公开(公告)号：US07144754B2

公开(公告)日：2006-12-05

申请号：US10856777

申请日：2004-06-01

Applicant: Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

Inventor： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC: H01L21/50

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

Abstract translation: 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US07132029B2

公开(公告)日：2006-11-07

申请号：US11226142

申请日：2005-09-14

Applicant: Yasuhiro Nakatani ,  Hideki Higashitani ,  Tadashi Nakamura ,  Fumio Echigo

Inventor： Yasuhiro Nakatani ,  Hideki Higashitani ,  Tadashi Nakamura ,  Fumio Echigo

IPC: B29C65/00 ,  B29C47/00

CPC classification number: H05K3/4614 ,  H05K1/113 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/09045 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/068 ,  H05K2203/1461 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/24917

Abstract: It is an object of the present invention to provide a multilayer circuit board, and a method for manufacturing the same, in which a plurality of circuit boards are layered, wherein as regards at least one circuit board positioned on an outer side, a conductive substance is filled into holes passing through the circuit board in the thickness direction and cured, and the wiring layers of the plurality of circuit boards are electrically connected by the conductive substance that has been cured, wherein in the multilayer circuit board, the wiring layer positioned outside the conductive substance that has been cured projects outward from its surroundings. Thus, the conductive paste is sufficiently compressed during hot pressing to yield a stable electrical connection, and thermosetting resin can be filled in between the inner layer wiring pattern without leaving gaps.

公开(公告)号：US20060183358A1

公开(公告)日：2006-08-17

申请号：US10541038

申请日：2004-08-24

Applicant: Mitsuru Iida ,  Mitsutaka Abe ,  Hidetaka Mori

Inventor： Mitsuru Iida ,  Mitsutaka Abe ,  Hidetaka Mori

IPC: H01R12/00

CPC classification number: H05K1/119 ,  H01R13/66 ,  H01R29/00 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/183 ,  H05K3/403 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10189

Abstract: In a connector with a component built-in, a base member is formed of three-dimensional formation circuit substrate, and has a fitting portion that is to be fitted to a connector of counterpart. Terminals electrically connected to a wiring pattern on a mother board, contacts electrically connected to contacts of the connector of counterpart, and a conductive pattern electrically connected to the electronic component are formed on a surface of the base member. Thus, the conductive pattern can easily be modified depending on application, and it is possible to provide complicated wirings. Furthermore, since the electronic component is mounted on the base member, it is possible to make the connector embed a lot of electronic components, and degrees of freedom of design are increased. Still furthermore, the electronic component can be connected by reflow soldering, so that mounting workability of the electronic component is increased.

Abstract translation: 在具有内置部件的连接器中，基部构件由三维形成电路基板形成，并且具有拟配合到对应件的连接器的装配部分。 电连接到母板上的布线图案的端子形成在电连接到对应物的连接器的触点的触点上，并且电连接到电子部件的导电图案形成在基底构件的表面上。 因此，可以根据应用容易地改变导电图案，并且可以提供复杂的布线。 此外，由于电子部件安装在基座部件上，因此能够使连接器嵌入大量的电子部件，能够提高设计自由度。 此外，可以通过回流焊接来连接电子部件，从而提高电子部件的安装加工性。

公开(公告)号：US20060094159A1

公开(公告)日：2006-05-04

申请号：US11301807

申请日：2005-12-13

Applicant: Teck Lee

Inventor： Teck Lee

IPC: H01L21/50

CPC classification number: H01L23/13 ,  G06F1/18 ,  G06F1/183 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83385 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09481 ,  H05K2201/10719 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration. A computer system incorporating an electronic device package with an interposer according to the present invention is also disclosed.

Abstract translation: 公开了用于安装半导体管芯的插入件的各种实施例以及用于形成插入件的方法。 插入器包括由插入器的芯材料形成的柔性焊盘元件，使得插入器可以吸收热诱导的应力并且符合​​翘曲或不平坦的表面。 还公开了包括安装到内插器并且电连接到插入器的半导体管芯的电子器件封装的实施例以及用于形成电子器件封装的方法。 在一个电子器件封装中，半导体管芯通过连接到插入器的布线层上的引线电连接到插入器。 在另一个电子器件封装中，半导体管芯通过以倒装芯片配置将半导体管芯连接到插入器的柔性焊盘元件而电连接到插入器。 还公开了一种结合根据本发明的具有插入器的电子器件封装的计算机系统。

公开(公告)号：US20050176242A1

公开(公告)日：2005-08-11

申请号：US10623495

申请日：2003-07-22

Applicant: Takeo Kawase

Inventor： Takeo Kawase

IPC: B05D7/00 ,  B05D1/26 ,  B05D5/12 ,  B41M3/00 ,  H01L21/28 ,  H01L21/288 ,  H01L29/786 ,  H05K3/12 ,  H01L21/4763 ,  H01L21/31 ,  H01L21/469

CPC classification number: H05K3/1258 ,  B41M3/006 ,  H05K3/125 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/013

Abstract: A substrate is patterned by forming an indent region 8 in the surface 10 of a substrate 4 and depositing a liquid material onto the surface 10 at selected locations adjacent to the indent region 8. The liquid material spreads over the surface to an edge of the indent region, at which point further spreading is controlled by the effective enhancement of the contact angle of the liquid material relative to the surface as provided by the indent region.

Abstract translation: 通过在衬底4的表面10中形成凹陷区域8并在与凹口区域8相邻的选定位置处将液体材料沉积到表面10上来对衬底进行构图。 液体材料在表面上扩散到凹陷区域的边缘，此时通过凹陷区域提供的液体材料相对于表面的接触角的有效增强来控制进一步的扩展。

公开(公告)号：US06901852B2

公开(公告)日：2005-06-07

申请号：US10784853

申请日：2004-02-23

Applicant: John J. Michiels ,  Darryl M. Stansbury

Inventor： John J. Michiels ,  Darryl M. Stansbury

IPC: B41M1/12 ,  B41M1/34 ,  B41M3/00 ,  H01C1/00 ,  H01J9/02 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12 ,  H05K3/24 ,  H05K3/46

CPC classification number: B41M1/12 ,  B41M1/34 ,  B41M3/006 ,  H01J29/92 ,  H01L51/0004 ,  H05K1/092 ,  H05K1/181 ,  H05K3/1233 ,  H05K3/248 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09045 ,  H05K2201/09981 ,  H05K2203/0264

Abstract: Method for screen printing a continuous structure on a substrate wherein the screen printed structure extends from at least a first level to at least a second level. The disclosed method is particularly suitable for the fabrication of microelectronic devices and components thereof including the fabrication of field emission display devices. Preferably, a print screen of a preferred thickness having a preconfigured print pattern formed therethrough, in combination with a squeegee having a hardness within a preferred range, are used to force a screen printable substance onto a substrate while maintaining a portion of the print screen within a preferred reference angle. The resulting screen printed structure extends from at least one lower level to at least one upper level in a continuous “uphill” manner.

Abstract translation: 在基板上丝网印刷连续结构的方法，其中丝网印刷结构从至少第一层延伸到至少第二层。 所公开的方法特别适用于制造微电子器件及其组件，包括制造场致发射显示器件。 优选地，使用具有通过其形成的预配置印刷图案的优选厚度的印刷丝网与具有优选范围内的硬度的刮板组合，以将丝网印刷物质强制在基材上，同时将印刷丝网的一部分保持在 优选的参考角度。 所得到的丝网印刷结构以连续的“上坡”方式从至少一个下层延伸到至少一个上层。

公开(公告)号：US06783652B2

公开(公告)日：2004-08-31

申请号：US09997665

申请日：2001-11-26

Applicant: Takahiro Iijima ,  Akio Rokugawa ,  Yasuyoshi Horikawa

Inventor： Takahiro Iijima ,  Akio Rokugawa ,  Yasuyoshi Horikawa

IPC: C25D502

CPC classification number: H05K3/045 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/005 ,  H05K3/107 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/426 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0108

Abstract: A resin plate having wiring pattern recesses and via through holes is made. All of the surfaces of the resin plate including inner walls of the wiring pattern recesses and via through holes are coated with a metal film. An electro-plating is applied using the metal film as a power-supply layer to fill a plated metal into the wiring pattern recesses and via through holes. The metal film formed on the resin plate except for the inner walls of the wiring pattern recesses and via through holes is removed, so that wiring pattern and via are exposed on a surface the same as that of the resin plate.

Abstract translation: 制成具有布线图形凹部和通孔的树脂板。 包括布线图案凹槽的内壁和通孔的树脂板的所有表面均涂覆有金属膜。 使用金属膜作为电源层施加电镀，以将电镀金属填充到布线图案凹部和通孔中。 去除了除了布线图形凹部和通路孔的内壁之外的树脂板上形成的金属膜，使得布线图案和通路露出在与树脂板相同的表面上。

公开(公告)号：US06739028B2

公开(公告)日：2004-05-25

申请号：US09905794

申请日：2001-07-13

Applicant: Daniel F. Sievenpiper ,  Joseph L. Pikulski ,  James H. Schaffner ,  Tsung-Yuan Hsu

Inventor： Daniel F. Sievenpiper ,  Joseph L. Pikulski ,  James H. Schaffner ,  Tsung-Yuan Hsu

IPC: H01G700

CPC classification number: H05K1/162 ,  H01Q15/008 ,  H01Q15/14 ,  H01Q15/141 ,  H05K1/0284 ,  H05K3/045 ,  H05K3/4614 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09672 ,  H05K2201/09981 ,  H05K2203/0455 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49174

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract translation: 高阻抗表面及其制造方法。 该表面包括具有其中的重复图案的模制结构和侧壁表面的重复图案，所述孔贯穿其第一和第二主表面之间的结构以及连接第一主表面的侧壁表面。 金属层放置在所述模制结构上，金属层在孔中，覆盖第二主表面的至少一部分，覆盖第一主表面的侧壁和部分，以通过金属层将侧壁与其它侧壁互连 在第二个主表面和孔中。

公开(公告)号：US06730854B2

公开(公告)日：2004-05-04

申请号：US10270643

申请日：2002-10-16

Applicant: Yukio Yokoyama

Inventor： Yukio Yokoyama

IPC: H05K704

CPC classification number: H05K3/202 ,  H05K1/0271 ,  H05K1/0284 ,  H05K3/301 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10454 ,  H05K2201/2009 ,  H05K2201/2036

Abstract: A resin-formed substrate is provided which has a component side for mounting an electronic component thereon, and a solder side for soldering thereto a lead extending from the electronic component, which is the reverse to the component side, the resin-formed substrate comprising a metal frame forming an electronic circuit pattern; and a resin covering the metal frame, the resin having an aperture formed therein, for exposing a portion of the metal frame, wherein the portion of the metal frame exposed through the aperture serves as an electrode portion for mounting of the electronic component, wherein the resin has a rib integrally formed on the component side, thereby suppressing warp of the resin-formed substrate due to a temperature difference made between a component side and a solder side during soldering.

Abstract translation: 提供一种树脂成形基板，其具有用于在其上安装电子部件的部件侧，以及用于焊接从与部件侧相反的电子部件延伸的引线的焊料侧，所述树脂形成基板包括 金属框架形成电子电路图案; 以及覆盖金属框架的树脂，其中形成有孔的树脂用于暴露金属框架的一部分，其中通过孔露出的金属框架的部分用作用于安装电子部件的电极部分，其中， 树脂具有在部件侧一体形成的肋，从而由于在焊接期间由于部件侧和焊料侧之间的温差而抑制树脂成形基板的翘曲。

公开(公告)号：US20040081921A1

公开(公告)日：2004-04-29

申请号：US10453392

申请日：2003-06-03

Inventor： Yudai Yamashita

IPC: G03C005/00

CPC classification number: B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0035 ,  H05K3/0082 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2203/0108 ,  H05K2203/056 ,  Y10S438/942 ,  Y10S438/945 ,  Y10S438/948

Abstract: It is an major object to ravel out the drawbacks that it is difficult to form a sectional shape of a metal pattern in square and it is also difficult to obtain a constant line width in the conventional full additive method and semi additive method, and to solve the problem that it is difficult to secure dimensional accuracy and positional accuracy at a high level in the above method using conductive ink and a photoresist since this method is carried out by utilizing printing. To attain the above object, in the present invention, a conductive pattern 12a is obtained by forming concavo-convex on a substrate 1 by using a pattern substrate 4, and forming a conductive thin layer 9, then coating with a layer 10 of a photosensitive resin, exposing and developing by using the pattern substrate 4 again to bare a conductive thin layer 9a on the convex portion and carrying out electrolytic plating. The conductive thin layer 9 and the layer of the photosensitive resin on the concave portion may be removed.

Abstract translation: 解决难以在正方形中形成金属图案的截面形状的困难的主要目的是，在常规的全添加法和半添加法中也难以获得恒定的线宽，并且解决 在上述使用导电油墨和光致抗蚀剂的方法中难以确保尺寸精度和位置精度难以确保的问题，因为该方法是通过利用印刷进行的。 为了实现上述目的，在本发明中，通过使用图形基板4在基板1上形成凹凸，并形成导电薄层9，然后用感光层10涂覆导电图案12a 树脂，通过使用图案基板4再次曝光和显影，以在凸部上露出导电薄膜9a并进行电镀。 可以去除导电薄层9和凹部上的感光树脂层。