Patent search ap:"Delin Li" Page 2

11.

发明申请
METHODS FOR FABRICATING THIN FILM SOLAR CELLS 审中-公开
Title translation: 薄膜太阳能电池的制备方法

公开(公告)号：US20130230933A1

公开(公告)日：2013-09-05

申请号：US13849678

申请日：2013-03-25

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L31/0272

CPC classification number: H01L31/0272 , C25D3/40 , C25D3/54 , C25D3/56 , C25D5/10 , C25D5/18 , C25D5/48 , C25D7/126 , H01L21/02425 , H01L21/02491 , H01L21/02568 , H01L21/02614 , H01L21/02628 , H01L22/12 , H01L31/0322 , H01L31/03928 , H01L31/0749 , Y02E10/541 , Y02P70/521

Abstract: A method for fabricating a thin-film solar cell. The method includes rolling a flexible substrate prepared with a metalized surface out of a roll to move linearly with a speed. The method further includes forming a back-electrode film overlying the metalized surface moving with the speed. Additionally, the method includes forming a stack of films comprising at least copper, gallium, and indium overlying the back-electrode film and forming a Se-alloy layer overlying the stack of films. Furthermore, the method includes depositing a Se—Na bearing film overlying the Se-alloy layer from a vacuum evaporator having at least two sources. Moreover, the method includes performing a thickness measurement in real time for the back-electrode film, the stack of films, and the Se-alloy layer on the flexible substrate moving with the speed to control the Se-alloy layer in a thickness of 10-100 nm corresponding to the Se—Na film in a thickness of 1-3 microns.

Abstract translation: 一种制造薄膜太阳能电池的方法。该方法包括将由金属化表面制备的柔性基材滚出，以速度线性地移动。该方法还包括形成覆盖金属化表面的背面电极膜，该表面以速度移动。此外，该方法包括形成至少包含覆盖在背电极膜上的铜，镓和铟的膜的叠层，并且形成覆盖该层叠膜的Se合金层。此外，该方法包括从具有至少两个源的真空蒸发器沉积覆盖Se合金层的Se-Na轴承膜。此外，该方法包括对于背面电极膜，薄膜叠层和柔性基板上的Se合金层实时地进行厚度测量，以便以Se的速度控制Se合金层的厚度为10 -100nm对应于厚度为1-3微米的Se-Na膜。

12.

发明授权
Ni-25 heat-resistant nodular graphite cast iron for use in exhaust systems 有权
Title translation: 用于排气系统的Ni-25耐热球墨铸铁

公开(公告)号：US08454764B2

公开(公告)日：2013-06-04

申请号：US12919044

申请日：2008-02-25

Applicant: Robert Logan , Delin Li , Shuzhi Yu , Gangjun Liao

Inventor： Robert Logan , Delin Li , Shuzhi Yu , Gangjun Liao

IPC: C22C37/08 , C22C37/04 , F02B53/00

CPC classification number: C22C37/04 , C22C37/08 , C22C37/10

Abstract: A nodular graphite, heat-resistant cast iron composition for use in engine systems. The composition contains carbon 1.5-2.4 weight %, silicon 5.4-7.0 weight %, manganese 0.5-1.5 weight %, nickel 22.0-28.0 weight %, chromium 1.5-3.0 weight %, molybdenum 0.1-1.0 weight %, magnesium 0.03-0.1 weight %, and a balance weight % being substantially iron. The composition has an austenitic matrix. Additionally, the composition exhibits excellent oxidation resistance at high temperature and excellent mechanical properties at both room and high temperatures. Thus, the composition can be a lower cost substitute material for Ni-Resist D5S under thermocycling conditions experienced by exhaust gas accessories and housings such as engine exhaust manifolds, turbocharger housings, and catalytic converter housings.

Abstract translation: 用于发动机系统的结节状石墨，耐热铸铁组合物。该组合物包含1.5-2.4重量％的碳，5.4-7.0重量％的硅，0.5-1.5重量％的锰，22.0-28.0重量％的镍，1.5-3.0重量％的铬，0.1-1.0重量％的钼，0.03-0.1重量％％，平衡重量％基本上为铁。该组合物具有奥氏体基质。此外，该组合物在高温下表现出优异的抗氧化性和在室温和高温下都具有优异的机械性能。因此，组合物可以是由排气附件和诸如发动机排气歧管，涡轮增压器壳体和催化转化器壳体的壳体经历的热循环条件下的Ni-Resist D5S的较低成本替代材料。

13.

发明申请
Solar Cell Design and Methods of Manufacture 审中-公开
Title translation: 太阳能电池的设计和制造方法

公开(公告)号：US20090272422A1

公开(公告)日：2009-11-05

申请号：US12430114

申请日：2009-04-27

Applicant: Delin Li

Inventor： Delin Li

IPC: H01L31/042 , H01L31/00

CPC classification number: H01L31/0322 , H01L31/022425 , H01L31/035281 , H01L31/046 , H01L31/0543 , H01L31/0749 , Y02E10/52 , Y02E10/541 , Y02P70/521

Abstract: A solar cell has a first surface and the second surface areas. The first surface is a semi-cylindrical area or modified semi-cylindrical area. The first surface is a flattened area. Sunlight strikes the semi-cylindrical area of the solar cell surface with a maximum incident angle from sunrise to sunset. A mirror may be attached on the top surface of the solar cell to further improve the efficiency.

Abstract translation: 太阳能电池具有第一表面和第二表面区域。第一表面是半圆柱形区域或改进的半圆柱形区域。第一个表面是平坦的区域。阳光照射太阳能电池表面的半圆柱形区域，具有从日出到日落的最大入射角。可以在太阳能电池的顶表面上附接反射镜以进一步提高效率。

14.

发明申请
Cast Iron With Improved High Temperature Properties 审中-公开
Title translation: 铸铁具有改善的高温性能

公开(公告)号：US20080274005A1

公开(公告)日：2008-11-06

申请号：US11913596

申请日：2006-05-04

Applicant: Gangjun Liao , Delin Li , Gene B. Burger , Robert N. Logan

Inventor： Gangjun Liao , Delin Li , Gene B. Burger , Robert N. Logan

IPC: C22C37/10 , C22C37/00 , C22C37/06

CPC classification number: C22C37/10 , C21D5/00 , C22C33/08 , C22C37/04

Abstract: A nodular, compacted graphite or other hybrid or duplex graphite morphology cast high silicon iron is disclosed which contains up to 1.5% tungsten, up to 0.8% vanadium, and up to 1.2% niobium; and at least 60.0% iron, all percentages are based on the total weight of the composition. This cast iron exhibits high strength and good ductility over a wide temperature range compared to the conventional SiMo ductile iron. The compositions may further contain, up to 1.5% molybdenum and up to 1.0% chromium to offer improvements in material strength. The compositions may include 0.2 to 0.5% by weight aluminum and up to 1.2% chromium for further oxidation resistance and 0.5 to 5.0% nickel for corrosion resistance.

Abstract translation: 公开了一种结节状，压实的石墨或其他混合或双相石墨形态铸造的高硅铁，其含有高达1.5％的钨，至多0.8％的钒和至多1.2％的铌; 和至少60.0％的铁，所有百分比均基于组合物的总重量。与传统的SiMo球墨铸铁相比，这种铸铁在宽的温度范围内表现出高强度和良好的延展性。组合物还可含有至多1.5％的钼和至多1.0％的铬以提供材料强度的改善。组合物可以包含0.2至0.5重量％的铝和至多1.2重量％的铬以用于进一步的抗氧化性，以及0.5-5.0％的镍用于耐腐蚀性。

15.

发明申请
Microelectronic assemblies having low profile connections 审中-公开
Title translation: 具有薄型连接的微电子组件

公开(公告)号：US20060275951A1

公开(公告)日：2006-12-07

申请号：US11487880

申请日：2006-07-17

Applicant: Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John Smith

Inventor： Michael Warner , Masud Beroz , David Light , Delin Li , Dennis Castillo , Hung-ming Wang , John Smith

IPC: H01L21/00

CPC classification number: H01L24/10 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49827 , H01L23/4985 , H01L23/5389 , H01L24/13 , H01L2224/05001 , H01L2224/05022 , H01L2224/05572 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/73204 , H01L2224/81193 , H01L2224/8193 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/00 , H01L2224/05644 , H01L2924/00014 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05124

Abstract: A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.

Abstract translation: 微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸在顶面和底面之间，与第一微电子元件上的触点对齐。组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接，电介质层的顶表面与第二微电子元件的第一表面间隔开。

16.

发明授权
Circuit board and a method for making the same 失效
Title translation: 电路板及其制作方法

公开(公告)号：US06972379B2

公开(公告)日：2005-12-06

申请号：US09814486

申请日：2001-03-20

Applicant: Delin Li

Inventor： Delin Li

IPC: H05K3/00 , H05K3/06 , H05K3/40 , H05K3/42 , H05K3/44 , H05K3/46 , H05K1/11

CPC classification number: H05K3/4685 , H05K3/0047 , H05K3/06 , H05K3/062 , H05K3/064 , H05K3/4038 , H05K3/4069 , H05K3/429 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K3/4611 , H05K3/4623 , H05K3/4641 , H05K2201/0305 , H05K2201/0352 , H05K2201/0355 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09309 , H05K2201/09509 , H05K2201/09554 , H05K2201/09563 , H05K2201/09609 , H05K2201/09845 , H05K2201/09881 , H05K2203/0369 , H05K2203/066 , H05K2203/0733 , H05K2203/1152 , H05K2203/1184 , H05K2203/1536 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165

Abstract: A method 10 for making a multi-layer electronic circuit board 110 having electroplated apertures 18, 20 which may be selectively and electrically isolated from electrically grounded member 12 and further having selectively formed air bridges and/or crossover members 50 which are structurally supported by material 54, and further having certain exposed connection surfaces 112, selectively and electrically connected to certain electrically conductive members 34, 42, and 44.

Abstract translation: 一种用于制造具有电镀孔18,20的多层电子电路板110的方法10，其可以与电接地构件12选择性地和电隔离，并且还具有结构上由材料支撑的选择性地形成的空气桥和/或交叉构件50 并且还具有某些暴露的连接表面112，其选择性地和电连接到某些导电构件34,42和44。

17.

发明授权
Metallized optical fibers and ferrules for optical fibers for direct attachment to photodiodes 失效
Title translation: 用于光纤的金属化光纤和套圈，用于直接连接到光电二极管

公开(公告)号：US06913399B2

公开(公告)日：2005-07-05

申请号：US10625255

申请日：2003-07-23

Applicant: Yen-Ping Ho , Delin Li

Inventor： Yen-Ping Ho , Delin Li

IPC: G02B6/42 , G02B6/36

CPC classification number: G02B6/4202 , G02B6/4238

Abstract: An optical component formed from a fiber directly coupled to a photodiode without any intervening optical components such as mirrors or lenses is disclosed. The optical component includes a stripped optical fiber having a core with a flat distal end that extends through a ferrule. The distal flat end of the core is printed with an annular coating of metal leaving a central portion of the core uncovered. The coated flat end of the core is initially aligned with an aperture or active area of a rear side of a back-illuminated photodiode which also includes a coating of metal. With the two parts in abutting engagement, a reflow or a partial melting process is carried out to directly couple the fiber core to the photodiode.

Abstract translation: 公开了一种由直接耦合到光电二极管的光纤形成的光学部件，而没有任何中间的光学部件，例如镜子或透镜。光学部件包括剥离的光纤，其具有延伸穿过套圈的平坦的远端的芯。芯的远端平坦端部印有环形的金属涂层，留下未覆盖的芯的中心部分。芯的涂覆的平坦端最初与背照式光电二极管的后侧的孔径或有源区域对准，其还包括金属涂层。在两个部件邻接接合的情况下，进行回流或部分熔融处理以将光纤芯直接耦合到光电二极管。