公开(公告)号：US09706637B2

公开(公告)日：2017-07-11

申请号：US13973785

申请日：2013-08-22

Applicant: Harman Becker Automotive Systems GmbH

Inventor： Guenther Kraft ,  Stephan Joos ,  Krunoslav Orcic ,  Walter Knappich ,  Didier Berthomier

IPC: H05K3/34 ,  H05K1/02 ,  H01L23/42 ,  H01L21/48 ,  H01L23/552 ,  H05K13/04

CPC classification number: H05K1/0203 ,  H01L21/4853 ,  H01L23/42 ,  H01L23/552 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K1/024 ,  H05K3/3484 ,  H05K13/0465 ,  H05K2201/10371 ,  H05K2203/1572

Abstract: Methods for producing a circuit board system and a circuit board arrangement are disclosed. One method for producing a circuit board system includes: providing a first circuit board including a top side, a bottom side, a top metallization layer arranged at the top side, and a bottom metallization layer arranged at the bottom side, wherein the bottom metallization layer comprises a number of soldering pads; applying a first solder over the soldering pads; and applying a second solder over the top metallization layer. The method further includes providing a number of electronic components and a metallic or metallized shielding frame; arranging the number of electronic components and the shielding frame on the applied second solder; and soldering the number of electronic components and the shielding frame to the top metallization layer with the second solder.

公开(公告)号：US20170181336A1

公开(公告)日：2017-06-22

申请号：US15453166

申请日：2017-03-08

Applicant: Laird Technologies, Inc.

Inventor： Kenneth M. Robinson ,  Paul W. Crotty, JR.

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K1/0216 ,  H05K9/00 ,  H05K9/0009 ,  H05K2201/10371

Abstract: According to various aspects, exemplary embodiments are disclosed of a two-piece metallic board level shield (BLS). In an exemplary embodiment, the BLS is solderable to a printed circuit board (PCB). The BLS includes a lid or cover and a fence or frame. The lid and fence are complementary in shape. The lid may be mounted onto the fence via a locking mechanism in a first position and a compressed second position, where the locking mechanism provides resistance against internal upward forces when the BLS has been compressed into a second position. The BLS may be soldered to the PCB while in the first position, and subsequently compressed into the second position after the solder has hardened.

公开(公告)号：US20170181335A1

公开(公告)日：2017-06-22

申请号：US15327107

申请日：2015-09-18

Applicant: Panasomic Intellectual Property Management Co., Ltd.

Inventor： TOMOHIKO ITOU

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0203 ,  H05K1/181 ,  H05K9/0026 ,  H05K9/0028 ,  H05K2201/06 ,  H05K2201/10371

Abstract: A shield cover includes a cover body that is formed of a metal plate and for covering an electronic component, a leaf spring formed by cutting a part of the cover body, and a projection that is disposed on the leaf spring and projects in the thickness direction of the leaf spring.

公开(公告)号：US20170181265A1

公开(公告)日：2017-06-22

申请号：US15388524

申请日：2016-12-22

Applicant: THOMSON LICENSING

Inventor： MICKEY HUNT ,  Joseph Lee CARPENTER ,  Darin Bradley RITTER

IPC: H05K1/02

CPC classification number: H05K1/0216 ,  H05K1/0209 ,  H05K1/0215 ,  H05K7/20445 ,  H05K2201/066 ,  H05K2201/10371

Abstract: An improved heat transfer system for components an electronic device is provided. The electronic device includes a printed circuit board, a component shield and a heatsink or heat spreader. An open heat transfer window is positioned in the component shield so as to enable the heat sink to directly contact a thermal pad for a component requiring heat dissipation. Grounding fingers between the shield and the heatsink may be provided to connect the shield to the heatsink, thereby protecting the component against electromagnetic interference and electrostatic discharge from the outside while preventing the component from leaking radio frequency radiation to the outside resulting from the creation of the open heat transfer window in the shield.

公开(公告)号：US20170171960A1

公开(公告)日：2017-06-15

申请号：US15366575

申请日：2016-12-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-Hee YANG

IPC: H05K1/02 ,  H05K5/00

CPC classification number: H05K1/0215 ,  G06F1/16 ,  H04M1/0277 ,  H04M1/185 ,  H05K1/0216 ,  H05K5/0017 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: Disclosed is an electronic device having a housing including an inner space, a board including a first face and a second face opposite to the first face, the board being disposed such that the second face directly faces the inner space of the housing, at least one washer member mounted on the first face of the board and having at least a portion being soldered to a conductive exposure portion exposed to the first face of the board, a fastening member that anchors the board to the housing, and at least one electronic component disposed in the housing to directly face the first face of the board.

公开(公告)号：US20170170583A1

公开(公告)日：2017-06-15

申请号：US15350239

申请日：2016-11-14

Applicant: GE Aviation Systems Limited

Inventor： Denis Vaughan WEALE ,  Julian Peter MAYES

IPC: H01R12/70 ,  H05K1/18 ,  H01R13/658 ,  H05K1/02 ,  H01R12/71 ,  H01R13/24

CPC classification number: H01R12/7088 ,  H01R12/718 ,  H01R13/2414 ,  H01R13/658 ,  H05K1/0216 ,  H05K1/0263 ,  H05K1/181 ,  H05K3/4015 ,  H05K2201/0314 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/10757 ,  H05K2201/2036 ,  Y02P70/611

Abstract: The present embodiments relate to providing electrical connectivity to electric-powered components mounted in parallel on a wiring board. An electrical apparatus is provided in which electricity is conducted from an electrically conductive member onto first and second electrically conductive pathways, of a wiring board through the use of first and second resiliently-deformable electrically conductive connectors. First and second electric-powered components are mounted to the respective first and second electrically conductive pathways. The first and second resiliently-deformable electrically conductive connectors are compressed between the electrically conductive member and the wiring board such that the first connector provides an electrical connection between the conductive member and the first electrically conductive pathway, and the second connector provides an electrical connection between the conductive member and the second electrically conductive pathway.

公开(公告)号：US20170135200A1

公开(公告)日：2017-05-11

申请号：US15296051

申请日：2016-10-18

Applicant: Sercomm Corporation

Inventor： Cheng-Chung Chang ,  Yuan-Long Li

IPC: H05K1/02 ,  F16B2/22

CPC classification number: H05K1/0216 ,  F16B2/22 ,  H05K3/301 ,  H05K3/3447 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: A shielding clip and an electronic device are provided. The electronic device includes a circuit board, an electronic element, a shielding cover and the shielding clip. The shielding clip comprises a bottom plate parallel to the circuit board. The bottom plate has a first side region and a second side region. The first side region has a first pin extending into the circuit board and a first buckle plate extending away from the circuit board to buckle the shielding cover. The second side region has a second pin extending into the circuit board and a second buckle plate extending away from the circuit board to buckle the shielding cover.

公开(公告)号：US09635769B2

公开(公告)日：2017-04-25

申请号：US13858279

申请日：2013-04-08

Applicant: Seiko Epson Corporation

Inventor： Yukihiro Hashi

IPC: H05K5/00 ,  H05K3/10 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K3/24 ,  H05K3/32

CPC classification number: H05K5/0091 ,  H01L2924/16152 ,  H01L2924/16195 ,  H05K1/0284 ,  H05K1/111 ,  H05K1/183 ,  H05K3/10 ,  H05K3/108 ,  H05K3/243 ,  H05K3/321 ,  H05K3/3494 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/107 ,  Y02P70/611 ,  Y10T29/49155

Abstract: An electronic device has a package and a piezoelectric element accommodated in an accommodating space formed inside the package. The package has a frame-like metallization layer bonding a base substrate and a lid together and electrodes formed on and in the base substrate and electrically connected with the piezoelectric element. The metallization layer is insulated from the electrodes.

公开(公告)号：US20170105278A1

公开(公告)日：2017-04-13

申请号：US14881915

申请日：2015-10-13

Applicant: GOOGLE INC.

Inventor： James Cooper ,  Joshua Norman Lilje

IPC: H05K1/02 ,  H05K3/32 ,  H05K3/30 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically-conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a flexible electrically-conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

公开(公告)号：US20170094831A1

公开(公告)日：2017-03-30

申请号：US15271635

申请日：2016-09-21

Applicant: LAIRD TECHNOLOGIES, INC.

Inventor： Mohammadali Khorrami ,  Paul Francis Dixon

IPC: H05K7/20 ,  H05K1/02 ,  H05K9/00 ,  H01P1/201

CPC classification number: H05K7/2039 ,  H01L23/34 ,  H01L23/3737 ,  H01P1/201 ,  H01P3/12 ,  H05K1/0203 ,  H05K1/0216 ,  H05K9/0032 ,  H05K9/0081 ,  H05K2201/10371

Abstract: According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including thermal interface materials, and related methods. In an exemplary embodiment, a thermal interface material generally includes a top surface, a bottom surface, and one or more outer side surfaces extending between the top and bottom surfaces. Electrically-conductive material is along and/or adjacent the one or more outer side surfaces. The thermal interface material may be configured to be operable as a waveguide through which energy below a cutoff frequency cannot flow. The electrically-conductive material may be parallel with a direction of heat flow from a heat source to a heat removal/dissipation structure when the bottom surface is positioned against or adjacent the heat source and the top surface is positioned adjacent or against the heat removal/dissipation structure.