公开(公告)号：US10941496B2

公开(公告)日：2021-03-09

申请号：US16514022

申请日：2019-07-17

Applicant: MacDermid Enthone Inc.

Inventor： Chalo Aoun

IPC: C23C22/05 ,  C23G1/26 ,  B08B3/08 ,  C23G1/00

Abstract: A near neutral pH pickling composition for the removal of oxides from metallic surfaces, including heat treated steel. The pickling composition comprises a) a water-soluble organic or inorganic nitro compound, wherein a central N atom has an oxidation state of 3+; b) a polarizing agent for the nitro compound, wherein the polarizing agent comprises at least one of a phosphonate and a carboxylate; c) a pH buffer, and d) at least one metal complexing agent. The composition is preferably maintained at a pH between about 4.5 and about 7.5. The near neutral pH pickle composition can be used on various metallic surfaces as well as composite surfaces comprising metallic and non-metallic portions.

公开(公告)号：US10774425B2

公开(公告)日：2020-09-15

申请号：US15607925

申请日：2017-05-30

Applicant: MacDermid Enthone Inc.

Inventor： Cherry S. Santos ,  Tyler Banker ,  John Swanson ,  Ernest Long ,  Fengting Xu

IPC: C23C18/54 ,  H05K3/24 ,  H05K3/18

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

公开(公告)号：US10519557B2

公开(公告)日：2019-12-31

申请号：US15412809

申请日：2017-01-23

Applicant: MacDermid Enthone Inc.

Inventor： Vincent Paneccasio, Jr. ,  Kyle Whitten ,  Thomas B. Richardson ,  Ivan Li

IPC: C25D3/38 ,  C08G65/333 ,  H05K3/18 ,  H05K3/42 ,  C25D7/12 ,  C08G65/24 ,  C08L71/03 ,  H01L21/768 ,  H01L21/48 ,  H01L21/288

Abstract: An aqueous electrolytic composition and a process for electrodeposition of copper on a dielectric or semiconductor base structure using the aqueous electrolytic composition. The process includes (i) contacting a metalizing substrate comprising a seminal conductive layer on the base structure with an aqueous electrolytic deposition composition; and (ii) supplying electrical current to the electrolytic deposition composition to deposit copper on the substrate. The aqueous electrolytic composition comprises: (a) copper ions; (b) an acid; (c) a suppressor; and (d) a quaternized poly(epihalohydrin) comprising n repeating units corresponding to structure 1N and p repeating units corresponding to structure 1P:

公开(公告)号：US20190091724A1

公开(公告)日：2019-03-28

申请号：US15717275

申请日：2017-09-27

Applicant: MacDermid Enthone Inc.

Inventor： Keith Paul Parsons ,  Herrick Man Hin Yu

IPC: B05D5/02 ,  B29C45/14 ,  B29C69/02 ,  B05D3/06 ,  B05D3/02

Abstract: Textured hardcoat films are disclosed for preferable use in film insert moulding. Texture in the hardcoat film is created through the use of a textured protective overlayer, which can impart texture to the curable coating of the hardcoat film. This process preferably avoids the need to alter the composition of the curable coating to allow for texture and preferably produces a hardcoat film with a matte and reduced-glare finish. An apparatus and a method embodying the invention are disclosed.

公开(公告)号：US20190010624A1

公开(公告)日：2019-01-10

申请号：US15641756

申请日：2017-07-05

Applicant: MacDermid Enthone Inc.

Inventor： John Commander ,  Kyle Whitten ,  Vincent Paneccasio, JR. ,  Shaopeng Sun ,  Eric Yakobson

IPC: C25D3/16 ,  H01L21/768 ,  C25D5/02 ,  C25D7/12

Abstract: Compositions and methods of using such compositions for electroplating cobalt onto semiconductor base structures comprising submicron-sized electrical interconnect features are provided herein. The interconnect features are metallized by contacting the semiconductor base structure with an electrolytic composition comprising a source of cobalt ions, a suppressor, a buffer, and one or more of a depolarizing compound and a uniformity enhancer. Electrical current is supplied to the electrolytic composition to deposit cobalt onto the base structure and fill the submicron-sized features with cobalt. The method presented herein is useful for superfilling interconnect features.

公开(公告)号：US20180016685A1

公开(公告)日：2018-01-18

申请号：US15667002

申请日：2017-08-02

Applicant: MacDermid Enthone Inc.

Inventor： Trevor Pearson ,  Terrence Clark ,  Roshan V. Chapaneri

IPC: C25C1/10 ,  C25C7/02 ,  C25B11/12 ,  C25B1/21 ,  C23C18/20 ,  C23C18/30 ,  C23C18/22 ,  C25D5/54 ,  C25B9/06

CPC classification number: C25C1/10 ,  C23C18/2086 ,  C23C18/2093 ,  C23C18/22 ,  C23C18/30 ,  C25B1/21 ,  C25B9/06 ,  C25B11/12 ,  C25C7/02 ,  C25D5/54

Abstract: An electrolytic cell and a method of electrochemical oxidation of manganese(II) ions to manganese(III) ions in the electrolytic cell are described. The electrolytic cell comprises (1) an electrolyte solution of manganese(II) ions in a solution of 9 to 15 molar sulfuric acid; (2) a cathode immersed in the electrolyte solution; and (3) an anode immersed in the electrolyte solution and spaced apart from the cathode. Various anode materials are described including vitreous carbon, reticulated vitreous carbon, and woven carbon fibers.

公开(公告)号：US09613858B2

公开(公告)日：2017-04-04

申请号：US14325601

申请日：2014-07-08

Applicant: Enthone Inc.

Inventor： Vincent Paneccasio, Jr. ,  Xuan Lin ,  Richard Hurtubise ,  Qingyun Chen

IPC: C25D5/02 ,  C25D3/38 ,  H05K3/42 ,  H01L21/768 ,  C25D7/12 ,  H01L21/288 ,  H01L23/532

CPC classification number: H01L21/76879 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.

公开(公告)号：US09538665B2

公开(公告)日：2017-01-03

申请号：US14350971

申请日：2012-10-10

Applicant: ENTHONE INC.

Inventor： Edwin W. Bastenbeck ,  Harald Orschel ,  Ulrich Prinz

IPC: B05D5/12 ,  H05K3/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  B05D3/00

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 所公开的本发明涉及水激活剂溶液和用于在激光直接结构化的衬底表面上无电沉积铜的方法。 通过本发明，提出了含有强还原剂的水活化剂溶液，以提高LDS基材的照射表面积的催化活性。

公开(公告)号：US20160281251A1

公开(公告)日：2016-09-29

申请号：US15037267

申请日：2014-11-25

Applicant: Enthone Inc.

Inventor： Vincent Paneccasio ,  Kyle Whitten ,  John Commander ,  Richard Hurtubise ,  Eric Rouya

IPC: C25D3/38 ,  H05K3/18 ,  H05K1/09 ,  H01L21/768 ,  H01L23/532 ,  H01L21/288 ,  H05K3/42

CPC classification number: C25D3/38 ,  H01L21/2885 ,  H01L21/76879 ,  H01L23/53228 ,  H05K1/09 ,  H05K3/187 ,  H05K3/188 ,  H05K3/423

Abstract: In electrolytic copper plating, an aqueous composition comprising a source of copper ions and at least one alkylene or polyalkylene glycol monoether which is soluble in the aqueous phase and has molecular weight not greater than about 500 for improving the efficacy of other additives such as, for example, levelers and suppressors; and a related plating method.

Abstract translation: 在电解铜电镀中，包含铜离子源和至少一种可溶于水相的亚烷基或聚亚烷基二醇单醚的水性组合物，其分子量不大于约500以提高其它添加剂的效力，例如 例如，整平器和抑制器; 和相关电镀方法。

公开(公告)号：US08771495B2

公开(公告)日：2014-07-08

申请号：US13785946

申请日：2013-03-05

Applicant: Enthone Inc.

Inventor： Vincent Paneccasio, Jr. ,  Xuan Lin ,  Richard Hurtubise ,  Qingyun Chen

IPC: C25D5/02 ,  C25D3/38 ,  H05K3/42

CPC classification number: H01L21/76879 ,  C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76877 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and composition for metallizing a via feature in a semiconductor integrated circuit device substrate, using a leveler compound which is a dipyridyl compound.

Abstract translation: 一种用于金属化半导体集成电路器件衬底中的通孔特征的方法和组合物，使用作为二吡啶基化合物的矫味剂化合物。