公开(公告)号：US20090236567A1

公开(公告)日：2009-09-24

申请号：US12311289

申请日：2007-09-11

Applicant: Kozo Ogi ,  Taku Okano

Inventor： Kozo Ogi ,  Taku Okano

IPC: H01B1/20 ,  B05D5/12

CPC classification number: B82Y30/00 ,  B22F1/0022 ,  B22F1/0062 ,  B22F9/24 ,  B22F2998/00 ,  H01B1/02 ,  H01B1/22 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2201/0266 ,  H05K2203/1131

Abstract: A powder of silver particles having an organic protective film, which has a broad particle size distribution of such that the CV value, as computed according to the following formula (1) in which the particle diameter is determined by TEM (transmission electromicroscopy), is at least 40%. The organic protective film comprises, for example, a fatty acid (oleic acid, etc.) having a molecular weight of from 100 to 1000 and an amine compound having a molecular weight of from 100 to 1000, and at least any one of the fatty acid and the amine compound has at least one unsaturated bond in one molecule. CV=100×[standard deviation of particle diameter, σD]/[mean particle diameter, DTEM]  (1)

Abstract translation: 具有有机保护膜的银颗粒粉末，其具有宽的粒度分布，使得根据通过TEM（透射电子显微镜）测定粒径的根据下式（1）计算的CV值为 至少40％。 有机保护膜包括例如分子量为100〜1000的脂肪酸（油酸等）和分子量为100〜1000的胺化合物，和至少任一种脂肪酸 酸和胺化合物在一个分子中具有至少一个不饱和键。 CV = 100×[粒径的标准偏差，σD] / [平均粒径，DTEM]（1）<？in-line -formulae description =“在线公式”end =“tail”？>

公开(公告)号：US20090188701A1

公开(公告)日：2009-07-30

申请号：US10585446

申请日：2005-01-07

Applicant: Hiroshi Tsuzuki ,  Hisao Kogoi ,  Jun Tanaka

Inventor： Hiroshi Tsuzuki ,  Hisao Kogoi ,  Jun Tanaka

IPC: H05K1/02 ,  B32B9/00 ,  B32B27/00 ,  C08K3/22

CPC classification number: H01L23/3737 ,  C09K5/14 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/2982 ,  H01L2924/00

Abstract: The present invention relates to an inorganic powder having a frequency-size distribution with multiple peaks, wherein the peaks are present at least in the particle size regions from 0.2 to 2 μm and from 2 to 63 μm, preferably with the maximum particle size being 63 μm or less, the average particle size being from 4 to 30 μm, and the mode size being from 2 to 35 μm. The inorganic powder of the present invention is useful as a filler for a high thermally conductive member in electronic component-mounted circuit board required to have electrical insulating property and heat radiating performance, in that a heat radiating member comprising the powder can have thermal conductivity, the powder can provide a resin composition having excellent withstand voltage characteristics for forming an insulative composition into a thin film and can be filled in the resin composition at a high density so as to improve heat radiating performance of the resin composition.

Abstract translation: 本发明涉及具有多个峰的频率分布的无机粉末，其中峰至少存在于0.2〜2μm和2〜63μm的粒径范围内，优选最大粒径为63μm mum以下，平均粒径为4〜30μm，模式尺寸为2〜35μm。 本发明的无机粉末作为具有电绝缘性和散热性能的电子部件安装电路板中的高导热性部件的填充材料是有用的，因为包含粉末的散热构件可具有导热性， 粉末可以提供具有优异的耐电压特性的树脂组合物，用于将绝缘组合物形成薄膜，并且可以以高密度填充在树脂组合物中，从而提高树脂组合物的散热性能。

公开(公告)号：US20080199687A1

公开(公告)日：2008-08-21

申请号：US12070063

申请日：2008-02-14

Applicant: Shivkumar Chiruvolu ,  Vladimir K. Dioumaev ,  Nobuyuki Kambe ,  Hui Du

Inventor： Shivkumar Chiruvolu ,  Vladimir K. Dioumaev ,  Nobuyuki Kambe ,  Hui Du

IPC: B32B5/16 ,  C08K3/02 ,  C08K3/08

CPC classification number: H05K1/095 ,  C09D11/101 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0329 ,  Y10T428/25 ,  Y10T428/259

Abstract: Functional composite materials comprise elemental inorganic particles within an organic matrix. The elemental inorganic materials generally comprise elemental metal, elemental metalloid, alloys thereof, or mixtures thereof. In alternative or additional embodiments, the inorganic particles can comprise a metal oxide, a metalloid oxide, a combination thereof or a mixture thereof. The inorganic particles can have an average primary particle size of no more than abut 250 nm and a secondary particle size in a dispersion when blended with the organic matrix of no more than about 2 microns. The particles can be substantially unagglomerated within the composite. The organic binder can be a functional polymer such as a semiconducting polymer. The inorganic particles can be surface modified, such as with a moiety having an aromatic functional group for desirable interactions with a semiconducting polymer. Appropriate solution based methods can be used for forming the composite from dispersions of the particles. The composites can be processed into products, such as printed electronics devices.

Abstract translation: 功能复合材料包括有机基质内的元素无机颗粒。 元素无机材料通常包含元素金属，元素准金属，其合金或其混合物。 在替代或另外的实施方案中，无机颗粒可以包含金属氧化物，类金属氧化物，其组合或其混合物。 当与有机基质共混不超过约2微米时，无机颗粒的平均一次粒径不超过250nm，分散体中的二次粒径。 颗粒可以在复合材料内基本上未聚集。 有机粘合剂可以是功能聚合物，例如半导体聚合物。 无机颗粒可以被表面改性，例如具有芳族官能团的部分用于与半导体聚合物的期望相互作用。 基于溶液的方法可用于从颗粒的分散体形成复合物。 复合材料可以加工成产品，如印刷电子设备。

公开(公告)号：US20080173398A1

公开(公告)日：2008-07-24

申请号：US11964827

申请日：2007-12-27

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: B32B5/16 ,  B29C65/02

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 包含涂覆有碳原子数为2〜8的有机物质的金属粒子的接合材料，其中所述金属粒子包含100nm以下的第一部分，大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20070278456A1

公开(公告)日：2007-12-06

申请号：US11754421

申请日：2007-05-29

Applicant: Tadahiko Sakai ,  Tadashi Maeda

Inventor： Tadahiko Sakai ,  Tadashi Maeda

IPC: H01B1/22

CPC classification number: H05K3/3484 ,  H05K2201/0218 ,  H05K2201/0266 ,  H05K2203/0435

Abstract: In a solder paste 3 formed by allowing a resin component 3a having oxide removability to contain solder particles 4A, 4B, and 4C which are formed by coating the surfaces of core particles 6A, 6B, and 6C made of tin (Sn) or an alloy of tin with silver (Ag) coating films 7A, 7B, and 7C, the core particles are distributed to have such a particle distribution that the average particle diameter is in the range of 3 μm to 7 μm and 75% or more of the particles is in the range of 1 μm to 9 μm and the coating film is formed so that the core particles are coated with a silver coating film of an amount which occupies 1 to 4 wt % of the solder particles. Accordingly, it is possible to prevent oxide from being formed on the surfaces of the solder particles and to enhance the solder wettability at the time of soldering. In addition, it is possible to secure printability onto fine electrodes and to secure excellent solder adhesion with respect to a fine-pitch part by the use of a simple and low-cost method.

Abstract translation: 在通过使具有氧化物去除性的树脂组分3a含有通过涂覆由下列物质制成的芯颗粒6A，6B和6C的表面形成的焊料颗粒4A，4B和4C形成的焊膏3中， 锡（Sn）或锡与银（Ag）涂膜7 A，7 B和7 C的合金，芯颗粒分布成具有这样的颗粒分布，使得平均粒径在3μm至 7μm和75％以上的颗粒在1μm〜9μm的范围内，并且形成涂膜，使得芯颗粒涂覆有占银的1〜4wt％的银涂膜 焊料颗粒。 因此，可以防止在焊料颗粒的表面上形成氧化物，并且可以提高焊接时的焊料润湿性。 此外，可以通过简单且低成本的方法将可印刷性确保到细小电极上并且确保相对于细间距部分的良好焊接粘合性。

公开(公告)号：US07276185B2

公开(公告)日：2007-10-02

申请号：US10969320

申请日：2004-10-21

Applicant: Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

Inventor： Masashi Totokawa ,  Yuji Ootani ,  Hirokazu Imai ,  Akira Shintai

IPC: H01B1/22 ,  B32B15/01 ,  B32B27/14

CPC classification number: H01L24/29 ,  C09J9/02 ,  C09J11/04 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/8384 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/095 ,  H05K1/113 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T156/1057 ,  Y10T428/29 ,  Y10T428/2982 ,  Y10T428/2991 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00014

Abstract: A conductor composition being able to easily secure the conductivity at the same level as an Ag bulk at low temperature process, a mounting substrate utilizing the conductor composition and a mounting structure utilizing the conductor composition are provided. In a mounting structure, wherein one or more electrodes (11) of a mounting substrate (10) and one or more surface mounting components (20) are connected through a conductor composition (30), and one or more surface wirings (14) of the mounting substrate (10), one or more inner-layer wirings (13) and one or more via conductors (12) are formed with the conductor composition, the conductor composition contains conductive particles with electrical conductivity, and the conductive particles are composed of low crystallized Ag fillers with the crystal size of 10 nm or less.

Abstract translation: 提供一种导体组合物，其能够在低温处理下容易地确保与Ag体积相同的电导率，使用该导体组合物的安装基板和利用导体组合物的安装结构。 在安装结构中，其中安装基板（10）的一个或多个电极（11）和一个或多个表面安装部件（20）通过导体组合物（30）连接，以及一个或多个表面布线（14） 所述安装基板（10），一个或多个内层布线（13）和一个或多个通孔导体（12）由所述导体组合物形成，所述导体组合物包含具有导电性的导电颗粒，并且所述导电颗粒由 结晶尺寸为10nm以下的低结晶性Ag填料。

公开(公告)号：US20070060672A1

公开(公告)日：2007-03-15

申请号：US10557890

申请日：2004-05-19

Applicant: Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

Inventor： Yasushi Kumashiro ,  Yoshitaka Hirata ,  Shin Takanezawa ,  Yasushi Shimada ,  Kazuhisa Otsuka ,  Hiroyuki Kuriya ,  Kazunori Yamamoto

IPC: B32B17/00 ,  B32B5/16 ,  C08K7/00 ,  C08K3/10 ,  C08K3/22

CPC classification number: H05K1/162 ,  H01B3/30 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/31678

Abstract: There is provided an insulation material having a dielectric constant of 10 or more, comprising a filler having a dielectric constant of 50 or more and having two peaks in different particle size ranges in a particle size distribution and an insulating resin combined with each other; an insulation material having a dielectric constant of 10 or more comprising, as essential components, 1) at least one filler selected from the group consisting of barium titanate, strontium titanate, potassium titanate, magnesium titanate, lead titanate, titanium dioxide, barium zirconate, calcium zirconate and lead zirconate, 2) an insulating resin and 3) a dispersant containing a carboxylic group; or an insulation material comprising a filler having a dielectric constant of 50 or more, a dispersant for dispersing the filler and an insulating resin as essential components, wherein an extract of a cured product of the insulation material obtained by extraction with water at 120° C. for 20 hours using a pressure vessel has a pH of 6 or higher.

Abstract translation: 提供介电常数为10以上的绝缘材料，其包含介电常数为50以上的填料，并且在粒度分布中具有不同粒径范围的两个峰和彼此结合的绝缘树脂; 一种具有10或更高介电常数的绝缘材料，其包含作为必要组分的1）至少一种选自钛酸钡，钛酸锶，钛酸钾，钛酸镁，钛酸铅，二氧化钛，锆酸钡， 锆酸锆和锆酸铅，2）绝缘树脂和3）含有羧基的分散剂; 或包含介电常数为50以上的填料的绝缘材料，用于分散填料的分散剂和绝缘树脂作为必要成分，其中通过在120℃下用水萃取获得的绝缘材料的固化产物的提取物 使用压力容器20小时，pH为6以上。

公开(公告)号：US20050263895A1

公开(公告)日：2005-12-01

申请号：US11139210

申请日：2005-05-26

Applicant: Ryosuke Usui ,  Hiroyuki Watanabe ,  Takeshi Nakamura

Inventor： Ryosuke Usui ,  Hiroyuki Watanabe ,  Takeshi Nakamura

IPC: H05K1/11 ,  H01L21/56 ,  H01L23/12 ,  H01L23/433 ,  H01L23/495 ,  H01L23/538 ,  H01L29/40 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2221/68377 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/421 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09509 ,  H05K2201/09581 ,  H05K2201/096 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first resin film is formed so as to cover a first wiring layer. Thereafter, a first through-hole is formed, which penetrates the first resin film and exposes the first wiring layer from a bottom thereof. Next, a second resin film is formed so as to fill up the first through-hole. Moreover, a second through-hole is formed in the second resin film buried in the first through-hole, and a connection part is formed.

Abstract translation: 提供一种能够容易地形成将布线层彼此连接的连接部的电路装置及其制造方法。 在本发明的混合集成电路器件的制造方法中，形成第一树脂膜以覆盖第一布线层。 此后，形成穿过第一树脂膜并从其底部露出第一布线层的第一通孔。 接下来，形成第二树脂膜以填充第一通孔。 此外，在埋设在第一通孔中的第二树脂膜中形成第二通孔，形成连接部。

公开(公告)号：US06692581B2

公开(公告)日：2004-02-17

申请号：US10248802

申请日：2003-02-20

Applicant: Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Ching-Fu Horng ,  Shih-Kuang Chen ,  Shyh-Ing Wu ,  Chun-Hung Lin ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Ching-Fu Horng ,  Shih-Kuang Chen ,  Shyh-Ing Wu ,  Chun-Hung Lin ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

IPC: B23K35363

CPC classification number: H01L24/10 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2203/043 ,  H01L2924/00

Abstract: A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 &mgr;m and the average size of the metallic granules is 35 &mgr;m to 45 &mgr;m.

Abstract translation: 用于制造凸块的焊膏包括焊剂和金属合金粉末。 金属合金粉末包含多个低共晶金属合金颗粒，这些金属合金颗粒的尺寸为20-60μm，金属颗粒的平均尺寸为35μm〜45μm。

公开(公告)号：US06630742B2

公开(公告)日：2003-10-07

申请号：US10373773

申请日：2003-02-27

Applicant: Seiki Sakuyama

Inventor： Seiki Sakuyama

IPC: H01L2348

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0266 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0574 ,  H05K2203/0577 ,  H05K2203/0769

Abstract: The present invention relates to a method for forming bumps on a substrate provided with electrode pads. The method includes providing a mask having openings corresponding to the electrode pads, filling each of the openings with a solder paste, and heat treating the solder paste, wherein the solder paste includes solder powder. Preferably, the solder powder contains no more than 10 wt % of particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, the solder powder contains no more than 10 wt % of particles whose diameter is not less than 40% the diameter of the opening portions, or no less than 30 wt % of particles whose diameter is 40 to 100% the thickness of the mask.

Abstract translation: 本发明涉及在设置有电极焊盘的基板上形成凸块的方法。 该方法包括提供具有对应于电极焊盘的开口的掩模，用焊膏填充每个开口，以及对焊锡膏进行热处理，其中焊膏包括焊料粉末。 优选地，焊料粉末含有不超过10重量％的直径大于掩模厚度且不超过该厚度的1.5倍的颗粒。 优选地，焊料粉末含有不超过10重量％的直径不小于开口直径的40％的颗粒，或不小于30重量％的直径为掩模厚度为40至100％的颗粒 。