公开(公告)号：US08674469B2

公开(公告)日：2014-03-18

申请号：US12766130

申请日：2010-04-23

Applicant: Kuan-Chieh Huang ,  Chih-Jen Wu ,  Chen-Ming Huang ,  Dun-Nian Yaung ,  An-Chun Tu

Inventor： Kuan-Chieh Huang ,  Chih-Jen Wu ,  Chen-Ming Huang ,  Dun-Nian Yaung ,  An-Chun Tu

IPC: H01L31/00

CPC classification number: H01L21/76237 ,  H01L21/76224 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/18

Abstract: A backside illuminated image sensor includes an isolation structure passing through a substrate, a sensor element formed overlying the front surface of the substrate, and a color filter formed overlying the back surface of the substrate.

Abstract translation: 背面照明图像传感器包括通过基板的隔离结构，覆盖在基板的前表面上的传感器元件和形成在基板的后表面上的滤色器。

公开(公告)号：US20120290404A1

公开(公告)日：2012-11-15

申请号：US13463415

申请日：2012-05-03

Applicant: Kuo-Yu Chuang ,  Jen-Chu Liu ,  Johannes Hermanus Fouche ,  Chih-Jen Wu

Inventor： Kuo-Yu Chuang ,  Jen-Chu Liu ,  Johannes Hermanus Fouche ,  Chih-Jen Wu

IPC: G06Q30/02

CPC classification number: H04L51/14 ,  H04L51/08 ,  H04L51/34

Abstract: A system and a method for promoting multi-layer forwarding messages are provided. An embodiment of the method for use in an advertisement server system includes the following steps. At least one feedback message is received, wherein each of the at least one feedback message includes a forwarding user identifier and a user identifier of a corresponding first receiving device, and the advertisement server system interprets the at least one feedback message as a first-layer forwarding of an advertisement message associated with the forwarding user identifier. The forwarding number of the first-layer forwarding of the advertisement message is stored according to at least one feedback message of the first-layer forwarding of the advertisement message. An encouraging message is sent to a forwarding mobile device of the forwarding user identifier, wherein the encouraging message includes information based on a forwarding weight is determined according to at least the forwarding number.

Abstract translation: 提供了一种用于促进多层转发消息的系统和方法。 用于广告服务器系统的方法的实施例包括以下步骤。 接收至少一个反馈消息，其中所述至少一个反馈消息中的每一个包括转发用户标识符和对应的第一接收设备的用户标识符，并且所述广告服务器系统将所述至少一个反馈消息解释为第一层 转发与转发用户标识符相关联的广告消息。 根据广告消息的第一层转发的至少一个反馈消息，存储广告消息的第一层转发的转发号码。 向转发用户标识符的转发移动设备发送一个令人鼓舞的消息，其中鼓励消息包括基于转发权重的信息至少根据转发号确定。

公开(公告)号：US20100042319A1

公开(公告)日：2010-02-18

申请号：US12365190

申请日：2009-02-04

Applicant: Chih-Jen WU ,  Shung-Yung TSAI ,  Wen-Hsiang TSAI

Inventor： Chih-Jen WU ,  Shung-Yung TSAI ,  Wen-Hsiang TSAI

IPC: G01C21/00

CPC classification number: G05D1/0255 ,  G05D1/0246 ,  G05D1/0272 ,  G05D2201/0207

Abstract: The present invention discloses an automatic ultrasonic and computer-vision navigation device and a method using the same. In the method of the present invention, the user guides an automatic navigation device to learn and plan a navigation path; next, the automatic navigation device navigates independently and uses ultrasonic signals and computer vision to detect the environment; then, the automatic navigation device compares the detected environment data with the navigation path to amend the physical movement track. The present invention enables ordinary persons to interact with the automatic navigation device without operating the computer. As the present invention adopts computer vision and ultrasonic signals to realize the functions thereof, the manufacturers can save the hardware cost.

Abstract translation: 本发明公开了一种自动超声波和计算机视觉导航装置及其使用方法。 在本发明的方法中，用户引导自动导航装置学习和规划导航路径; 接下来，自动导航装置独立导航，使用超声信号和计算机视觉来检测环境; 然后，自动导航装置将检测到的环境数据与导航路径进行比较，以修改物理运动轨迹。 本发明使得普通人能够在不操作计算机的情况下与自动导航装置交互。 由于本发明采用计算机视觉和超声信号来实现其功能，所以制造商可以节省硬件成本。

公开(公告)号：US08796105B2

公开(公告)日：2014-08-05

申请号：US13558284

申请日：2012-07-25

Applicant: You-Hua Chou ,  Chih-Tsung Lee ,  Min-Hao Hong ,  Ming-Huei Lien ,  Chih-Jen Wu ,  Chen-Ming Huang

Inventor： You-Hua Chou ,  Chih-Tsung Lee ,  Min-Hao Hong ,  Ming-Huei Lien ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC: H01L21/76

CPC classification number: H01L21/02164 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/02323 ,  H01L21/02337 ,  H01L21/76227

Abstract: A method for depositing a polysilazane on a semiconductor wafer is provided. The method includes steps of disposing a silazane onto the semiconductor wafer, and heating the silazane to form the polysilazane on the semiconductor wafer. An apparatus for preparing a polysilazane on a semiconductor wafer is also provided.

Abstract translation: 提供了一种在半导体晶片上沉积聚硅氮烷的方法。 该方法包括将硅氮烷置于半导体晶片上，并加热硅氮烷以在半导体晶片上形成聚硅氮烷的步骤。 还提供了一种在半导体晶片上制备聚硅氮烷的设备。

公开(公告)号：US20140030866A1

公开(公告)日：2014-01-30

申请号：US13558284

申请日：2012-07-25

Applicant: You-Hua Chou ,  Chih-Tsung Lee ,  Min-Hao Hong ,  Ming-Huei Lien ,  Chih-Jen Wu ,  Chen-Ming Huang

Inventor： You-Hua Chou ,  Chih-Tsung Lee ,  Min-Hao Hong ,  Ming-Huei Lien ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC: H01L21/762 ,  H01L21/314

CPC classification number: H01L21/02164 ,  H01L21/02222 ,  H01L21/02282 ,  H01L21/02323 ,  H01L21/02337 ,  H01L21/76227

Abstract: A method for depositing a polysilazane on a semiconductor wafer is provided. The method includes steps of disposing a silazane onto the semiconductor wafer, and heating the silazane to form the polysilazane on the semiconductor wafer. An apparatus for preparing a polysilazane on a semiconductor wafer is also provided.

Abstract translation: 提供了一种在半导体晶片上沉积聚硅氮烷的方法。 该方法包括将硅氮烷置于半导体晶片上，并加热硅氮烷以在半导体晶片上形成聚硅氮烷的步骤。 还提供了一种在半导体晶片上制备聚硅氮烷的设备。

公开(公告)号：US08605276B2

公开(公告)日：2013-12-10

申请号：US13286617

申请日：2011-11-01

Applicant: Chih-Jen Wu ,  Chen-Ming Huang ,  Kuan-Chieh Huang ,  Chi-Yuan Shih ,  Chin-Hsiang Lin

Inventor： Chih-Jen Wu ,  Chen-Ming Huang ,  Kuan-Chieh Huang ,  Chi-Yuan Shih ,  Chin-Hsiang Lin

IPC: G01N21/00 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01N21/278 ,  G01N21/94 ,  G01N2021/8822 ,  G01N2021/8825

Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.

Abstract translation: 本公开的更广泛形式之一涉及增强缺陷检查的方法。 该方法包括提供具有缺陷颗粒的基底并在基底和缺陷颗粒上提供流体，该流体的折射率大于空气。 该方法还包括将衬底和缺陷颗粒暴露于通过流体的入射辐射，以及通过流体检测由缺陷颗粒反射或散射的辐射。

公开(公告)号：US20130107248A1

公开(公告)日：2013-05-02

申请号：US13286617

申请日：2011-11-01

Applicant: Chih-Jen Wu ,  Chen-Ming Huang ,  Kuan-Chieh Huang ,  Chi-Yuan Shih ,  Chin-Hsiang Lin

Inventor： Chih-Jen Wu ,  Chen-Ming Huang ,  Kuan-Chieh Huang ,  Chi-Yuan Shih ,  Chin-Hsiang Lin

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/278 ,  G01N21/94 ,  G01N2021/8822 ,  G01N2021/8825

Abstract: One of the broader forms of the present disclosure involves a method of enhanced defect inspection. The method includes providing a substrate having defect particles and providing a fluid over the substrate and the defect particles, the fluid having a refractive index greater than air. The method further includes exposing the substrate and the defect particles to incident radiation through the fluid, and detecting, through the fluid, radiation reflected or scattered by the defect particles.

Abstract translation: 本公开的更广泛形式之一涉及增强缺陷检查的方法。 该方法包括提供具有缺陷颗粒的基底并在基底和缺陷颗粒上提供流体，该流体的折射率大于空气。 该方法还包括将衬底和缺陷颗粒暴露于通过流体的入射辐射，以及通过流体检测由缺陷颗粒反射或散射的辐射。

公开(公告)号：US08352062B2

公开(公告)日：2013-01-08

申请号：US12402124

申请日：2009-03-11

Applicant: Chih-Jen Wu ,  Chen-Ming Huang ,  An-Chun Tu

Inventor： Chih-Jen Wu ,  Chen-Ming Huang ,  An-Chun Tu

IPC: G06F19/00

CPC classification number: H01L21/28026 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; performing a plurality of processes to form a gate stack over the substrate, wherein the gate stack comprises a gate layer; measuring a grain size of the gate layer after at least one of the plurality of processes; determining whether the measured grain size is within a target range; and modifying a recipe of at least one of the plurality of processes if the measured grain size of the gate layer is not within the target range.

Abstract translation: 公开了一种制造具有改进性能的集成电路的方法。 该方法包括提供基底; 执行多个处理以在所述衬底上形成栅极堆叠，其中所述栅极堆叠包括栅极层; 在所述多个处理中的至少一个处理之后测量所述栅极层的晶粒尺寸; 确定所测量的晶粒尺寸是否在目标范围内; 以及如果所述测量的所述栅极层的晶粒尺寸不在所述目标范围内，则修改所述多个处理中的至少一个处理的配方。

公开(公告)号：US08283745B2

公开(公告)日：2012-10-09

申请号：US12613585

申请日：2009-11-06

Applicant: Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

Inventor： Kuan-Chieh Huang ,  Dun-Nian Yaung ,  Chih-Jen Wu ,  Chen-Ming Huang

IPC: H01L21/00

CPC classification number: H01L31/0232 ,  H01L21/6835 ,  H01L23/49805 ,  H01L24/02 ,  H01L24/05 ,  H01L24/16 ,  H01L24/81 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14645 ,  H01L27/14687 ,  H01L27/14689 ,  H01L31/18 ,  H01L2221/68327 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/02313 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K2201/10151 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01022 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: Provided is a method of fabricating a backside illuminated image sensor that includes providing a device substrate having a frontside and a backside, where pixels are formed at the frontside and an interconnect structure is formed over pixels, forming a re-distribution layer (RDL) over the interconnect structure, bonding a first glass substrate to the RDL, thinning and processing the device substrate from the backside, bonding a second glass substrate to the backside, removing the first glass substrate, and reusing the first glass substrate for fabricating another backside-illuminated image sensor.

Abstract translation: 提供一种制造背面照射图像传感器的方法，其包括提供具有前侧和后侧的器件基板，其中在前侧形成像素，并且在像素上形成互连结构，形成再分布层（RDL），覆盖 所述互连结构将第一玻璃基板接合到所述RDL，从背面稀释并处理所述器件基板，将第二玻璃基板粘合到所述背面，移除所述第一玻璃基板，以及重新使用所述第一玻璃基板以制造另一个背面照明 图像传感器。

公开(公告)号：US20100279459A1

公开(公告)日：2010-11-04

申请号：US12772539

申请日：2010-05-03

Applicant: Kuan-Chieh HUANG ,  Chih-Jen WU ,  Chen-Ming HUANG ,  Dun-Nian YAUNG ,  An-Chun TU

Inventor： Kuan-Chieh HUANG ,  Chih-Jen WU ,  Chen-Ming HUANG ,  Dun-Nian YAUNG ,  An-Chun TU

IPC: H01L31/18

CPC classification number: H01L27/14689 ,  H01L21/28518

Abstract: A method for performing a CMOS Image Sensor (CIS) silicide process is provided to reduce pixel contact resistance. In one embodiment, the method comprises forming a Resist Protect Oxide (RPO) layer on the CIS, forming a Contact Etch Stop Layer (CESL), forming an Inter-Layer Dielectric (ILD) layer, performing contact lithography/etching, performing Physical Vapor Deposition (PVD) at a pixel contact hole area, annealing for silicide formation at pixel contact hole area, performing contact filling, and defining the first metal layer. The Resist Protect Oxide (RPO) layer can be formed without using a photo mask of Cell Resist Protect Oxide (CIRPO) photolithography for pixel array and/or without silicide process at pixel array. The method can include implanting N+ or P+ for pixel contact plugs at the pixel contact hole area. The contact filling can comprise depositing contact glue plugs and performing Chemical Mechanical Polishing (CMP).

Abstract translation: 提供了用于执行CMOS图像传感器（CIS）硅化物处理的方法以减少像素接触电阻。 在一个实施例中，该方法包括在CIS上形成抗蚀保护氧化物（RPO）层，形成接触蚀刻停止层（CESL），形成层间介电层（ILD）层，进行接触光刻/蚀刻，进行物理蒸气 在像素接触孔区域沉积（PVD），在像素接触孔区域进行硅化物形成退火，进行接触填充和限定第一金属层。 可以形成抗蚀保护氧化物（RPO）层，而不使用用于像素阵列的和/或不在像素阵列处的硅化物处理的电池抗蚀保护氧化物（CIRPO）光刻的光掩模。 该方法可以包括在像素接触孔区域处植入用于像素接触插塞的N +或P +。 接触填充可以包括沉积接触胶塞并进行化学机械抛光（CMP）。