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    Structure and fabrication method of a sensing device
    174.
    发明授权
    Structure and fabrication method of a sensing device 有权
    感测装置的结构和制造方法

    公开(公告)号：US09133018B2

    公开(公告)日：2015-09-15

    申请号：US12572277

    申请日：2009-10-02

    Applicant: Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

    Inventor： Lung-Tai Chen ,  Yu-Wen Hsu ,  Sheah Chen ,  Jing-Yuan Lin ,  Li-Chi Pan ,  Tzong-Che Ho

    IPC: B81B7/00

    CPC classification number: B81B7/007 ,  B81B2201/0292 ,  B81B2207/093 ,  H01L2224/16225

    Abstract: A sensing device comprises a substrate having an upper surface, a sensor member, at least an external conductive wire, and a standing-ring member. The sensor member, the external conductive wire and the stand-ring member are on the upper surface. The sensor member is located at the central area on the upper surface, and the standing-ring member surrounds the sensor member. The standing-ring member and the sensor member are electrically connected through the at least an external conductive wire.

    Abstract translation: 感测装置包括具有上表面的基底，传感器构件，至少外部导电线和驻环构件。 传感器构件，外部导电线和支架构件在上表面上。 传感器构件位于上表面的中央区域，并且立环构件围绕传感器构件。 站立环构件和传感器构件通过至少一个外部导线电连接。

    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    176.
    发明申请
    MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    微电子机械系统传感器模块包装及其制造方法

    公开(公告)号：US20150153378A1

    公开(公告)日：2015-06-04

    申请号：US14550851

    申请日：2014-11-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Tae Hyun KIM ,  Heung Woo Park ,  Eun Jung Jo

    IPC: G01P15/105

    CPC classification number: G01P1/023 ,  B81B2201/0235 ,  B81B2201/0292 ,  B81B2207/07 ,  B81C1/00238 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/97 ,  Y10T29/42

    Abstract: Disclosed herein is a micro electro mechanical systems (MEMS) sensor module package. The MEMS sensor module package includes: an MEMS sensor; a base part formed so as to encapsulate the MEMS sensor with a resin; an external terminal provided on one surface of the base part; a through mold via (TMV) provided in the base part to electrically connect the external terminal and the MEMS sensor to each other; and an application specific integrated circuit (ASIC) stacked on the MEMS sensor. Compared to a MEMS sensor module package structure according to the prior art, the present invention is to reduce the entire size and implement electric shielding.

    Abstract translation: 本文公开了一种微机电系统（MEMS）传感器模块封装。 MEMS传感器模块封装包括：MEMS传感器; 形成为用MEMS树脂密封MEMS传感器的基部; 设置在所述基部的一个表面上的外部端子; 设置在基座部分中的通过模具通孔（TMV），以将外部端子和MEMS传感器彼此电连接; 以及堆叠在MEMS传感器上的专用集成电路（ASIC）。 与根据现有技术的MEMS传感器模块封装结构相比，本发明是为了减小整体尺寸并实现电屏蔽。

    OPTICAL-MICROWAVE-QUANTUM TRANSDUCER
    177.
    发明申请
    OPTICAL-MICROWAVE-QUANTUM TRANSDUCER 有权
    光学微波量子传感器

    公开(公告)号：US20150060756A1

    公开(公告)日：2015-03-05

    申请号：US14016699

    申请日：2013-09-03

    Applicant: JAE I. PARK

    Inventor： JAE I. PARK

    IPC: B81B3/00 ,  B81B7/00

    CPC classification number: B81B3/0029 ,  B81B3/0021 ,  B81B7/0093 ,  B81B2201/0292 ,  B81B2201/047 ,  B82Y20/00 ,  G02B6/00 ,  G02B6/1225 ,  G02B6/1228

    Abstract: An optical-microwave-quantum transducer can include a tapered optical fiber configured to transmit and receive optical signals. The optical-microwave-quantum transducer can also include a cantilever that can include an optical cavity that includes a nanophotonic crystal. The optical cavity can be configured to provide mechanical excitation in response to electromagnetic excitation induced by photons emitted from the tapered optical fiber. The cantilever can also include a mechanical coupler that is configured to induce electrical modulation onto a superconducting cavity in response to the mechanical excitation. The mechanical coupler can also be configured to provide mechanical excitation in response to electromagnetic excitation induced by photons from the superconducting cavity. The optical cavity can further be configured to provide electromagnetic excitation that induces optical modulation on the tapered optical fiber in response to the mechanical excitation.

    Abstract translation: 光学微波量子换能器可以包括配置成发送和接收光信号的锥形光纤。 光学微波量子换能器还可以包括悬臂，其可以包括包括纳米光子晶体的光学腔。 光腔可以被配置为响应于从锥形光纤发射的光子引起的电磁激发而提供机械激励。 悬臂还可以包括机械耦合器，其被配置为响应于机械激励而在超导腔上引起电调制。 机械耦合器还可以被配置为响应于来自超导腔的光子引起的电磁激励而提供机械激励。 光腔可以进一步配置成提供响应于机械激励而在锥形光纤上引起光调制的电磁激励。

    Integrated Circuit Provided with a Device for Detecting its Spatial Orientation and/or a Modification of this Orientation
    178.
    发明申请
    Integrated Circuit Provided with a Device for Detecting its Spatial Orientation and/or a Modification of this Orientation 有权
    具有用于检测其空间方向和/或该方向的修改的装置的集成电路

    公开(公告)号：US20150014794A1

    公开(公告)日：2015-01-15

    申请号：US14501537

    申请日：2014-09-30

    Applicant: STMicroelectronics (Rousset) SAS

    Inventor： Antonio Di-Giacomo ,  Pascal Fornara

    IPC: B81B7/02 ,  B81C1/00 ,  B81B3/00

    CPC classification number: B81B7/02 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0292 ,  B81C1/00174 ,  B81C1/00246 ,  B81C2203/0714 ,  B81C2203/0771 ,  G01C9/12 ,  G01P13/00 ,  G01P15/135

    Abstract: An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the accommodation. A monitor inside the accommodation defines a displacement area for the metal component and includes electrically conductive elements disposed at the periphery of the displacement area. The component is configured so as to, under the action of the gravity, come into contact with the two electrically conductive elements in response to a given spatial orientation of the integrated circuit. A detector is configured to detect an electrical link passing through the component and the electrically conductive elements.

    Abstract translation: 集成电路包括用于检测集成电路的空间取向和/或取向变化的机械装置。 该装置形成在BEOL中并且包括其侧面包括形成在各种金属化水平内的金属部分的容纳物。 移动金属部件容纳在住宿内。 住房内的监视器限定了用于金属部件的位移区域，并且包括设置在位移区域周边的导电元件。 该部件构造成在重力的作用下，响应于集成电路的给定的空间取向与两个导电元件接触。 检测器被配置为检测通过部件和导电元件的电连接。

    SENSOR DEVICE
    179.
    发明申请
    SENSOR DEVICE 有权
    传感器设备

    公开(公告)号：US20140374859A1

    公开(公告)日：2014-12-25

    申请号：US14376945

    申请日：2013-02-26

    Applicant: OMRON Corporation

    Inventor： Takashi Kasai

    IPC: B81B7/00

    CPC classification number: B81B7/0058 ,  B81B7/0064 ,  B81B2201/0257 ,  B81B2201/0292 ,  B81B2207/115 ,  B81C1/00246 ,  H04R1/04 ,  H04R1/06 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006

    Abstract: A sensor device has a substrate, a sensor section provided on an upper surface of the substrate, a circuit section provided on the upper surface of the substrate, a plurality of connection pads that electrically conduct with the sensor section or the circuit section, and a metal protective film covering at least a part of the circuit section from above.

    Abstract translation: 传感器装置具有衬底，设置在衬底的上表面上的传感器部分，设置在衬底的上表面上的电路部分，与传感器部分或电路部分导电的多个连接焊盘，以及 金属保护膜从上方覆盖电路部分的至少一部分。

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