公开(公告)号：US4528748A

公开(公告)日：1985-07-16

申请号：US445127

申请日：1982-11-29

Applicant: Charles W. Eichelberger ,  Robert J. Wojnarowski ,  Abraham Auerbach

Inventor： Charles W. Eichelberger ,  Robert J. Wojnarowski ,  Abraham Auerbach

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/44 ,  H05K3/22

CPC classification number: H05K3/44 ,  H05K3/0014 ,  H05K1/053 ,  H05K1/056 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/0347 ,  H05K2201/057 ,  H05K2203/0709 ,  H05K2203/302 ,  Y10T29/49124 ,  Y10T29/49135

Abstract: A method is described for batch-fabricating flat printed circuit boards and subsequently forming the circuit boards to a particular desired shape. In particular, a conductive substrate is coated with an insulating coating and conductors are fabricated thereon, with integrated circuit and chip resistor/capacitor parts being mounted to the fabricated conductor patterns. After part-mounting, the circuit board is bent to the desired shape.

Abstract translation: 描述了用于批量制造平面印刷电路板并且随后将电路板形成为特定期望形状的方法。 特别地，导电基板涂覆有绝缘涂层，并且在其上制造导体，其中集成电路和芯片电阻器/电容器部件安装到制造的导体图案。 在部件安装之后，电路板弯曲到所需的形状。

公开(公告)号：US4522888A

公开(公告)日：1985-06-11

申请号：US497977

申请日：1983-05-25

Applicant: Charles W. Eichelberger ,  Robert J. Wojnarowski

Inventor： Charles W. Eichelberger ,  Robert J. Wojnarowski

IPC: H05K1/09 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46 ,  C23C3/02 ,  H05K3/00

CPC classification number: H05K3/246 ,  H05K3/46 ,  H05K1/095 ,  H05K2201/0347 ,  H05K3/18 ,  Y10S428/901 ,  Y10T428/12014

Abstract: A low-cost electrical conductor is prepared by applying a mixture of a metallic powder and a polymer on a substrate, curing the polymer, effecting an augmentation replacement reaction to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal at the surface exceeds that of the original metal powder replaced, and thereafter applying a dielectric material to selected areas of the conductor thus formed. Imperfections such as pin holes and screen marks can be eliminated by heating the dielectric material to cause a degree of flow. Multiple layer interconnected conductors can be prepared by reapplying the mixture of metallic powder and polymer such that a portion thereof contacts the first prepared conductor, curing the polymer and effecting an augmentation replacement reaction with a metal which is more noble than the powder metal and the replacement metal of the first conductor.

Abstract translation: 通过将金属粉末和聚合物的混合物施加在基材上，固化聚合物，进行增加置换反应以用更贵金属代替一些金属粉末，制备低成本电导体，使得 表面上沉积金属的总体积超过原来金属粉末的总体积，然后将电介质材料施加到如此形成的导体的选定区域。 可以通过加热介电材料以导致流动程度来消除诸如针孔和丝网痕迹的缺陷。 可以通过重新使用金属粉末和聚合物的混合物来制备多层互连导体，使得其一部分接触第一制备的导体，固化聚合物并且利用比粉末金属更高的金属和替换的金属进行增强置换反应 第一导体的金属。

公开(公告)号：US4464420A

公开(公告)日：1984-08-07

申请号：US421833

申请日：1982-09-23

Applicant: Noriyuki Taguchi ,  Tsuyoshi Fuzita ,  Gyozo Toda ,  Syoosaku Ishihara ,  Takashi Kuroki ,  Tatsuhiro Suzuki

Inventor： Noriyuki Taguchi ,  Tsuyoshi Fuzita ,  Gyozo Toda ,  Syoosaku Ishihara ,  Takashi Kuroki ,  Tatsuhiro Suzuki

IPC: H05K3/46 ,  H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/24 ,  B05D5/12

CPC classification number: H05K3/246 ,  H01L21/705 ,  H05K1/167 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/1453 ,  H05K3/4667

Abstract: A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.

Abstract translation: 提供一种陶瓷多层电路板，其通过在表面布线导体层上依次烧结以氧化铝为主要成分的多层布线基板，其通过生片工艺，镀镍和镀金制备，印刷厚膜导体膏 在镀金层上烧制印刷基板，最后在厚膜导体层的至少一部分上印刷厚膜电阻浆料并进行焙烧以形成厚膜电阻层。

公开(公告)号：US4463084A

公开(公告)日：1984-07-31

申请号：US430601

申请日：1982-09-30

Applicant: Ken'ichi Mitsumori ,  Kazuo Aikawa

Inventor： Ken'ichi Mitsumori ,  Kazuo Aikawa

IPC: H05K1/03 ,  H05K1/05 ,  H05K3/06 ,  H05K3/10 ,  H05K3/44 ,  G03C5/00

CPC classification number: H05K1/053 ,  H05K3/44 ,  H05K1/0306 ,  H05K2201/0116 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0323 ,  H05K2203/1147 ,  H05K3/06 ,  H05K3/107

Abstract: A circuit board such as a code disk having a smooth contact surface and a minute pattern is fabricated by depositing an alumite film on an aluminum and selectively filling electrically nonconductive and conductive materials in the cells in the crystals of the alumite film.

Abstract translation: 通过在铝上沉积耐酸铝膜并选择性地填充耐酸铝膜的晶体中的电池中的非导电和导电材料来制造诸如具有光滑接触表面和微小图案的代码盘的电路板。

公开(公告)号：US4454168A

公开(公告)日：1984-06-12

申请号：US427420

申请日：1982-09-29

Applicant: Herbert L. Fritz

Inventor： Herbert L. Fritz

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/46

CPC classification number: H05K3/185 ,  H05K3/102 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2203/0525 ,  H05K2203/0577 ,  H05K2203/073 ,  H05K3/0023 ,  H05K3/184 ,  H05K3/4644

Abstract: Process for preparation of printed circuits by applying particulate metal to tacky image areas, optionally removing excess particulate metal, and contacting the metallized image areas with an aqueous solution comprising cations of a plating metal to accomplish a metal-metal ion displacement reaction, the solution being substantially free of any chemical reducing agent for said cations. Preferably the conductive circuit is electroplated or soldered.

Abstract translation: 通过将颗粒状金属涂覆到粘性图像区域，任选地除去多余的颗粒金属以及使金属化图像区域与包含电镀金属的阳离子的水溶液接触以实现金属 - 金属离子置换反应来制备印刷电路的方法，所述溶液为 基本上不含任何用于所述阳离子的化学还原剂。 优选地，导电电路被电镀或焊接。

公开(公告)号：US4431685A

公开(公告)日：1984-02-14

申请号：US394588

申请日：1982-07-02

Applicant: Michael J. Canestaro ,  Donald G. McBride ,  John A. Welsh

Inventor： Michael J. Canestaro ,  Donald G. McBride ,  John A. Welsh

IPC: C23C18/18 ,  C23C18/16 ,  C23C18/38 ,  C23C18/42 ,  C25D5/02 ,  G03F7/11 ,  H01L21/70 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  G03C5/00

CPC classification number: H05K3/244 ,  C23C18/1605 ,  C23C18/1651 ,  C23C18/54 ,  G03F7/11 ,  H01L21/707 ,  H05K3/384 ,  H05K2201/0347 ,  H05K2203/072 ,  H05K3/108 ,  H05K3/382

Abstract: A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.

Abstract translation: 一种通过在光致抗蚀剂和金属表面之间施加一层贵金属如钯，铂，金，铱，铑或其混合物来减少电镀金属缺陷的方法。

公开(公告)号：US4416914A

公开(公告)日：1983-11-22

申请号：US220341

申请日：1980-12-29

Applicant: Charles W. Eichelberger ,  Robert J. Wojnarowski

Inventor： Charles W. Eichelberger ,  Robert J. Wojnarowski

IPC: H05K1/09 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46

CPC classification number: H05K3/246 ,  H05K3/4664 ,  H05K1/095 ,  H05K2201/0347 ,  H05K3/18

Abstract: A low-cost electrical conductor is prepared by applying a mixture of a metallic powder and a polymer on a substrate, curing the polymer, effecting an augmentation replacement reaction to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal at the surface exceeds that of the original metal powder replaced, and thereafter applying a dielectric material to selected areas of the conductor thus formed. Imperfections such as pin holes and screen marks can be eliminated by heating the dielectric material to cause a degree of flow. Multiple layer interconnected conductors can be prepared by reapplying the mixture of metallic powder and polymer such that a portion thereof contacts the first prepared conductor, curing the polymer and effecting an augmentation replacement reaction with a metal which is more noble than the powder metal and the replacement metal of the first conductor.

Abstract translation: 通过将金属粉末和聚合物的混合物施加在基材上，固化聚合物，进行增加置换反应以用更贵金属代替一些金属粉末，制备低成本电导体，使得 表面上沉积金属的总体积超过原来金属粉末的总体积，然后将电介质材料施加到如此形成的导体的选定区域。 可以通过加热介电材料以导致流动程度来消除诸如针孔和丝网痕迹的缺陷。 可以通过重新使用金属粉末和聚合物的混合物来制备多层互连导体，使得其一部分接触第一制备的导体，固化聚合物并且利用比粉末金属更高的金属和替换的金属进行增强置换反应 第一导体的金属。

公开(公告)号：US4411980A

公开(公告)日：1983-10-25

申请号：US304107

申请日：1981-09-21

Applicant: Douglas M. Haney ,  John W. Lott

Inventor： Douglas M. Haney ,  John W. Lott

IPC: H01H11/00 ,  G03F7/28 ,  H05K1/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/34 ,  G03C5/24

CPC classification number: H05K3/246 ,  G03F7/28 ,  H05K3/102 ,  H05K1/0393 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2203/044 ,  H05K2203/0505 ,  H05K2203/0525 ,  H05K2203/1545 ,  H05K3/0023 ,  H05K3/3468

Abstract: Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises(a) exposing imagewise said element,(b) applying particulate conductive metal, e.g., nickel, copper, to the unexposed image areas, optionally(c) heating the metal bearing areas, then(d) removing excess metal particles, optionally(e) fixing the particulate metal to the layer by heating, exposing to UV light or mechanical embedding, and(f) plating electrolessly or soldering the metal containing areas. The process can be operated continuously to prepare single and double layer flexible printed circuits, membrane switches, etc.

Abstract translation: 用于制备由具有至少一种有机弹性体聚合物粘合剂的柔性可光硬化元件形成的柔性电路的方法，该柔性电路包括（a）使所述元件成像曝光，（b）将未处理图像区域的颗粒状导电金属（例如镍，铜） 任选地（c）加热金属承载区域，然后（d）去除多余的金属颗粒，任选地（e）通过加热，暴露于UV光或机械嵌入将颗粒金属固定到该层，以及（f）电化学或焊接 金属包含区域。 该工艺可以连续工作，制备单层和双层柔性印刷电路，薄膜开关等。

公开(公告)号：US4402135A

公开(公告)日：1983-09-06

申请号：US250830

申请日：1981-04-03

Applicant: Otto Schweingruber ,  Werner Hafner

Inventor： Otto Schweingruber ,  Werner Hafner

IPC: H05K3/18 ,  H05K1/09 ,  H05K3/10 ,  H05K3/24 ,  H05K3/32 ,  H05K3/30

CPC classification number: H05K3/246 ,  H05K3/101 ,  H05K1/095 ,  H05K2201/0347 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/0113 ,  H05K2203/1461 ,  H05K3/107 ,  H05K3/32 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49158

Abstract: A circuit board is fabricated by injection molding a support of an insulating material. The support is provided with channels in the pattern of conductive paths. The channels are filled by injection with electrically conductive plastic, and electrically conductive metal is precipitated galvanoplastically on the plastic.

Abstract translation: 通过注射模制绝缘材料的支撑件来制造电路板。 支撑件设置有导电路径图案中的通道。 通道用导电塑料注射填充，导电金属在塑料上电铸成沉淀。

公开(公告)号：US4383363A

公开(公告)日：1983-05-17

申请号：US163634

申请日：1980-06-27

Applicant: Masao Hayakawa ,  Takamichi Maeda ,  Mituwo Oda

Inventor： Masao Hayakawa ,  Takamichi Maeda ,  Mituwo Oda

IPC: H05K1/00 ,  H05K3/00 ,  H05K3/18 ,  H05K3/24 ,  H05K3/40 ,  H05K3/02

CPC classification number: H05K3/4069 ,  H05K1/0393 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/0554 ,  H05K2203/1461 ,  H05K3/0047 ,  H05K3/181 ,  H05K3/246 ,  Y10T29/49156

Abstract: A conductive paste is disposed in a through hole to provide communication between wiring patterns formed on both of the major surfaces of an insulator substrate. Conductive layers integral with the wiring patterns are formed on the both major surfaces of the insulator substrate so that the conductive layers extend across the through hole. The conductive layers make contact with the conductive paste disposed in the through hole and function to enclose the both ends of the conductive paste.

Abstract translation: 在通孔中设置导电膏以提供形成在绝缘体基板的两个主表面上的布线图案之间的连通。 在绝缘体基板的两个主表面上形成与布线图形一体的导电层，使得导电层延伸穿过通孔。 导电层与布置在通孔中的导电膏接触，并且用于封装导电膏的两端。