公开(公告)号：US07804178B2

公开(公告)日：2010-09-28

申请号：US11748135

申请日：2007-05-14

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/02 ,  H01L29/40

CPC classification number: H01L25/165 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/73203 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10045 ,  H05K2201/10977 ,  Y02P70/613

Abstract: A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.

Abstract translation: 一种半导体部件，包括：衬底，布置在衬底上的至少一个半导体芯片和同样布置在衬底上的至少一个无源器件。 无源器件的底面安装在基板上。 半导体部件还包括设置在无源器件的下侧和衬底之间的间隙。 该间隙填充有底部填充材料。 为了避免焊料泵送效应，无源器件的上侧和侧面也嵌入塑料化合物中。

公开(公告)号：US20080150124A1

公开(公告)日：2008-06-26

申请号：US11759977

申请日：2007-06-08

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/29 ,  B29C45/14 ,  H01L21/56

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

Abstract translation: 半导体器件包括塑料外壳和半导体芯片，其中半导体芯片包括有源顶侧和后侧。 在半导体芯片的有源顶侧设置插入件。 插入器的至少一部分嵌入到塑料外壳中，而插入件的顶侧形成半导体器件的顶侧。 顶侧配件形状布置在插入件的顶侧上，其中顶侧配件形状具有不具有塑料外壳组合物的预定曲率半径，并且顶侧配件形状具有凸或凹透镜状球体 片段形状。

公开(公告)号：US20060209513A1

公开(公告)日：2006-09-21

申请号：US11375565

申请日：2006-03-15

Applicant: Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz ,  Erich Syri

Inventor： Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz ,  Erich Syri

IPC: H05K7/20

CPC classification number: H01L23/4093 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A heat sink for surface-mounted semiconductor devices is provided on a superordinate circuit board of an electronic module. The heat sink includes a three-dimensionally structured thermally conductive plate with a press-on region and snap-action hooks. The snap-action hooks are arranged approximately at right angles with respect to the press-on region and are spring-elastically connected to the press-on region of the heat sink via a spring-elastic connecting region of the heat sink. The snap-action hooks engage with edge regions of a thermally conductive coupling plate with the press-on region generating pressure. The coupling plate is fixed to a rear side of a semiconductor chip of the surface-mounted semiconductor device.

Abstract translation: 用于表面安装的半导体器件的散热器设置在电子模块的上级电路板上。 散热器包括具有压入区域和快动钩的三维结构的导热板。 快动钩相对于压入区域大致直角设置，并且通过散热器的弹簧弹性连接区域弹簧连接到散热器的压入区域。 快动钩与导热联接板的边缘区域接合，压区产生压力。 耦合板固定到表面安装半导体器件的半导体芯片的后侧。

公开(公告)号：US06903932B2

公开(公告)日：2005-06-07

申请号：US10210602

申请日：2002-08-01

Applicant: Ingo Wennemuth ,  Volker Strutz ,  Uta Gebauer

Inventor： Ingo Wennemuth ,  Volker Strutz ,  Uta Gebauer

IPC: H01L23/10 ,  H01L25/065 ,  H05K7/20

CPC classification number: H01L23/10 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01078 ,  H01L2924/12044 ,  H01L2924/16152 ,  H01L2924/16153

Abstract: A covering element for covering subassemblies having a substrate and at least one component disposed thereon and to be protected, in particular, a semiconductor component, includes at least one substantially planar area for covering the at least one component to be protected, one or more moldings serving for mechanical support, at least one of the moldings being in contact with the substrate and/or a supporting element disposed on the substrate after the covering element has been mounted on the subassembly, and the planar area and the molding being disposed such that, in the event of pressure on the covering element, no displacement of the at least one component (4) to be protected occurs.

Abstract translation: 用于覆盖具有基底的覆盖元件和设置在其上并被保护的至少一个部件，特别是半导体部件的覆盖元件包括至少一个基本上平坦的区域，用于覆盖至少一个待保护元件，一个或多个模制品 用于机械支撑，所述模制品中的至少一个在所述覆盖元件已经安装在所述子组件上之后与所述基板和/或设置在所述基板上的支撑元件接触，并且所述平面区域和所述模制件被设置成使得， 在被覆件的压力的情况下，不会发生被保护的至少一个部件（4）的位移。

公开(公告)号：US06851598B2

公开(公告)日：2005-02-08

申请号：US10205081

申请日：2002-07-25

Applicant: Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

Inventor： Uta Gebauer ,  Harry Hedler ,  Jürgen Högerl ,  Volker Strutz

IPC: B23K1/00 ,  H01L21/60 ,  H05K3/32 ,  B23K31/00 ,  B23K31/02

CPC classification number: H01L24/81 ,  B23K1/0016 ,  B23K2101/40 ,  H01L24/14 ,  H01L24/17 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/10135 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14505 ,  H01L2224/45144 ,  H01L2224/73253 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/325 ,  H05K2201/09781 ,  H05K2201/2036 ,  H01L2924/00

Abstract: An electronic component with at least one semiconductor chip and a wiring layer are described. The wiring layer has elastic contact elements of low mechanical strength in the spatial directions x, y and z, which can be electrically connected to corresponding contact terminal areas of a printed circuit board. The semiconductor chip or the wiring layer additionally has at least two spacers for the mechanical connection to a printed circuit board. A method for producing the electronic component is also described.

Abstract translation: 描述了具有至少一个半导体芯片和布线层的电子部件。 布线层具有在空间方向x，y和z上具有低机械强度的弹性接触元件，其可以电连接到印刷电路板的相应接触端子区域。 半导体芯片或布线层另外具有至少两个用于机械连接到印刷电路板的间隔件。 还描述了用于制造电子部件的方法。

公开(公告)号：US08722514B2

公开(公告)日：2014-05-13

申请号：US13007892

申请日：2011-01-17

Applicant: Carsten von Koblinski ,  Volker Strutz ,  Manfred Engelhardt

Inventor： Carsten von Koblinski ,  Volker Strutz ,  Manfred Engelhardt

IPC: H01L21/30 ,  H01L21/46 ,  H01L23/31

CPC classification number: H01L43/14 ,  H01L21/78 ,  H01L21/84 ,  H01L23/3121 ,  H01L23/3171 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/06 ,  H01L27/12 ,  H01L27/22 ,  H01L43/04 ,  H01L43/065 ,  H01L43/12 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: In one embodiment, a semiconductor device includes a glass substrate, a semiconductor substrate disposed on the glass substrate, and a magnetic sensor disposed within and/or over the semiconductor substrate.

Abstract translation: 在一个实施例中，半导体器件包括玻璃衬底，设置在玻璃衬底上的半导体衬底和设置在半导体衬底内和/或之上的磁传感器。

公开(公告)号：US20120112365A1

公开(公告)日：2012-05-10

申请号：US13348531

申请日：2012-01-11

Applicant: Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

Inventor： Udo Ausserlechner ,  Carsten von Koblinski ,  Sigrid Wabnig ,  Volker Strutz ,  Robert Grünberger

IPC: H01L23/52 ,  H01L21/56

CPC classification number: G01R15/20 ,  G01R15/207 ,  G01R33/072 ,  H01L23/047 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32111 ,  H01L2224/32237 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48463 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/49177 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In one embodiment, a semiconductor package includes an isolating container having a recess, which forms an inner membrane portion and an outer rim portion. The rim portion is thicker than the membrane portion. The package includes a semiconductor chip disposed in the recess and a backplane disposed under the membrane portion of the isolating container.

Abstract translation: 在一个实施例中，半导体封装包括具有形成内膜部分和外缘部分的凹部的隔离容器。 边缘部分比膜部分厚。 封装包括设置在凹部中的半导体芯片和设置在隔离容器的膜部下方的背板。

公开(公告)号：US08026618B2

公开(公告)日：2011-09-27

申请号：US11759977

申请日：2007-06-08

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/28

CPC classification number: H01L23/4334 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/48 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a plastic housing and a semiconductor chip, wherein the semiconductor chip includes an active top side and a rear side. An interposer is arranged on the active top side of the semiconductor chip. At least a portion of the interposer is embedded into the plastic housing, while the top side of the interposer forms the top side of the semiconductor device. A top side fitting shape is arranged on the top side of the interposer, where the top side fitting shape has a predetermined radius of curvature that is free of plastic housing composition, and the top side fitting shape has a convex or concave lens-shaped sphere segment shape.

Abstract translation: 半导体器件包括塑料外壳和半导体芯片，其中半导体芯片包括有源顶侧和后侧。 在半导体芯片的有源顶侧设置插入件。 插入器的至少一部分嵌入到塑料外壳中，而插入件的顶侧形成半导体器件的顶侧。 顶侧配件形状布置在插入件的顶侧上，其中顶侧配件形状具有不具有塑料外壳组合物的预定曲率半径，并且顶侧配件形状具有凸或凹透镜状球体 片段形状。

公开(公告)号：US07825506B2

公开(公告)日：2010-11-02

申请号：US11910113

申请日：2006-03-27

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L23/02

CPC classification number: H01L25/0655 ,  H01L23/16 ,  H01L23/3128 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09972 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor module and a method for producing the same is disclosed. In one embodiment, the semiconductor module has adjacent regions on a common wiring substrate in a common plastic housing composition. The regions are thermally decoupled by a thermal barrier. Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions, the thermal barrier ensuring that the function of the more thermally sensitive semiconductor chip is not impaired by the heat-loss-generating semiconductor chip.

Abstract translation: 公开了一种半导体模块及其制造方法。 在一个实施例中，半导体模块在共同的塑料外壳组合物中的公共布线基板上具有相邻区域。 这些区域被热障隔热解耦。 散热差异不同的半导体芯片被布置在这些热分离区域中，确保热损失较大的半导体芯片的功能不受损失发热半导体芯片的热障。

公开(公告)号：US20090057874A1

公开(公告)日：2009-03-05

申请号：US11910113

申请日：2006-03-27

Applicant: Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

Inventor： Erich Syri ,  Gerold Gruendler ,  Juergen Hoegerl ,  Thomas Killer ,  Volker Strutz

IPC: H01L21/52 ,  H01L23/02

CPC classification number: H01L25/0655 ,  H01L23/16 ,  H01L23/3128 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K3/284 ,  H05K2201/062 ,  H05K2201/09972 ,  H05K2201/10674 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Semiconductor module comprising semiconductor chips in a plastic housing in separate regions and method for producing the sameThe invention relates to a semiconductor module (9) comprising semiconductor chips (1, 2) in a plastic housing (3) in separate regions (4, 5), and to a method for producing the same. In this case, the semiconductor module (9) has adjacent regions (4, 5) on a common wiring substrate (7) in a common plastic housing composition (6), said regions being thermally decoupled by a thermal barrier (8). Semiconductor chips whose evolution of heat loss differs are arranged in these thermally separate regions (4, 5), the thermal barrier (8) ensuring that the function of the more thermally sensitive semiconductor chip (2) is not impaired by the heat-loss-generating semiconductor chip (1).

Abstract translation: 半导体模块包括分离区域中的塑料壳体中的半导体芯片及其制造方法技术领域本发明涉及一种半导体模块（9），其包括在分离区域（4,5）中的塑料壳体（3）中的半导体芯片（1,2） ）及其制造方法。 在这种情况下，半导体模块（9）在共同的塑料外壳组合物（6）中的公共布线基板（7）上具有相邻的区域（4,5），所述区域由热障（8）热解耦。 散热差异不同的半导体芯片被布置在这些热分离区域（4,5）中，确保热敏半导体芯片（2）的功能不受热损耗的影响， 生成半导体芯片（1）。