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    Substrate for Disposition of Light-Emitting Diodes
    161.
    发明申请
    Substrate for Disposition of Light-Emitting Diodes 有权
    发光二极管配置基板

    公开(公告)号：US20100265711A1

    公开(公告)日：2010-10-21

    申请号：US12622036

    申请日：2009-11-19

    Applicant: Wei-Long Lee

    Inventor： Wei-Long Lee

    IPC: F21V21/00

    CPC classification number: H05K1/142 ,  F21Y2115/10 ,  H05K3/0052 ,  H05K2201/09027 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2201/10363

    Abstract: A substrate of the present invention is provided with a plurality of parallel-arranged functional sections. First and second connecting sections are provided on both ends of the functional sections. Every two adjacent functional sections are separable from one another and are respectively connected with different connecting sections so that the substrate can be separated into two daughter substrates having identical areas. The two daughter substrates of the substrate can be processed simultaneously before separated from each other, thus saving the processing time. When used by a user, one daughter substrate can be used independently as a light source or the two daughter substrates can be used opposite to each other so that the functional sections of the two daughter substrates are staggered.

    Abstract translation: 本发明的基板具有多个平行排列的功能部。 第一和第二连接部分设置在功能部分的两端。 每两个相邻的功能部分彼此分离并且分别与不同的连接部分连接，使得基板可以分离成具有相同面积的两个子基板。 基板的两个子基板可以在彼此分离之前同时被处理，从而节省了处理时间。 当用户使用时，可以独立地使用一个子基板作为光源，或者可以将两个子基板彼此相对地使用，使得两个子基板的功能部分交错。

    Method of manufacturing circuit board
    162.
    发明授权
    Method of manufacturing circuit board 有权
    电路板制造方法

    公开(公告)号：US07735220B2

    公开(公告)日：2010-06-15

    申请号：US11538857

    申请日：2006-10-05

    Applicant: Tatsuhisa Fujii ,  Tomotaka Yonemitsu

    Inventor： Tatsuhisa Fujii ,  Tomotaka Yonemitsu

    IPC: H01K3/10 ,  H04R17/00

    CPC classification number: H02K7/06 ,  H02K16/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/10212 ,  H05K2203/175 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49787 ,  Y10T29/49789

    Abstract: A circuit board for a brushless DC motor whose rotation is controlled based on data stored on a rewritable non-volatile memory of a micro-computer mounted on the circuit board includes a substrate defined by a plurality of a circuit areas and a non-circuit area. The circuit areas and the non-circuit area are connected by a plurality of conductive patterns. The micro-computer having the rewritable non-volatile memory is mounted on each of the circuit areas. The rewritable non-volatile memory is connected to writing terminals arranged on the non-circuit area by the conductive patterns. By connecting a program writer to the writing terminals and activating the program writer, data are written to the rewritable non-volatile memory of each of the circuit areas. After writing data, the circuit areas are detached from the substrate, and a plurality of circuit boards are manufactured.

    Abstract translation: 一种用于无刷直流电动机的电路板，其旋转基于存储在安装在电路板上的微型计算机的可重写非易失性存储器上的数据而被控制，包括由多个电路区域和非电路区域 。 电路区域和非电路区域通过多个导电图案连接。 具有可重写非易失性存储器的微型计算机安装在每个电路区域上。 可重写非易失性存储器通过导电图案连接到布置在非电路区域上的写入端子。 通过将程序写入器连接到写入终端并激活程序写入器，数据被写入每个电路区域的可重写非易失性存储器。 在写入数据之后，电路区域与基板分离，并且制造多个电路板。

    PROCESSING APPARATUS AND PROCESSING METHOD
    163.
    发明申请
    PROCESSING APPARATUS AND PROCESSING METHOD 有权
    加工设备和加工方法

    公开(公告)号：US20100067998A1

    公开(公告)日：2010-03-18

    申请号：US12561499

    申请日：2009-09-17

    Applicant: Tsutomu MIYAMOTO ,  Satoshi Nakazawa ,  Takao Yamagishi

    Inventor： Tsutomu MIYAMOTO ,  Satoshi Nakazawa ,  Takao Yamagishi

    IPC: B23C3/00 ,  B23C3/12

    CPC classification number: H05K3/0052 ,  B23Q11/0046 ,  B23Q17/2233 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0228 ,  H05K2203/163 ,  Y10T408/172 ,  Y10T409/303752 ,  Y10T409/303808 ,  Y10T409/304144 ,  Y10T409/306888 ,  Y10T409/307056 ,  Y10T409/30728 ,  Y10T409/308008

    Abstract: A processing apparatus for processing a workpiece includes a router bit having a processing area for processing the workpiece; an actuator for moving the relative position of the router bit with respect to the workpiece so as to place a part of the processing area of the router bit in contact with the workpiece for processing the workpiece; an adjustment mechanism for adjusting the position of the router bit relative to the workpiece; a wearing detector for detecting wear of the processing area; and a controller for controlling the adjustment mechanism, upon detection of wear of the part of the processing area of the router bit, to make a different part of the processing area of the router bit contact with the workpiece during processing.

    Abstract translation: 一种用于处理工件的处理装置包括具有用于处理工件的处理区域的路由器位; 致动器，用于相对于所述工件移动所述路由器钻头的相对位置，以使所述路由器钻头的所述处理区域的一部分与所述工件接触以处理所述工件; 调节机构，用于调节路口钻头相对于工件的位置; 用于检测处理区域的磨损的磨损检测器; 以及控制器，用于在检测到所述路由器位的所述处理区域的所述部分的磨损时，控制所述调整机构，以使处理期间所述路由器位处理区域的不同部分与所述工件接触。

    Circuit board retention system
    166.
    发明授权
    Circuit board retention system 失效
    电路板保持系统

    公开(公告)号：US07626831B2

    公开(公告)日：2009-12-01

    申请号：US10970228

    申请日：2004-10-21

    Applicant: Douglas Sebastian Pfautz ,  Michael Steven Stanard

    Inventor： Douglas Sebastian Pfautz ,  Michael Steven Stanard

    IPC: H05K1/11

    CPC classification number: H05K13/0069 ,  H05K3/0052 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2203/0165

    Abstract: A retaining member for a circuit board array is provided. The retaining member includes an elongated support post having a first end and an opposite second end. A protrusion extends from the first end. The protrusion is configured to be received in a slot having side walls in a circuit board array. The support post is movable to move the protrusion within the slot from a first position wherein the protrusion is disengaged from the side walls of the slot to a second position wherein the protrusion engages the side walls of the slot to retain the circuit board array.

    Abstract translation: 提供了一种用于电路板阵列的保持构件。 保持构件包括具有第一端和相对的第二端的细长支撑柱。 突起从第一端延伸。 该突起构造成容纳在具有电路板阵列中的侧壁的槽中。 支撑柱可移动以使槽内的突起从第一位置移动，其中突起从槽的侧壁脱离到第二位置，其中突起接合槽的侧壁以保持电路板阵列。

    Rigid-flex printed circuit board with weakening structure
    167.
    发明授权
    Rigid-flex printed circuit board with weakening structure 有权
    刚性柔性印刷电路板，结构薄弱

    公开(公告)号：US07615860B2

    公开(公告)日：2009-11-10

    申请号：US11785601

    申请日：2007-04-19

    Applicant: Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

    Inventor： Kuo-Fu Su ,  Chih-Heng Chuo ,  Gwun-Jin Lin

    IPC: H01L23/14 ,  H01L23/12

    CPC classification number: H05K3/4691 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09127

    Abstract: A rigid-flex PCB includes at least one rigid PCB (RPCB) and at least one flexible PCB (FPCB). Each RPCB has a connection section; first and second sections separately extended from two lateral edges of the connection section and having at least one FPCB bonding side each; and a weakening structure formed along each joint of the connection section and the first and second sections. Each FPCB has a bending section corresponding to the connection section on the RPCB; first and second sections separately extended from two lateral edges of the bending section and having at least one RPCB bonding side each corresponding to the FPCB bonding sides of the first and second sections of the RPCB. When a proper pressure is applied against the weakening structures, the RPCB may be easily bent broken at the weakening structures to remove the connection section therefrom.

    Abstract translation: 刚性柔性PCB包括至少一个刚性PCB（RPCB）和至少一个柔性PCB（FPCB）。 每个RPCB都有一个连接部分; 第一和第二部分分别从连接部分的两个侧边缘延伸并且每个具有至少一个FPCB接合侧; 以及沿着连接部分和第一和第二部分的每个接头形成的弱化结构。 每个FPCB具有对应于RPCB上的连接部分的弯曲部分; 第一和第二部分分别从弯曲部分的两个侧边缘延伸并且具有至少一个RPCB接合侧，每个RPCB接合侧对应于RPCB的第一和第二部分的FPCB接合侧。 当对弱化结构施加适当的压力时，RPCB可以容易地在弱化结构处弯曲断裂以从其中移除连接部分。

    METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
    170.
    发明申请
    METHOD FOR MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD 有权
    制造刚性柔性印刷电路板的方法

    公开(公告)号：US20090183823A1

    公开(公告)日：2009-07-23

    申请号：US12270612

    申请日：2008-11-13

    Applicant: LIN REN ,  YING SU ,  CHENG-HSIEN LIN

    Inventor： LIN REN ,  YING SU ,  CHENG-HSIEN LIN

    IPC: B32B37/00

    CPC classification number: H05K3/4691 ,  H05K3/0052 ,  H05K3/4611 ,  H05K2201/0909 ,  H05K2201/09127 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/1064

    Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

    Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，提供柔性基板。 其次，在柔性基板中限定至少一个狭缝。 第三，提供具有对应于柔性基板的结构的刚性基板。 第四，将柔性基板层合到刚性基板上以获得层压基板。 第五，去除刚性基板的一部分。 第六，层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此，获得刚性柔性印刷电路板。

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