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    ELECTRICAL CONNECTOR ASSEMBLY
    161.
    发明申请
    ELECTRICAL CONNECTOR ASSEMBLY 有权
    电气连接器总成

    公开(公告)号：US20120052695A1

    公开(公告)日：2012-03-01

    申请号：US12868370

    申请日：2010-08-25

    Applicant: MYOUNGSOO JEON ,  ATTALEE SNARR TAYLOR ,  JOHN JOSEPH CONSOLI

    Inventor： MYOUNGSOO JEON ,  ATTALEE SNARR TAYLOR ,  JOHN JOSEPH CONSOLI

    IPC: H01R12/14 ,  H05K1/11

    CPC classification number: H05K3/308 ,  H01R12/585 ,  H05K1/116 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/10189

    Abstract: An electrical connector assembly includes a circuit board and an electrical connector mounted on the circuit board. The circuit board has a circuit board body having first and second surfaces and through-holes bored between the first and second surfaces. The circuit board has signal traces on internal layers of the circuit board that are generally parallel to the first and second surfaces. Portions of the circuit board body within the through-holes are etched away to expose portions of the signal traces beyond the circuit board body within the corresponding through-hole. The electrical connector includes a housing and signal terminals held by the housing. The signal terminals are received in respective through-holes of the circuit board and engage the corresponding signal traces.

    Abstract translation: 电连接器组件包括电路板和安装在电路板上的电连接器。 电路板具有电路板主体，其具有在第一表面和第二表面之间钻孔的第一表面和第二表面以及通孔。 电路板在电路板的内层上具有通常平行于第一和第二表面的信号迹线。 蚀刻掉通孔内的电路板主体的部分，以将信号迹线的部分暴露在对应的通孔内的电路板主体之外。 电连接器包括壳体和由壳体保持的信号端子。 信号端子被接收在电路板的相应通孔中并与相应的信号迹线接合。

    Printed circuit board
    162.
    发明授权
    Printed circuit board 失效
    印刷电路板

    公开(公告)号：US08089007B2

    公开(公告)日：2012-01-03

    申请号：US12331444

    申请日：2008-12-10

    Applicant: Ying-Tso Lai ,  Tsung-Sheng Huang ,  Shou-Kuo Hsu

    Inventor： Ying-Tso Lai ,  Tsung-Sheng Huang ,  Shou-Kuo Hsu

    IPC: H05K1/11

    CPC classification number: H05K1/0265 ,  H05K1/114 ,  H05K1/115 ,  H05K2201/094 ,  H05K2201/0979 ,  H05K2201/09854 ,  H05K2201/10189

    Abstract: A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced.

    Abstract translation: 印刷电路板包括参考层，限定在参考层中并与电子部件的第一列销中的第一销相邻的至少一个第一孔以及限定在参考层中并与参考层相邻的至少一个第二孔 电子部件的第二引脚。 至少一个第二孔限定在参考层中并与至少一个第一孔相对。 第二引脚位于与第一列引脚相邻的第二列引脚中。 所述至少一个第一孔的直径大于所述至少一个第二孔的直径，使得流过所述第一销和所述第二销的电流差减小。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    163.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法

    公开(公告)号：US20110240351A1

    公开(公告)日：2011-10-06

    申请号：US13012267

    申请日：2011-01-24

    Applicant: Hideyuki WAKITA ,  Akihide Kawaguchi

    Inventor： Hideyuki WAKITA ,  Akihide Kawaguchi

    IPC: H05K1/00 ,  H05K1/11 ,  H05K3/10

    CPC classification number: H05K3/4644 ,  H05K1/185 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/09709 ,  H05K2201/09854

    Abstract: A wiring board including a core insulation layer having a connection conductor formed in a hole of the core layer, and an interlayer insulation layer laminated on one side of the core layer. The conductor of the core layer includes plating filling the hole of the core layer. The interlayer layer has a connection conductor formed in a hole of the interlayer layer. The conductor of the interlayer layer includes plating filling the hole of the interlayer layer. The conductor of the interlayer layer is stacked on the conductor of the core insulation layer. The conductors of the core and interlayer layers have lands formed on the core and interlayer layers and including metal foils and plating on the foils. The foil of the land on the core layer has a thickness which is thicker than a thickness of the foil of the land on the interlayer layer.

    Abstract translation: 一种布线板，包括具有形成在芯层的孔中的连接导体的芯绝缘层和层叠在芯层的一侧上的层间绝缘层。 芯层的导体包括填充芯层的孔的电镀。 层间层具有形成在中间层的孔中的连接导体。 中间层的导体包括填充中间层的孔的电镀。 层间层的导体层叠在芯绝缘层的导体上。 芯层和层间层的导体具有形成在芯层和层间层上并且包括金属箔和箔上的电镀的焊盘。 芯层上的焊盘的厚度比层间层上焊盘厚度厚。

    Partitioned through-layer via and associated systems and methods
    165.
    发明授权
    Partitioned through-layer via and associated systems and methods 有权
    分层通过层和通过相关的系统和方法

    公开(公告)号：US07830018B2

    公开(公告)日：2010-11-09

    申请号：US11863579

    申请日：2007-09-28

    Applicant: Teck Kheng Lee

    Inventor： Teck Kheng Lee

    IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC classification number: H05K13/00 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/115 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09645 ,  H05K2201/09854 ,  H01L2924/00

    Abstract: Partitioned vias, interconnects, and substrates that include such vias and interconnects are disclosed herein. In one embodiment, a substrate has a non-conductive layer and a partitioned via formed in a portion of the non-conductive layer. The non-conductive layer includes a top side, a bottom side, and a via hole extending between the top and bottom sides and including a sidewall having a first section a second section. The partitioned via includes a first metal interconnect within the via on the first section of the sidewall and a second metal interconnect within the via hole on the second section of the sidewall and electrically isolated from the first metal interconnect. In another embodiment, the first metal interconnect is separated from the second metal interconnect by a gap within the via hole.

    Abstract translation: 包括这种通孔和互连的分隔的过孔，互连和衬底在本文中公开。 在一个实施例中，衬底具有形成在非导电层的一部分中的非导电层和分隔通孔。 非导电层包括在顶侧和底侧之间延伸的顶侧，底侧和通孔，并且包括具有第一部分和第二部分的侧壁。 分隔通孔包括在侧壁的第一部分上的通孔内的第一金属互连和在侧壁的第二部分上的通孔内的第二金属互连，并与第一金属互连电隔离。 在另一个实施例中，第一金属互连通过通孔内的间隙与第二金属互连分开。

    Circuit board
    166.
    发明授权
    Circuit board 有权
    电路板

    公开(公告)号：US07820917B2

    公开(公告)日：2010-10-26

    申请号：US10597306

    申请日：2005-01-06

    Applicant: Yoshifumi Kanetaka ,  Naomi Ishizuka

    Inventor： Yoshifumi Kanetaka ,  Naomi Ishizuka

    IPC: H05K1/16

    CPC classification number: H05K1/116 ,  H05K3/3447 ,  H05K2201/094 ,  H05K2201/09854 ,  H05K2201/10189 ,  Y10T29/49139

    Abstract: A circuit board includes a plurality of through holes into which a plurality of leads of one electronic devices are inserted and soldered with lead free solder. Among these through holes, the volume of through hole into which the outermost end lead of leads of the electronic device is inserted, is set greater than the volume of through hole, into which the lead at the position nearest to the center of the electronic device is inserted.

    Abstract translation: 电路板包括多个通孔，一个电子设备的多个引线插入并焊接到无铅焊料中。 在这些通孔中，电子装置的引线的最外端引线插入其中的通孔的容积被设定为大于通孔的容积，最靠近电子装置的中心的位置处的引线 被插入。

    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF
    168.
    发明申请
    PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF 有权
    印刷电路板及其生产方法

    公开(公告)号：US20100089632A1

    公开(公告)日：2010-04-15

    申请号：US12641498

    申请日：2009-12-18

    Applicant: Tomoyuki Ikeda

    Inventor： Tomoyuki Ikeda

    IPC: H05K1/11

    CPC classification number: H05K3/0026 ,  C25D5/02 ,  H05K1/119 ,  H05K3/0032 ,  H05K3/0094 ,  H05K3/422 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49126

    Abstract: A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other.

    Abstract translation: 印刷电路板具有具有第一表面和第二表面的绝缘树脂基板，所述绝缘树脂基板具有从所述第一表面到所述第二表面穿过所述绝缘树脂基板的一个或多个贯穿孔，形成在所述绝缘树脂基板上的第一导体 绝缘树脂基板的第一表面，形成在绝缘树脂基板的第二表面上的第二导体和形成在绝缘树脂基板的穿透孔中的通孔导体结构，并将第一导体和第二导体 。 所述贯穿孔具有在所述第一表面上具有开口的第一部分和在所述第二表面上具有开口的第二部分。 第一部分和第二部分被连接成使得第一部分和第二部分彼此脱离。

    MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
    169.
    发明申请
    MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD 失效
    多层接线板及制造多层接线板的方法

    公开(公告)号：US20100071951A1

    公开(公告)日：2010-03-25

    申请号：US12067408

    申请日：2006-08-14

    Applicant: Tokuo Yoshida ,  Akiyoshi Fujii ,  Tatsuya Fujita

    Inventor： Tokuo Yoshida ,  Akiyoshi Fujii ,  Tatsuya Fujita

    IPC: H05K1/11 ,  H01K3/10

    CPC classification number: H05K3/4069 ,  H05K1/115 ,  H05K3/125 ,  H05K3/1258 ,  H05K3/4664 ,  H05K2201/09727 ,  H05K2201/09854 ,  H05K2203/013 ,  H05K2203/0568 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165

    Abstract: The multilayer wiring board is provided with a lower layer wiring (8), and an upper layer wiring (10) formed on the lower layer wiring (8) through an interlayer insulating layer (9). On the interlayer insulating layer (9), a contact hole (11) is provided for interconnecting the upper layer wiring (8) with the lower layer wiring (10). A region surrounded by an inner wall (13) which forms the contact hole (11) is permitted to have a linewidth region wherein a wide line region (13A) and protruding regions (13B, 13C) as regions having different linewidths are connected. Thus, film thickness distribution of an ink baked product (12) formed at the contact hole (11) rises at the protruding regions (13B, 13C), and highly reliable multilayer interconnection can be performed between the lower layer wiring (8) and the upper layer wiring (10).

    Abstract translation: 多层布线基板具有下层布线（8）和通过层间绝缘层（9）形成在下层布线（8）上的上层布线（10）。 在层间绝缘层（9）上设置有用于使上层布线（8）与下层布线（10）互连的接触孔（11）。 由形成接触孔（11）的内壁（13）包围的区域被允许具有作为具有不同线宽的区域的宽线区域（13A）和突出区域（13B，13C）的线宽区域。 因此，形成在接触孔（11）处的油墨烘烤产品（12）的膜厚分布在突出区域（13B，13C）处上升，并且可以在下层布线（8）和 上层布线（10）。

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