-film resistance layer at both the paste resin part and the metal part.

Abstract translation: 电阻形成基板包括第一绝缘层，形成在第一绝缘层的第一表面上的第一布线，形成在第一绝缘层的第二表面上的薄膜电阻层和第一通孔导体。 第一通孔导体穿过第一绝缘层，并且电连接到第一布线和薄膜电阻层。 第一通孔导体包括包含低熔点金属和高熔点金属的金属部分和糊状树脂部分。 低熔点金属包括锡和铋，并且具有300℃或更低的熔点。 高熔点金属包括铜和银中的至少一种，并且具有900℃以上的熔点。 第一通孔导体在糊状树脂部分和金属部分都与薄膜电阻层接触。

公开(公告)号：US20130299236A1

公开(公告)日：2013-11-14

申请号：US13904072

申请日：2013-05-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke Nakano ,  Hidekiyo Takaoka

IPC: H01R4/02 ,  B23K1/00

CPC classification number: H01R4/02 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/0238 ,  B23K35/0244 ,  B23K35/262 ,  B23K2101/42 ,  C22C9/05 ,  C22C9/06 ,  C22C13/00 ,  C22C13/02 ,  H01R4/58 ,  H05K3/3463 ,  H05K2201/0272 ,  Y10T403/479

Abstract: A method of joining a first metal member having at least a surface made of a first metal to a second metal member having at least a surface made of a second metal with a joining material sandwiched therebetween. The joining material includes a low melting point metal having a lower melting point than the first metal and/or the second metal. The low melting point metal composing the joining material is Sn or an alloy containing Sn. At least one of the first metal and the second metal is a metal or an alloy which forms an intermetallic compound with the low melting point metal, and which has a lattice constant difference of 50% or more from the intermetallic compound. The joining material located between the first metal member and the second metal member is heat-treated at a temperature at which the low melting point metal is melted.

Abstract translation: 一种将具有至少由第一金属构成的表面的第一金属构件与至少具有由第二金属制成的表面的第二金属构件接合在一起的方法。 接合材料包括熔点低于第一金属和/或第二金属的低熔点金属。 组成接合材料的低熔点金属是Sn或含有Sn的合金。 第一金属和第二金属中的至少一个是与低熔点金属形成金属间化合物的金属或合金，并且与金属间化合物的晶格常数差为50％以上。 位于第一金属构件和第二金属构件之间的接合材料在低熔点金属熔化的温度下进行热处理。

公开(公告)号：US20130277096A1

公开(公告)日：2013-10-24

申请号：US13819313

申请日：2011-08-26

Applicant: Jiehyun Seong ,  Kyoung Su Jeon ,  Soo Yeon Heo ,  Jong Taik Lee ,  Ji Young Hwang ,  In-Seok Hwang ,  Seung-Heon Lee

Inventor： Jiehyun Seong ,  Kyoung Su Jeon ,  Soo Yeon Heo ,  Jong Taik Lee ,  Ji Young Hwang ,  In-Seok Hwang ,  Seung-Heon Lee

IPC: C09D11/00 ,  H05K1/02

CPC classification number: H01B1/22 ,  B05D5/12 ,  C09D11/033 ,  C09D11/037 ,  C09D11/52 ,  H05K1/02 ,  H05K1/097 ,  H05K3/1275 ,  H05K2201/0272 ,  H05K2203/0534

Abstract: The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.

Abstract translation: 本发明涉及导电金属油墨组合物，其包含：具有导电性的第一金属粉末; 非水溶剂; 附着改善剂; 和聚合物涂层性能改进剂，以及通过使用导电金属油墨组合物形成导电图案的方法和导电金属油墨组合物可以适当地应用于辊印刷工艺和显示出更好的导电性和优异的附着性的导电图案 可以形成相对于电路板的能力。

公开(公告)号：US20130020114A1

公开(公告)日：2013-01-24

申请号：US13631202

申请日：2012-09-28

Applicant: Kazutoshi KOSHIMIZU

Inventor： Kazutoshi KOSHIMIZU

IPC: H05K1/09

CPC classification number: H01L23/4985 ,  C08F2222/1026 ,  C08K3/08 ,  C08K7/00 ,  C08K7/18 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/014 ,  C08K2201/016 ,  C09D4/00 ,  C09D11/52 ,  H01B1/22 ,  H01L21/4867 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/4664 ,  H05K2201/0245 ,  H05K2201/0272 ,  H01L2924/00

Abstract: The present invention is a membrane wiring board provided with an insulating substrate, and at least one circuit portion provided on the insulating substrate and obtained by coating a circuit layer, formed by an electrically conductive paste containing electrically conductive particles, with an insulating coating layer, wherein the circuit layer contains a resin component having a gel fraction of 90% or more.

Abstract translation: 本发明是一种设置有绝缘基板的膜布线板，以及至少一个设置在绝缘基板上的电路部分，其通过用包含导电颗粒的导电膏形成的电路层涂覆绝缘涂层， 其中电路层含有凝胶分数为90％以上的树脂成分。

公开(公告)号：US20120251736A1

公开(公告)日：2012-10-04

申请号：US13248924

申请日：2011-09-29

Applicant: Jae-Min HONG ,  Yong-Won SONG ,  Yong-Ju JUNG ,  Hee-Dok CHOI ,  Won-Suk HAN ,  Hak-Sung KIM

Inventor： Jae-Min HONG ,  Yong-Won SONG ,  Yong-Ju JUNG ,  Hee-Dok CHOI ,  Won-Suk HAN ,  Hak-Sung KIM

IPC: H01B13/00 ,  B05D3/02 ,  H01B1/22 ,  B05D3/06 ,  B82Y30/00

CPC classification number: H01B1/22 ,  B41M3/006 ,  B41M7/009 ,  B82Y30/00 ,  C09D11/106 ,  C09D11/52 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0272 ,  H05K2203/107

Abstract: Disclosed is a conductive ink composition, a manufacturing method thereof, and a manufacturing method of a conductive thin film using the same, and more specifically, a conductive ink composition is provided that includes composite metal nanoparticles including first metal nanoparticles and second metal nanoparticles, and a polymer matrix. The polymer matrix is a composition including a polymer and a solvent, the first metal nanoparticles and the second metal nanoparticles are different metals, and the content of the composite metal nanoparticles is about 20 to about 25 wt %, the content of the polymer is about 5 to about 10 wt %, and the content of the solvent is about 65 to about 75 wt %, based on the total weight of the composition.

Abstract translation: 公开了一种导电性油墨组合物及其制造方法以及使用该导电性薄膜的导电性薄膜的制造方法，更具体地说，提供了包含第一金属纳米粒子和第二金属纳米粒子的复合金属纳米粒子的导电性油墨组合物，以及 聚合物基质。 聚合物基质是包含聚合物和溶剂的组合物，第一金属纳米颗粒和第二金属纳米颗粒是不同的金属，并且复合金属纳米颗粒的含量为约20至约25重量％，聚合物的含量约为 5至约10重量％，并且溶剂的含量为约65至约75重量％，基于组合物的总重量。