公开(公告)号：US20050066523A1

公开(公告)日：2005-03-31

申请号：US10956804

申请日：2004-10-01

Applicant: James Wark ,  Salman Akram

Inventor： James Wark ,  Salman Akram

IPC: G01R1/04 ,  H01L21/60 ,  H01L23/50 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40 ,  H01L23/04 ,  H05K3/02

CPC classification number: H01R12/57 ,  G01R1/0408 ,  G01R1/0466 ,  H01L2924/0002 ,  H01R43/205 ,  H05K1/119 ,  H05K3/325 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2201/09472 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49123 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49222 ,  Y10T29/49453 ,  H01L2924/00

Abstract: A method of making an interposer having an array of contact structures for making temporary electrical contact with the leads of a chip package. The contact structures may make contact with the leads substantially as close as desired to the body of the chip package. Moreover, the contact structures can be adapted for making contact with leads having a very fine pitch. In a first embodiment, the contact structures include raised members formed over a body of the interposer. A conductive layer is formed over each of the raised members to provide a contact surface for engaging the leads of the chip package. In another embodiment, the raised members are replaced with depressions formed into the interposer. A conductive layer is formed on an inside surface of each depression to provide a contact surface for engaging the leads of the chip package. Moreover, any combination of raised members and depressions may be used.

Abstract translation: 一种制造具有用于与芯片封装的引线暂时电接触的接触结构阵列的插入件的方法。 接触结构可以与引线基本上接近于芯片封装体的所需位置。 此外，接触结构可以适于与具有非常细的间距的引线接触。 在第一实施例中，接触结构包括形成在插入件主体上的凸起部件。 在每个凸起构件上形成导电层，以提供用于接合芯片封装引线的接触表面。 在另一个实施例中，凸起构件被形成在插入件中的凹陷所代替。 在每个凹陷的内表面上形成导电层，以提供用于接合芯片封装的引线的接触表面。 此外，可以使用凸起构件和凹陷的任何组合。

公开(公告)号：US20050063164A1

公开(公告)日：2005-03-24

申请号：US10667694

申请日：2003-09-22

Applicant: Gilroy Vandentop ,  Hamid Azimi

Inventor： Gilroy Vandentop ,  Hamid Azimi

IPC: H01L21/48 ,  H01L21/68 ,  H01L23/00 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/38 ,  H05K3/40 ,  H05K7/08

CPC classification number: H01L24/10 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/562 ,  H01L24/13 ,  H01L2221/68345 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/30105 ,  H05K3/326 ,  H05K3/386 ,  H05K3/4007 ,  H05K2201/0133 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09909 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A system may include a plurality of pliant conductive elements, a first end of one of the plurality of pliant conductive elements to be electrically coupled to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality of pliant conductive elements to be electrically coupled to a second electrical contact of an integrated circuit die.

Abstract translation: 系统可以包括多个柔性导电元件，多个柔性导电元件中的一个导电元件的第一端被电耦合到集成电路基板的第一电接触件和多个柔性导电元件中的一个的第二端 元件被电耦合到集成电路管芯的第二电接触件。

公开(公告)号：US20050046573A1

公开(公告)日：2005-03-03

申请号：US10485863

申请日：2002-04-30

Applicant: Francisco Velasco ,  Manfred Rietzler

Inventor： Francisco Velasco ,  Manfred Rietzler

IPC: B42D15/10 ,  G02B5/122 ,  G02B5/124 ,  G02B5/128 ,  G06K19/06 ,  G06K19/07 ,  G06K19/077 ,  G06K19/08 ,  G08B13/14 ,  G08B29/00 ,  G09F3/00 ,  G09F3/02 ,  H01Q1/38 ,  H05K1/00 ,  H05K3/06

CPC classification number: G06K19/0723 ,  G06K19/07 ,  G06K19/07718 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07758 ,  G06K19/0776 ,  G06K19/07771 ,  G06K19/07779 ,  G06K19/07783 ,  G06K2019/0629 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K1/0274 ,  H05K1/0393 ,  H05K3/067 ,  H05K2201/0133 ,  H05K2201/09781 ,  H05K2201/09936 ,  H05K2201/2054 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2924/00

Abstract: A method for selectively removing metal from a metallized substrate (e.g., a metallized polymer film) and the formation of devices thereby are provided. Th method involves selectively exposing the metallized surface to a demetallizing (i.e., an oxidizing) chemical solution. The metallized layer can be selectively exposed to the demetallizing solution using a flexographic printing process wherein printing rollers are used to transfer the demetallizing solution to the metallized surface. An identification device including, for example, a holographic, retro-reflective, or other metallized material and a radio-frequency transponder are also provided. The radio-frequency transponder includes an RF chip and an antenna in electrical communication with the chip. The identification device including the holographic image allows both electronic identification through the reading or identification data stored in the chip and optical identification via the holographic image.

Abstract translation: 提供了从金属化基板（例如，金属化聚合物膜）选择性地去除金属并由此形成器件的方法。 Th方法包括将金属化表面选择性地暴露于脱金属（即氧化）化学溶液。 金属化层可以使用柔性版印刷方法选择性地暴露于脱金属溶液，其中使用印刷辊将去金属化溶液转移到金属化表面。 还提供了包括例如全息，回射或其它金属化材料和射频转发器的识别装置。 射频转发器包括RF芯片和与芯片电连通的天线。 包括全息图像的识别装置允许通过存储在芯片中的读取或识别数据进行电子识别，并通过全息图像进行光学识别。

公开(公告)号：US20050030466A1

公开(公告)日：2005-02-10

申请号：US10935572

申请日：2004-09-07

Applicant: Tsutomu Kanatsu

Inventor： Tsutomu Kanatsu

IPC: G02F1/1345 ,  G02F1/13 ,  H05K1/00 ,  H05K1/14

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K1/147 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/10681

Abstract: In a flat panel display device, in which a display panel 1 loosely fitted on a main surface of a chassis 4 and circuit substrates held in hook portions provided on side surfaces of the chassis are connected each other through TCP's by bending the latter TCP's, and a method for manufacturing the same device, a main slit for a rounded portion of each TCP is formed in a rounded portion of the TCP and an auxiliary sub slit is also formed adjacent to the main slit. In order to reduce the peeling force exerted on connecting/fixing portions between the TCP's and the display panel, the circuit substrate is pulled up by bending the main and sub slits and then returning the sub slit to a flat state to insert the circuit substrate into the hook portions.

Abstract translation: 在平板显示装置中，其中松散地装配在底盘4的主表面上的显示面板1和保持在设置在底盘的侧表面上的钩部中的电路基板通过TCP相互连接，通过弯曲后者TCP，并且 制造同一装置的方法中，每个TCP的圆形部分的主狭缝形成在TCP的圆形部分中，辅助副狭缝也形成在与主狭缝相邻的位置。 为了减少施加在TCP和显示面板之间的连接/固定部分上的剥离力，通过弯曲主和副狭缝将电路基板拉起，然后将副狭缝返回到平坦状态以将电路基板插入 钩部。

公开(公告)号：US20040264057A1

公开(公告)日：2004-12-30

申请号：US10606844

申请日：2003-06-27

Applicant: Fujitsu Limited

Inventor： Hiroyuki Iwahara ,  Mitsuhiro Izumi

IPC: G11B005/48

CPC classification number: H05K1/0281 ,  G11B5/4833 ,  G11B5/5582 ,  H05K1/0271 ,  H05K2201/0133 ,  H05K2201/2009 ,  H05K2201/2045

Abstract: A disc unit includes a head that records information from and/or reproduces information onto a disc, a suspension that includes a top surface and a side surface, and supports the head on the top surface, a flexible printed circuit board attached to the side surface of the suspension through an air gap, the flexible printed circuit board transmitting a signal indicative of the information to and from the head, and a damper that damps oscillation of the flexible printed circuit board.

Abstract translation: 盘单元包括将信息记录在盘上的信息和/或将信息再现到盘上的头，包括顶表面和侧表面的悬架，并且在顶表面上支撑头部，附接到侧表面的柔性印刷电路板 通过空气间隙的悬架的柔性印刷电路板，柔性印刷电路板将表示信息的信号传送到头部，以及阻尼器，其阻止柔性印刷电路板的振荡。

公开(公告)号：US20040244906A1

公开(公告)日：2004-12-09

申请号：US10888890

申请日：2004-07-08

Applicant: AU Optoelectronic Corporation

Inventor： Ling-Yi Chuang ,  Li-Chang Lu

IPC: C09J001/00 ,  H05K003/36

CPC classification number: H01L24/29 ,  H01L24/13 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/13144 ,  H01L2224/13551 ,  H01L2224/13564 ,  H01L2224/13578 ,  H01L2224/13655 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/102 ,  H05K3/321 ,  H05K2201/0133 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24983 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A first substrate, a second substrate, an intermediate and a plurality of particles form a laminated structure. The first substrate has a first conjunction portion and a second conjunction portion, and the second substrate has a third conjunction portion and a fourth conjunction portion which are characterized by a first hardness. The intermediate is disposed between the first substrate and the second substrate. The particles provided with a second hardness greater than the first hardness are coated on the third conjunction portion to contact the first conjunction portion and coated on the fourth conjunction portion to contact the second conjunction portion. A height difference with reference to the base surface of the second substrate exists between the end surface of the third conjunction portion and the end surface of the fourth conjunction portion. A height difference that exists between the fourth conjunction portion and the third conjunction portion can be compensated for by the particles embedded in the fourth conjunction portion. Thus the bridging of the third conjunction portion and the first conjunction portion can be uniformly performed by the particles located between the two.

Abstract translation: 第一基板，第二基板，中间和多个颗粒形成层压结构。 第一基板具有第一连接部和第二连接部，第二基板具有以第一硬度为特征的第三连接部和第四连结部。 中间体设置在第一基板和第二基板之间。 具有大于第一硬度的第二硬度的颗粒涂覆在第三连接部分上以与第一连接部分接触并涂覆在第四连接部分上以接触第二连接部分。 在第三连接部的端面与第四连结部的端面之间存在与第二基板的基面相对的高度差。 存在于第四结合部分和第三连接部分之间的高度差可以通过嵌入在第四连接部分中的颗粒来补偿。 因此，第三连接部分和第一连接部分的桥接可以由位于两者之间的颗粒均匀地进行。

公开(公告)号：US20040238115A1

公开(公告)日：2004-12-02

申请号：US10489680

申请日：2004-05-10

Inventor： Hisao Matsuno ,  Kenjiro Osugi

IPC: B29C043/04 ,  B32B031/00

CPC classification number: B30B15/024 ,  B30B5/02 ,  B30B15/065 ,  H01L24/29 ,  H01L24/31 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7598 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2203/0278 ,  Y10T156/1089 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An anisotropic conductive film (14) and circuit elements (16) are superimposed and disposed on a substrate (10). An isotropic pressing operation is performed by a pressing mold having a flexible layer (22) on the surface to be brought into contact with the circuit elements, and simultaneously heating is performed to bond the circuit elements onto the substrate. Since the flexible layer absorbs differences in thickness of the circuit elements, the plurality of circuit elements can be pressed simultaneously. Further, since the plurality of circuit elements are simultaneously heated, it is unnecessary to consider an influence of heat on unheated adjacent circuit elements in a case where the elements are heated one by one. The isotropic pressing makes it possible to prevent the anisotropic conductive film from protruding sideways. As a result, spaces between the circuit elements can be reduced.

Abstract translation: 各向异性导电膜（14）和电路元件（16）叠加并设置在基板（10）上。 通过具有与电路元件接触的表面上的柔性层（22）的压模进行各向同性的加压操作，同时进行加热以将电路元件接合到基板上。 由于柔性层吸收电路元件的厚度差异，所以可以同时按压多个电路元件。 此外，由于多个电路元件被同时加热，因此在元件被逐个加热的情况下，不需要考虑热量对未加热的相邻电路元件的影响。 各向同性按压使得可以防止各向异性导电膜侧向突出。 结果，可以减少电路元件之间的空间。

公开(公告)号：US06808959B2

公开(公告)日：2004-10-26

申请号：US10256364

申请日：2002-09-27

Applicant: Nobuyuki Umezaki

Inventor： Nobuyuki Umezaki

IPC: H01L2150

CPC classification number: H01L23/49816 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0133 ,  H05K2201/0162 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/0588 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device comprises a semiconductor element mounted on a first surface of a wiring substrate, and a plurality of conductive land portions formed and exposed at a second surface of the wiring substrate which is opposite to the first surface. A plurality of solder balls are respectively joined to the plurality of conductive land portions. A plurality of reinforcement resin film portions are formed to reinforce coupling between the solder balls and the conductive land portions. Each of the reinforcement resin film portions is formed around a portion of the solder ball joining to the conductive land portion. Each of the reinforcement resin film portions being bent to form a portion along the wiring substrate and a portion along the side surface of the solder ball. The coupling between the solder balls and the conductive land portions is reinforced by elastic force of the bent portions of the reinforcement resin film portions.

Abstract translation: 半导体器件包括安装在布线基板的第一表面上的半导体元件以及在与第一表面相对的布线基板的第二表面处形成和暴露的多个导电接合部。 多个焊球分别与多个导电接合部接合。 形成多个加强树脂膜部，以加强焊球和导电接合部之间的耦合。 每个加强树脂膜部分形成在与导电接合部分接合的焊球的一部分周围。 每个加强树脂膜部分被弯曲以形成沿着布线基板的部分和沿着焊球的侧表面的部分。 通过加强树脂膜部分的弯曲部分的弹性力来增强焊球与导电接合部之间的耦合。

公开(公告)号：US20040114063A1

公开(公告)日：2004-06-17

申请号：US10724120

申请日：2003-12-01

Applicant: Pioneer Corporation

Inventor： Yukiharu Miyamura ,  Koichi Kaneko ,  Sadao Yokoi ,  Yousuke Tagaya ,  Toshiharu Oishi

IPC: G02F001/1333

CPC classification number: H05K1/028 ,  G02F1/13452 ,  H05K2201/0133 ,  H05K2201/0394

Abstract: A drive circuit board 11 is mounted on a side portion of a chassis 10 in a position forming an angle with a flat display panel 1. A wiring board 13 has two flections 13DA, 13DB formed in two positions. The wiring board 13 is placed in a front corner of the flat display apparatus and between the flat display panel 1 and the drive circuit board 11, which are placed at angles on the chassis 10, in such a way that electrode terminals 13B and 13C are respectively connected to the flat display panel 1 and the drive circuit board 11, and a board body 13A is bent by the flections 13DA, 13DB, provided in the two positions, in the direction of projecting toward the front of the flat display panel 1.

Abstract translation: 驱动电路板11安装在与平板显示面板1成角度的位置的底座10的侧部。布线板13具有形成在两个位置上的两个折角13DA，13DB。 布线板13被放置在平面显示装置的前角，平面显示面板1和驱动电路板11之间，以这样的方式配置在底座10上，使得电极端子13B和13C为 分别连接到平面显示面板1和驱动电路板11，并且板状体13A在设置在两个位置的折射线13DA，13DB上沿朝向平面显示面板1的前方突出的方向弯曲。

公开(公告)号：US20040094835A1

公开(公告)日：2004-05-20

申请号：US10295096

申请日：2002-11-14

Applicant: The Regents of the University of California

Inventor： Mariam N. Maghribi ,  Peter Krulevitch ,  Julie Hamilton

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: H01L23/145 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0313 ,  H05K2201/0133 ,  H05K2201/0162 ,  H01L2924/00

Abstract: A system for providing metal features on silicone comprising providing a silicone layer on a matrix and providing a metal layer on the silicone layer. An electronic apparatus can be produced by the system. The electronic apparatus comprises a silicone body and metal features on the silicone body that provide an electronic device.

Abstract translation: 一种用于在硅树脂上提供金属特征的系统，包括在基体上提供硅树脂层，并在硅树脂层上提供金属层。 电子设备可以由系统生产。 电子设备包括硅树脂体和硅树脂体上提供电子设备的金属特征。