Abstract:
A noise-reduced capacitive sensing unit is disclosed. The noise-reduced capacitive sensing unit includes: a sensing plate; a first bias voltage source for providing a first bias voltage; a second bias voltage source for providing a second bias voltage; a switch unit, connected between two bias voltage sources and the sensing plate, for selectively providing one of the bias voltages to the sensing plate; an excitation signal source for providing a bi-level waveform; a reference capacitor, formed between the excitation signal source and the sensing plate, for injecting the excitation signal to the sensing plate; and a voltage follower for providing sensing results, wherein an input node of the voltage follower is connected to the sensing plate.
Abstract:
A capacitive image sensor and a method for running the capacitive image sensor are disclosed. The capacitive image sensor includes a number of capacitive sensing elements, forming an array, each capacitive sensing element for transforming a distance between a portion of a surface of an approaching finger and a top surface thereof into an output voltage, wherein a value of the output voltage is changed by a driving signal exerted on the finger; an A/D converter, for converting the output voltage into a number and outputting the number; and a signal source, for providing the driving signal to the finger.
Abstract:
A remote control for a smart TV or a set-top box is disclosed. The remote control includes a capacitive fingerprint sensor, a processor and a wireless transmitter. The present invention takes advantages of the capacitive fingerprint sensor so that every user's personal data and corresponding setting for the smart TV or set-top box are available. Channel (or web-site) content rating can be achieved. Purchasing over TV can be safer than ever.
Abstract:
A Printed Circuit Board Assembly (PCBA) for forming an enhanced biometric module and a method for manufacturing the PCBA are disclosed. The method includes the steps of providing a PCB, a biometric sensing chip and SMDs; mounting the biometric sensing chip on the PCB with each bonding pad being electrically linked to one corresponding first contact pad; mounting the SMDs on second contact pads which are electrically linked thereto, respectively; and forming a protection layer. The present invention takes advantages of compact size of small conductive elements to avoid cracks in the protection layer.
Abstract:
A method for forming a stacked metal contact in electrical communication with aluminum wiring in a semiconductor wafer of an integrated circuit is disclosed. The method includes the steps of: forming at least one passivation layer on a surface of the semiconductor wafer of the integrated circuit, where an aluminum wiring is embedded; forming a patterned terminal via opening through the passivation layer to expose the aluminum wiring; removing a portion of the aluminum wiring from the patterned terminal via opening by chemical etching and forming a thin zinc film on an etched surface at the same time; forming a nickel film stacked on the zinc film; and; and forming a metal stack in the patterned terminal via opening and/or at least a portion of the passivation layer by chemical plating or metal plating.
Abstract:
An image sensing device that can adjust parameters of an image before sending it to a processor for reducing computing power and/or storage requirement is disclosed. The image sensing device includes an array of sensing pixels; an output amplifier; an analog-to-digital converter; a first set of registers and a second set of registers; an activation circuit; and a profiling logic. The profiling logic conducts statistical analysis on output data and adjusts parameters stored in the first set of registers until results of the statistical analysis reaches a target standard, wherein the adjusted parameters are used to generate an output image by each sensing pixel of the array of sensing pixels once the target standard is reached and a notification signal is sent to an external device for notifying the failure of parameter adjustment if the target standard fails to be reached within a predetermined times of adjustment.
Abstract:
A biometric security device for digital key storing is disclosed. The biometric security device includes a biometric information fetching module and a processing module. The processing module has a nonvolatile storage unit and a processing unit. The nonvolatile storage unit includes a secure storage unit and a general storage unit. The biometric security device with a secure electronic key designed for storing secret data utilizes both TrustZone™ technology (or similar technology) and biometric authentication. Thus, it can provide the flexibility for multiple users or applications to use the biometric security device or any equipment the biometric security device mounted in without compromising the safeguard of the data stored therein.
Abstract:
A secure electronic device is disclosed. The secure electronic device includes a first core processing unit, a secure boot Read-Only Memory, a first non-volatile memory, a first volatile memory and a first communication interface. A new framework based on the secure electronic device with built-in security is able to safeguard intellectual property for the developers and further improves the security of the secure electronic device. Thus, more developers can launch their programs or services without being stolen or tampered by an unauthorized party.
Abstract:
A contact image sensor is disclosed in the present invention. The contact image sensor includes: a substrate; an array of sensing units, formed above the substrate; a first insulation structure, formed over the sensing units and the substrate; a number of focusing units, formed above the first insulation structure, each focusing unit is aligned above a corresponding sensing unit with the first insulation structure sandwiched therebetween; a conductive metal layer, linked to a control circuit; an array of Organic Light-Emitting Diode (OLED) units, formed above the conductive metal layer and connected thereto; a transparent conductive layer, formed above the array of OLED units, and connected to the control circuit to control the statuses of the OLED units; and a transparent insulation structure, formed above the transparent conductive layer.
Abstract:
A chip with I/O pads on the peripheries and a method making the chip is disclosed. The chip includes: a substrate; at least two metal layers, formed above the substrate, each metal layer forming a specific circuit, wherein two adjacent metal layers are separated by an inter-metal dielectric layer; and a passivation layer, formed on a top side of the chip. By changing the I/O pad from the top of the chip to the peripheries, the extra thickness of the packaged chip caused by wire bonding in the prior arts can be reduced.