公开(公告)号：US20070111561A1

公开(公告)日：2007-05-17

申请号：US11565715

申请日：2006-12-01

Applicant: Alan Wang ,  Kevin Olson ,  Thomas DiStefano

Inventor： Alan Wang ,  Kevin Olson ,  Thomas DiStefano

IPC: H01R12/00

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/44 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/0919 ,  H05K2201/09309 ,  H05K2201/09554 ,  H05K2201/10446 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.

Abstract translation: 提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分 到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 和（d）以一种方式将第一电路板与一次性部分分离，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。 还提供了通过该方法形成的电路板。

公开(公告)号：US20060244135A1

公开(公告)日：2006-11-02

申请号：US11441976

申请日：2006-05-26

Applicant: Igor Khandros ,  Thomas Distefano

Inventor： Igor Khandros ,  Thomas Distefano

IPC: H01L23/48

CPC classification number: H01L22/32 ,  H01L21/6836 ,  H01L21/822 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2224/8547 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

Abstract translation: 公开了一种微电子部件，其包括具有开口的介电层和延伸穿过开口的引线。 导线具有偏移部分。 制造微电子组件的方法包括将每个引线连接到微电子元件上的触点。 半导体芯片组件具有具有开口的微电子部件，并且穿过开口延伸引线。 引线连接到半导体芯片上的触点，并具有至少一个扭绞部分。

公开(公告)号：US20060009051A1

公开(公告)日：2006-01-12

申请号：US11226186

申请日：2005-09-13

Applicant: Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

Inventor： Koenraad Schuylenbergh ,  Armin Volkel ,  Thomas DiStefano ,  Michel Rosa ,  David Fork ,  Eugene Chow ,  Meng Lean

IPC: H01R12/00

CPC classification number: H01R12/78 ,  H05K1/147 ,  H05K3/323 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/044 ,  H05K2201/09845

Abstract: A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

公开(公告)号：US20050139986A1

公开(公告)日：2005-06-30

申请号：US11064630

申请日：2005-02-24

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas Distefano ,  John Smith

IPC: H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L23/04 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

Abstract: An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

Abstract translation: 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US20050087855A1

公开(公告)日：2005-04-28

申请号：US10990015

申请日：2004-11-16

Applicant: Igor Khandros ,  Thomas Distefano

Inventor： Igor Khandros ,  Thomas Distefano

IPC: H01L21/60 ,  H01L21/822 ,  H01L21/98 ,  H01L23/13 ,  H01L23/31 ,  H01L23/485 ,  H01L23/498 ,  H01L23/58 ,  H01L25/16 ,  H01L23/02

CPC classification number: H01L22/32 ,  H01L21/6836 ,  H01L21/822 ,  H01L23/13 ,  H01L23/3107 ,  H01L23/3164 ,  H01L23/485 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49861 ,  H01L24/27 ,  H01L24/48 ,  H01L24/81 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2224/8547 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06579 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic component comprising a dielectric layer having an opening and leads extending across the opening is disclosed. The leads have an offset portion. A method of making a microelectronic assembly comprises connecting each of the leads to a contact on a microelectronic element. A semiconductor chip assembly has a microelectronic component with an opening and leads extending across the opening. The leads are connected to contacts on a semiconductor chip and have at least one twisted portion.

Abstract translation: 公开了一种微电子部件，其包括具有开口的介电层和延伸穿过开口的引线。 导线具有偏移部分。 制造微电子组件的方法包括将每个引线连接到微电子元件上的触点。 半导体芯片组件具有具有开口的微电子部件，并且穿过开口延伸引线。 引线连接到半导体芯片上的触点，并具有至少一个扭绞部分。

公开(公告)号：US20070197099A1

公开(公告)日：2007-08-23

申请号：US11670340

申请日：2007-02-01

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: H01R13/66

CPC classification number: H01R13/2407 ,  H01L2224/16225 ,  H01L2924/15312

Abstract: A socket connector for connecting a post or ball wherein the female element grips the post with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing helical prongs so as to allow the prongs of the connector to spirally open around the post or ball-like bump and mechanically grip the post or bump as the post or bump is inserted along the longitudinal axis of the tube. The tubular element may be made by forming helical prongs in the end of a tube in helical cuts from about a mid section to one end of the tube.

Abstract translation: 一种用于连接柱或球的插座连接器，其中，母构件用低插入力的端尖用弹性插脚夹住柱，但保持正接触，并且其中通常通过增加由阴元件施加到柱上的力来阻止尝试拔出 对撤军的回应。 阴元件包括弹性导电材料管，其已被切片或螺旋地分隔成相对的螺旋插脚，以便允许连接器的插脚螺旋地围绕柱或球状凸起打开，并机械地夹持柱或凸块 柱或凸块沿着管的纵向轴线插入。 管状元件可以通过在管的端部中形成螺旋形尖头而制成，其中螺旋形尖头以大约中间部分至管的一端为螺旋形切口。

公开(公告)号：US20060225272A1

公开(公告)日：2006-10-12

申请号：US11450537

申请日：2006-06-09

Applicant: Thomas Distefano

Inventor： Thomas Distefano

IPC: H05K3/30

CPC classification number: H01L21/568 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/50 ,  H01L24/83 ,  H01L24/86 ,  H01L24/97 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01009 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49821 ,  H01L2224/83 ,  H01L2224/05599

Abstract: A method of making a microelectronic package includes providing a first microelectronic element having electrically conductive parts and including first and second surfaces and providing a compliant element including a releasable adhesive over the first surface of the first microelectronic element. A second microelectronic element having electrically conductive parts is abutted against the releasable adhesive so that the second microelectronic element is releasably assembled to the first microelectronic element and the electrically conductive parts of the first and second microelectronic elements are connected to one another. The releasably assembled package is tested to determine whether the package has been properly assembled. A curable liquid is then introduced between the first and second microelectronic elements of a properly assembled package and the curable liquid is cured to permanently assemble the first and second microelectronic elements together.

公开(公告)号：US20060049498A1

公开(公告)日：2006-03-09

申请号：US11259398

申请日：2005-10-26

Applicant: Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

Inventor： Zlata Kovac ,  Craig Mitchell ,  Thomas DiStefano ,  John Smith

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/29 ,  H01L24/72 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2224/81 ,  H01L2924/3512 ,  H01L2924/00

Abstract: An assembly includes a structure, a plurality of terminals and a plurality of compliant pads disposed between said terminals and said structure. The terminals are aligned with at least some of said pads, with the pads providing a standoff between the structure and the terminals. The compliant pads are preferably made of a non-conductive material such as a silicone elastomer.

Abstract translation: 组件包括设置在所述端子和所述结构之间的结构，多个端子和多个柔性焊盘。 端子与至少一些所述焊盘对准，焊盘在结构和端子之间提供间隔。 柔性衬垫优选地由诸如硅氧烷弹性体的非导电材料制成。

公开(公告)号：US20050275662A1

公开(公告)日：2005-12-15

申请号：US10868312

申请日：2004-06-15

Applicant: Thomas DiStefano

Inventor： Thomas DiStefano

IPC: G06F17/21 ,  G06F17/24 ,  G09G5/00

CPC classification number: G06F17/24 ,  G06F17/212

Abstract: A method of designing a plurality of elements to be implemented on at least one web page of a website is provided. The method includes providing a first display region on a user interface, the first display region being capable of displaying the plurality of elements; providing a second display region on the user interface, the second display region being capable of displaying the plurality of elements; and displaying a first element in the second display region. The method further includes receiving a first command to modify the first element in the second display region; modifying the first element in response to the first command; and displaying the modified first element in the first display region. The modified first element forms at least part of a first web page of the website that is displayed in the first display region, and the first display region is capable of displaying the first web page in an interactive manner.

Abstract translation: 提供了一种设计要在网站的至少一个网页上实现的多个元素的方法。 该方法包括在用户界面上提供第一显示区域，第一显示区域能够显示多个元素; 在所述用户界面上提供第二显示区域，所述第二显示区域能够显示所述多个元素; 以及在所述第二显示区域中显示第一元素。 该方法还包括接收修改第二显示区域中的第一元素的第一命令; 响应于第一命令修改第一元素; 以及在第一显示区域中显示修改的第一元素。 修改的第一元素形成在第一显示区域中显示的网站的第一网页的至少一部分，并且第一显示区域能够以交互方式显示第一网页。

公开(公告)号：US6080603A

公开(公告)日：2000-06-27

申请号：US268286

申请日：1999-03-15

Applicant: Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

Inventor： Thomas Distefano ,  John W. Smith ,  Anthony B. Faraci

IPC: H01L21/60 ,  H01L21/30 ,  H01L21/48 ,  H01L21/603 ,  H01L23/12 ,  H01L23/22 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01R12/71 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44

CPC classification number: H01L23/4985 ,  H01L21/4839 ,  H01L23/22 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/642 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49158

Abstract: In a method for mounting a sheet-like microelectronic element, the sheet-like element comprises a dielectric layer having a top surface and a bottom surface and is first bonded to an expansion ring. The expansion ring is then heated to stretch the sheet-like element. A frame ring, having an external diameter smaller than the internal diameter of the expansion ring, is then bonded to the sheet-like element. A plurality of leads are formed on the bottom surface of the sheet-like element, the leads including bonding pads. In other embodiments, a method is provided for bonding bond pads on a sheet-like microelectronic element to contacts on a microelectronic component.

Abstract translation: 在安装片状微电子元件的方法中，片状元件包括具有顶表面和底表面的电介质层，并且首先接合到膨胀环。 然后将膨胀环加热以拉伸片状元件。 然后将具有小于膨胀环内径的外径的框架环结合到片状元件。 多个引线形成在片状元件的底表面上，引线包括接合焊盘。 在其他实施例中，提供了一种用于将片状微电子元件上的接合焊盘接合到微电子部件上的接触的方法。