公开(公告)号：US20040166305A1

公开(公告)日：2004-08-26

申请号：US10700343

申请日：2003-11-03

Inventor： Murali Sethumadhavan ,  Vincent R. Landi ,  Bruce G. Kosa

IPC: B32B015/06

CPC classification number: H05K1/032 ,  B32B27/04 ,  C08K3/22 ,  C08K3/36 ,  C08K5/14 ,  C08L9/00 ,  C08L27/12 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/24917 ,  Y10T428/249933 ,  Y10T428/25 ,  Y10T428/3154 ,  Y10T428/31605 ,  Y10T428/31609 ,  Y10T428/31707 ,  C08L2666/04

Abstract: An electrical circuit material having a conductive layer disposed a substrate, wherein the substrate is formed from a thermosetting composition comprising a polybutadiene or polyisoprene resin; an optional, functionalized liquid polybutadiene or polyisoprene resin; an optional butadiene- or isoprene-containing copolymer; an optional low molecular weight polymer; an optional curing agent; a cross-linking agent; a particulate fluoropolymer; and about 20 to about 50 percent by weight, based on the total weight of the thermosetting composition, of a magnesium hydroxide having a low ionic content. Use of magnesium hydroxide allows the composition to attain a high level of flame retardancy without use of halogenated flame retardants, while maintaining good moisture absorption and other physical properties.

Abstract translation: 一种电路材料，其具有设置在衬底上的导电层，其中所述衬底由包含聚丁二烯或聚异戊二烯树脂的热固性组合物形成; 任选的官能化液体聚丁二烯或聚异戊二烯树脂; 任选的含丁二烯或含异戊二烯的共聚物; 任选的低分子量聚合物; 任选的固化剂; 交联剂; 颗粒状含氟聚合物; 和约20至约50重量％，基于热固性组合物的总重量，具有低离子含量的氢氧化镁。 使用氢氧化镁可使组合物达到高水平的阻燃性，而不使用卤化阻燃剂，同时保持良好的吸湿性和其他物理性能。

公开(公告)号：US06758389B1

公开(公告)日：2004-07-06

申请号：US10069513

申请日：2002-03-04

Applicant: Syunji Odaka ,  Yutaka Fukatsu

Inventor： Syunji Odaka ,  Yutaka Fukatsu

IPC: B23K120

CPC classification number: H05K3/3452 ,  B23K35/224 ,  B23K35/3613 ,  B23K35/3616 ,  H05K3/3489 ,  H05K2201/015 ,  H05K2203/122

Abstract: A composition for preventing creeping for a flux for soldering, which is free from a problem from the viewpoint of the global environment or working environment is provided. The composition comprising a polymer (A) containing the polymer units (a1) derived from an unsaturated ester containing a polyfluroalkyl group and the polymer units (b1) derived from a compound containing a silicon atom and an unsaturated group, and an aqueous medium (B), further optionally including a fluorine type surfactant (c).

Abstract translation: 提供了一种用于防止从全球环境或工作环境的角度出发，没有问题的用于焊接的焊剂的蠕变的组合物。 包含含有源自含有聚氟烷基的不饱和酯的聚合物单元（a 1）和由含有硅原子和不饱和基团的化合物衍生的聚合物单元（b 1））的聚合物（A）的组合物， 和水性介质（B），还可任选地包含氟型表面活性剂（c）。

公开(公告)号：US20040124405A1

公开(公告)日：2004-07-01

申请号：US10663375

申请日：2003-09-16

Inventor： Murali Sethumadhavan ,  Richard T. Traskos ,  Michael E. St. Lawrence ,  Sankar K. Paul ,  Luis D. Borges ,  Allen F. Horn III

IPC: H01L047/00

CPC classification number: B32B15/04 ,  B32B7/12 ,  B32B15/20 ,  B32B27/12 ,  B32B27/20 ,  B32B27/365 ,  B32B37/153 ,  B32B2037/243 ,  B32B2307/204 ,  B32B2307/3065 ,  B32B2307/704 ,  B32B2311/12 ,  B32B2369/00 ,  B32B2457/00 ,  C08K3/36 ,  C08L27/18 ,  C08L67/00 ,  C09K19/38 ,  C09K19/54 ,  C09K2219/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4626 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10T428/1086 ,  Y10T428/1095 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/252 ,  Y10T428/254 ,  C08L2666/04

Abstract: A liquid crystalline composite comprising a liquid crystalline polymer, particulate filler, and fibrous web. Further disclosed is a method for forming the liquid crystalline polymer composite. The liquid crystalline polymer composite is useful in circuit materials, circuits, and multi-layer circuits, economical to make, and has excellent flame retardant properties.

Abstract translation: 包含液晶聚合物，颗粒填料和纤维网的液晶复合材料。 进一步公开了形成液晶聚合物复合材料的方法。 液晶聚合物复合材料在电路材料，电路和多层电路中是有用的，制造经济，并且具有优异的阻燃性能。

公开(公告)号：US20040099958A1

公开(公告)日：2004-05-27

申请号：US10301124

申请日：2002-11-21

Inventor： William R. Schildgen ,  Robin E. Gorrell ,  Michael D. Holcomb ,  William V. Ballard ,  Mark F. Sylvester

IPC: H01L023/48 ,  H01L023/52 ,  H01L029/40 ,  H01L023/12

CPC classification number: H05K1/0271 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/0116 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H01L2224/0401

Abstract: An interconnect module providing conductive interconnection paths between an integrated chip, a printed wiring board, and at least one layer within the module, incorporating a plurality of alternating dielectric and conductive layers laminated together to form a unitary structure. The module includes a chip attach surface and a board attach surface, that define contact pads for attachment to corresponding pads on the chip and printed wiring board, respectively, by means of solder balls.

Abstract translation: 一种互连模块，其在集成芯片，印刷线路板和模块内的至少一个层之间提供导电互连路径，并入多个交替的电介质层和导电层，以形成一体结构。 该模块包括芯片连接表面和板连接表面，其分别通过焊球限定接触垫，以分别连接到芯片和印刷线路板上的相应焊盘。

公开(公告)号：US20040056233A1

公开(公告)日：2004-03-25

申请号：US10617117

申请日：2003-07-10

Inventor： Michael Robert Samuels ,  Michael Joseph Molitor

IPC: C09K019/52 ,  C09K019/54

CPC classification number: C09K19/52 ,  C09K19/00 ,  C09K19/38 ,  C09K19/542 ,  H01B3/305 ,  H01B3/445 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0224 ,  H05K2201/0254

Abstract: Disclosed are liquid crystalline polymer compositions, which are melt moldable, and which contain a perfluorinated polymer, and a particulate aramid, and optionally contain hollow glass or quartz spheres, and which usually have low dielectric constants. They are particularly useful as electrical connectors and substrates for other electronic applications which use high frequency signals.

Abstract translation: 公开了液态聚合物组合物，其是可熔融模塑的，并且其含有全氟化聚合物和芳族聚酰胺颗粒，并且任选地包含中空玻璃或石英球，并且通常具有低介电常数。 它们特别适用于使用高频信号的其他电子应用的电连接器和基板。

公开(公告)号：US20030216490A1

公开(公告)日：2003-11-20

申请号：US10460000

申请日：2003-06-12

Applicant: International Business Machines Corporation

Inventor： Donald S. Farquhar ,  Konstantinos I. Papathomas

IPC: C08K003/34

CPC classification number: H05K1/056 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/143 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/3154

Abstract: A composition usable in hole filling of a metal layer and to planarize the metal layer is provided. The metal layer is part of a substrate which can be part of a multilayer printed circuit board or chip carrier. The composition comprises a fluoropolymer dielectric metal, a filler material, and a coupling agent, the filler material having at least a partial coating of the coupling agent.

Abstract translation: 提供了可用于金属层的孔填充和使金属层平坦化的组合物。 金属层是可以是多层印刷电路板或芯片载体的一部分的基板的一部分。 该组合物包含含氟聚合物介电金属，填料和偶联剂，该填料至少具有偶联剂的部分涂层。

公开(公告)号：US20030082363A1

公开(公告)日：2003-05-01

申请号：US10280762

申请日：2002-10-24

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Yasushi Nakagiri ,  Takeshi Suzuki ,  Fumio Echigo

IPC: B32B003/00

CPC classification number: B32B5/26 ,  B32B3/266 ,  B32B5/022 ,  B32B15/14 ,  B32B2250/05 ,  B32B2250/40 ,  H05K1/036 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10378 ,  H05K2203/0759 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/249971

Abstract: The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of an insulating layer. The present invention also provides a method for manufacturing the prepreg and the circuit board. The prepreg of the present invention includes a laminate including at least one first layer and at least one second layer. The first layer is an insulating layer that includes a resin. The second layer has pores that connect an upper and a lower surface of the second layer, and the upper and the lower surface of the second layer differ from each other in at least one selected from open are ratio and average pore diameter. Using this prepreg makes it possible to provide a circuit board that is characterized, e.g., by low interstitial via connection resistance, excellent connection stability, and high durability.

Abstract translation: 本发明提供一种预浸料和电路板，其可以通过连接电阻实现例如低间隙，优异的连接稳定性和高耐久性，而不管材料，物理性质以及绝缘层的材料的组合。 本发明还提供了一种制造预浸料和电路板的方法。 本发明的预浸料包括包含至少一个第一层和至少一个第二层的层压体。 第一层是包括树脂的绝缘层。 第二层具有连接第二层的上表面和下表面的孔，并且第二层的上表面和下表面在选自开口比和平均孔径中的至少一个中彼此不同。 使用这种预浸料可以提供一种电路板，其特征在于例如通过连接电阻的低间隙，良好的连接稳定性和高的耐久性。

公开(公告)号：US20030045164A1

公开(公告)日：2003-03-06

申请号：US09506318

申请日：2000-02-17

Inventor： Fumio Echigo ,  Yoshihiro Kawakita

IPC: B32B005/16 ,  B32B027/02

CPC classification number: D21H13/20 ,  B29C70/12 ,  D04H1/587 ,  D04H1/60 ,  D04H1/64 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/015 ,  H05K2201/0175 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/27 ,  Y10T442/2861 ,  Y10T442/2902

Abstract: The present invention provides a nonwoven fabric material prepared from short fibers including thermal-resistant synthetic fibers bound with an inorganic binder, a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed.

Abstract translation: 本发明提供一种由短纤维制成的无纺布材料，包括与无机粘合剂结合的耐热合成纤维，预浸料和使用其的电路板。 电路板即使在高温下也具有优异的尺寸稳定性，并且防止电路板翘曲或被吸湿等损坏。 无机粘合剂是由低熔点玻璃溶液或至少包含分散在其中的至少一种纤维或低熔点玻璃颗粒的水分散性胶体溶液形成的残留物。 当使用粘合剂时，形成通过硅氧烷键合的化学共价键合。

公开(公告)号：US06395374B1

公开(公告)日：2002-05-28

申请号：US09579915

申请日：2000-05-26

Applicant: Joseph McAndrew ,  James J. Logothetis

Inventor： Joseph McAndrew ,  James J. Logothetis

IPC: H05K118

CPC classification number: H05K1/186 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49805 ,  H01L23/49894 ,  H01L23/5389 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H05K1/034 ,  H05K1/167 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/015 ,  H05K2201/10674 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T156/1057 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24562 ,  Y10T428/24661 ,  Y10T428/24802 ,  Y10T428/3154 ,  H01L2924/00

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract translation: 提供了一个平台，用于制造微波，多层集成电路和微波，多功能模块。 制造过程包括使用熔融粘合将含氟聚合物复合基材粘合成多层结构。 具有嵌入式半导体器件，蚀刻电阻器和电路图案以及电镀通孔的键合多层形成独立的表面贴装模块。 如果可能，膜结合或熔接可用于覆盖具有一层或多层的包括嵌入式有源半导体器件的嵌入式半导体器件。

公开(公告)号：US20020045394A1

公开(公告)日：2002-04-18

申请号：US09983614

申请日：2001-10-25

Inventor： Osamu Noda ,  Hideo Hatanaka ,  Kazunori Sakamoto ,  Masanaru Hasegawa

IPC: B32B005/02 ,  B32B027/04

CPC classification number: B32B3/10 ,  B32B5/02 ,  B32B7/12 ,  B32B27/04 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/20 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/462 ,  H05K3/4623 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T428/24273 ,  Y10T428/24917 ,  Y10T442/2418 ,  Y10T442/2992 ,  Y10T442/674 ,  H01L2924/00

Abstract: In a wiring board, predetermined wiring patterns which are formed on both sides of an insulation substrate are electrically connected by an electrically conductive material provided in through holes formed through the insulation substrate. The insulation substrate is composed of a resin impregnated fibrous sheet and a heat resistant film. The present invention solves the problems of the wiring board which are caused by irregularities on the surface of the resin impregnated fibrous sheet. The problems include insufficient adhesion strength between the wiring pattern and the insulation substrate or the limitation of fineness of the wiring pattern due to the irregularities on the surface of the printed wiring board which are formed upon the thermocompression bonding process.

Abstract translation: 在布线板中，形成在绝缘基板两侧的预定布线图案由设置在通过绝缘基板形成的通孔中的导电材料电连接。 绝缘基板由树脂浸渍纤维片和耐热膜构成。 本发明解决了由树脂浸渍的纤维片材的表面上的不规则性引起的布线板的问题。 这些问题包括布线图案和绝缘基板之间粘合强度不足或由于热压接工艺形成的印刷电路板表面上的不规则性引起的布线图案细度的限制。