公开(公告)号：US07854367B2

公开(公告)日：2010-12-21

申请号：US12833191

申请日：2010-07-09

Applicant: Hideaki Sakaguchi ,  Kiyoaki Iida

Inventor： Hideaki Sakaguchi ,  Kiyoaki Iida

IPC: B23K31/02

CPC classification number: H01L24/742 ,  B23K3/0623 ,  B23K2101/36 ,  H01L21/4853 ,  H01L24/13 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13561 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/104 ,  H01L2924/014 ,  H01L2224/05599

Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.

Abstract translation: 用于布置磁性焊球的装置包括：用于在其上放置和固定基板的台; 磁体，其被并入所述平台中并且可与所述放置和固定的基板的下表面平行移动，以使磁力沿所述平台的向上方向作用; 以及能够定位在舞台上方的面罩框架。 还提供了一种使用该布置装置的布置方法。 用于布置磁性焊球的装置包括：用于在其上放置和固定基板的台; 能够定位在舞台上方的面罩框架; 以及可在掩模框架上方移动并使磁力作用在台架上的磁性发生器。 还提供了一种使用该布置装置的布置方法。

公开(公告)号：US07807510B2

公开(公告)日：2010-10-05

申请号：US12123744

申请日：2008-05-20

Applicant: Toshio Kobayashi

Inventor： Toshio Kobayashi

IPC: H01L23/31 ,  H01L21/70

CPC classification number: H05K1/144 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/1322 ,  H01L2924/00012 ,  H01L2924/00

Abstract: There are provided the steps of connecting a chip component 13 to a first substrate 10 through a wire 14, providing an electrode 21 on a second substrate 20, attaching, to the first substrate 10, a molding tool 30 having a protruded portion 31 formed corresponding to an array of a bump connecting pad 12 of the first substrate 10 and a cavity 32 formed corresponding to a region in which the chip component 13 is mounted, thereby forming a first sealing resin 34 for sealing the chip component 13 and the wire 14, bonding the electrode 21 to the bump connecting pad 12 through a solder, thereby bonding the first substrate 10 to the second substrate 20, and filling a second filling resin 40 in a clearance portion between the first substrate 10 and the second substrate 20.

Abstract translation: 提供了通过线14将芯片部件13连接到第一基板10的步骤，在第二基板20上提供电极21，将电极21附接到第一基板10，模制工具30具有对应形成的突出部分31 涉及第一基板10的凸块连接焊盘12的阵列和与安装芯片部件13的区域对应地形成的空腔32，由此形成用于密封芯片部件13和导线14的第一密封树脂34， 通过焊料将电极21接合到凸块连接焊盘12，从而将第一基板10接合到第二基板20，并且将第二填充树脂40填充在第一基板10和第二基板20之间的间隙部分中。

公开(公告)号：US20100068466A1

公开(公告)日：2010-03-18

申请号：US12210920

申请日：2008-09-15

Applicant: Hau NGUYEN

Inventor： Hau NGUYEN

IPC: B32B3/22 ,  B23K35/14 ,  B23K1/20

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US20090095520A1

公开(公告)日：2009-04-16

申请号：US12247471

申请日：2008-10-08

Applicant: Katsuya Fukase ,  Kishio Yokouchi ,  Hideaki Yoshimura

Inventor： Katsuya Fukase ,  Kishio Yokouchi ,  Hideaki Yoshimura

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/4046 ,  H05K3/4602 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10416 ,  Y10T29/49124

Abstract: There is provided a wiring substrate. The wiring substrate includes: a core substrate formed of a conductive material and having a through hole therein; an insulating layer formed on first and second surfaces of the core substrate; wiring patterns formed on the first and second surfaces via the insulating layer; and a via formed in the through hole and electrically connected to the wiring patterns. The via includes: a conductor ball and a conductor portion. The conductor ball has a conductive surface and an insulating member covering the conductive surface. A portion of the conductive surface is exposed from the insulating member. The conductor portion is electrically connected to the exposed conductive surface and the wiring patterns. At least one of the insulating member and the insulating layer is interposed between the via and the core substrate.

Abstract translation: 提供了布线基板。 布线基板包括：由导电材料形成并在其中具有通孔的芯基板; 绝缘层，形成在所述芯基板的第一和第二表面上; 通过绝缘层在第一和第二表面上形成的布线图案; 以及形成在通孔中并且电连接到布线图案的通孔。 通孔包括：导体球和导体部分。 导体球具有导电表面和覆盖导电表面的绝缘构件。 导电表面的一部分从绝缘构件露出。 导体部分电连接到暴露的导电表面和布线图案。 绝缘构件和绝缘层中的至少一个介于通路和芯基板之间。

公开(公告)号：US20090075469A1

公开(公告)日：2009-03-19

申请号：US11855236

申请日：2007-09-14

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L21/44

CPC classification number: H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

Abstract translation: 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。

公开(公告)号：US20090072370A1

公开(公告)日：2009-03-19

申请号：US12205057

申请日：2008-09-05

Applicant: Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

Inventor： Michio HORIUCHI ,  Fumimasa KATAGIRI ,  Shigeaki SUGANUMA ,  Yasue TOKUTAKE ,  Jun YOSHIKE

IPC: H01L23/495 ,  H01L21/00

CPC classification number: H01L23/49861 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2223/6611 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/48091 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48699 ,  H01L2224/48755 ,  H01L2224/48764 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/73204 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19051 ,  H01L2924/19107 ,  H01L2924/20753 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K3/222 ,  H05K3/4046 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10234 ,  H05K2201/10287 ,  H05K2203/0733 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/00

Abstract: There is provided a multilayer wiring substrate on which at least one semiconductor element is mounted. The multilayer wiring substrate includes: a baseboard; a first wiring layer formed on the baseboard and having a plurality of first wiring portions; an insulating layer formed on the baseboard; a second wiring layer formed on the insulating layer and having a plurality of second wiring portions, the second wiring portions being electrically connected to each other via a conductor wire, the conductor wire being arranged within the insulating layer three-dimensionally in a curved manner; and conductor portions configured to pass through the insulating layer and connecting the first wiring portions and the second wiring portions.

Abstract translation: 提供了一种其上安装有至少一个半导体元件的多层布线基板。 多层布线基板包括：基板; 形成在所述基板上并具有多个第一布线部的第一布线层; 形成在基板上的绝缘层; 形成在所述绝缘层上并且具有多个第二布线部的第二布线层，所述第二布线部经由导体布线彼此电连接，所述导线以三维方式弯曲地布置在所述绝缘层内; 以及导体部，被配置为穿过所述绝缘层并连接所述第一布线部和所述第二布线部。

公开(公告)号：US20080303149A1

公开(公告)日：2008-12-11

申请号：US10593535

申请日：2005-01-21

Applicant: Toshiharu Takayama ,  Ryuusuke Suzuki ,  Takefumi Nakamori

Inventor： Toshiharu Takayama ,  Ryuusuke Suzuki ,  Takefumi Nakamori

IPC: H01L23/488

CPC classification number: H01C1/16 ,  H01C1/144 ,  H01C13/02 ,  H01G4/40 ,  H01L23/49816 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10045 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic component including, on one surface of a substrate (1), a plurality of circuit elements and external terminals each consisting of a conductive protrusion (9) for the circuit elements is provided with a structure capable of resisting an external force after mounting. Each of the circuit elements includes, as constituent elements, a pair of electrodes (2) and a resistive element (3) or a dielectric contacting with the pair of electrodes (2), each circuit element is covered with an overcoat (7) while the electrodes (2) are partially exposed as lands (4), the conductive protrusion (9) includes a fixedly bonding member, the conductive protrusion (9) is fixedly bonded to each of the lands (4) by the fixedly bonding member, at least three lands (4b) of the lands (4) are larger in area than the other lands (4a), the electronic component can stand alone while the conductive protrusion (9) contacts with a flat if the conductive protrusion (9) is fixedly bonded only to each of the larger-area lands (4b), and the conductive protrusions are all formed by fixedly bonding conductive balls (10) substantially equal in size to entire surfaces of the respective lands (4).

Abstract translation: 一种电子部件，在基板（1）的一个表面上具有由电路元件用的导电突起（9）构成的多个电路元件和外部端子，其具有能够抵抗安装后的外力的结构。 每个电路元件包括作为组成元件的一对电极（2）和电阻元件（3）或与该对电极（2）接触的电介质，每个电路元件被外涂层（7）覆盖，同时 电极（2）部分地露出为焊盘（4），导电突起（9）包括固定接合部件，导电突起（9）通过固定接合部件固定地接合到每个焊盘（4）上， 如果导电突起（9）固定地，导电突起（9）与平坦接触，则电子部件可以独立地平坦地区域（4）中的至少三个焊盘区域（4b）的面积大于其他焊盘（4a） 仅与每个较大区域焊盘（4b）接合，并且导电突起全部通过将导电球（10）固定地结合到大致相等于各个焊盘（4）的整个表面上而形成。

公开(公告)号：US20080251281A1

公开(公告)日：2008-10-16

申请号：US11733840

申请日：2007-04-11

Applicant: Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

Inventor： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC: H05K1/03 ,  H01K3/10

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

Abstract translation: 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US07433201B2

公开(公告)日：2008-10-07

申请号：US10765772

申请日：2004-01-26

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H05K7/10

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L23/49555 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H05K1/111 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/29099 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environments such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

Abstract translation: 本发明公开了可用于增强电子设备的可靠性和延长使用寿命的设计概念和方法和方法，以及包括这些设备的组件以及衬底和/或PCB，特别是如果这样的组件暴露于恶劣环境，例如 热循环或动力循环。 本发明的主要目的是在附接的部件之间提供诸如柱之类的柔性接头，并且优选地定向这些接头，使得它们向组件的热中心或固定点呈现其最柔软的弯曲方向。 具有矩形或细长横截面的接头是优选的，并且它们应该被定向成使得每个接头的宽面将面向热中心，垂直于从热中心朝向每个相应接头的中心发出的热变形射线。 这些概念同样适用于无引线封装以及引线封装。

公开(公告)号：US20080237302A1

公开(公告)日：2008-10-02

申请号：US12011565

申请日：2008-01-25

Applicant: Kazuo Kinoshita

Inventor： Kazuo Kinoshita

IPC: B23K1/00

CPC classification number: H05K3/3436 ,  H05K3/3463 ,  H05K3/363 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2201/2036 ,  H05K2203/048 ,  Y02P70/613

Abstract: The camera module structure (10) of the present invention is arranged such that a board electrode (2) of a printed board (1) and a mounting electrode (4) of a camera module (3) mounted on the printed board (1) are joined with each other through a solder joint section (5), and the board electrode (2) and the mounting electrode (4) are aligned by self-alignment. The solder joint section (5) includes a solder section (16) for solder-joining, and a supporting section (17) for supporting the camera module (3). The present invention realizes a solder mounting structure wherein a heavy-weight component is joined on the board with solder by self-alignment.

Abstract translation: 本发明的相机模块结构（10）被布置成使得印刷板（1）的板电极（2）和安装在印刷板（1）上的相机模块（3）的安装电极（4） 通过焊接部分（5）彼此连接，并且板电极（2）和安装电极（4）通过自对准排列。 焊接部分（5）包括用于焊接的焊接部分（16）和用于支撑相机模块（3）的支撑部分（17）。 本发明实现了一种焊料安装结构，其中通过自对准将重量份的组分与焊料接合在板上。