公开(公告)号：US20160372307A1

公开(公告)日：2016-12-22

申请号：US14742142

申请日：2015-06-17

Applicant: Applied Materials, Inc.

Inventor： YANG YANG ,  Kartik RAMASWAMY ,  Steven LANE ,  Lawrence WONG ,  Shahid RAUF ,  Andrew NGUYEN ,  Kenneth S. COLLINS ,  Roger Alan LINDLEY

IPC: H01J37/32 ,  C23C14/48 ,  C23C16/458 ,  C23C16/505

CPC classification number: H01J37/32715 ,  H01J37/32165 ,  H01J37/32568 ,  H01J37/3299

Abstract: Implementations described herein provide a substrate support assembly which enables tuning of a plasma within a plasma chamber. In one embodiment, a method for tuning a plasma in a chamber is provided. The method includes providing a first radio frequency power and a direct current power to a first electrode in a substrate support assembly, providing a second radio frequency power to a second electrode in the substrate support assembly at a different location than the first electrode, monitoring parameters of the first and second radio frequency power, and adjusting one or both of the first and second radio frequency power based on the monitored parameters.

Abstract translation: 本文所述的实施方案提供了能够调整等离子体室内的等离子体的衬底支撑组件。 在一个实施例中，提供了一种用于调谐腔室中的等离子体的方法。 该方法包括向衬底支撑组件中的第一电极提供第一射频功率和直流电力，在与第一电极不同的位置处向衬底支撑组件中的第二电极提供第二射频功率，监测参数 的第一和第二射频功率，并且基于所监视的参数来调整第一和第二射频功率中的一个或两个。

公开(公告)号：US20150293527A1

公开(公告)日：2015-10-15

申请号：US14677901

申请日：2015-04-02

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Yogananda SARODE VISHWANATH ,  Tom K. CHO

IPC: G05B19/418

Abstract: The present disclosure generally relates to process chambers having modular design to provide variable process volume and improved flow conductance and uniformity. The modular design according to the present disclosure achieves improved process uniformity and symmetry with simplified chamber structure. The modular design further affords flexibility of performing various processes or processing substrates of various sizes by replacing one or more modules in a modular process chamber according to the present disclosure.

Abstract translation: 本公开通常涉及具有模块化设计以提供可变工艺体积和改善的流动传导和均匀性的处理室。 根据本公开的模块化设计通过简化的室结构实现了改进的工艺均匀性和对称性。 模块化设计进一步提供了通过根据本公开的替换模块化处理室中的一个或多个模块来执行各种尺寸的各种工艺或处理衬底的灵活性。

公开(公告)号：US20150097486A1

公开(公告)日：2015-04-09

申请号：US14505065

申请日：2014-10-02

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Kartik RAMASWAMY ,  Yogananda SARODE VISHWANATH ,  Alexander Charles MARCACCI

IPC: H01L21/67 ,  H01J7/46

CPC classification number: H01J7/46 ,  H01J37/32082 ,  H01J37/3244 ,  H01J37/32596

Abstract: A showerhead assembly includes a front plate having a front surface, a back surface and a plurality of first through holes connecting the front surface and the back surface, a back plate having a front surface, a back surface and a plurality of second through holes connecting the front surface and the back surface, and an adhesive layer joining the back surface of the front plate and the front surface of the back plate. The plurality of first through holes are aligned with the plurality of second through holes, and the front plate and the back plate are formed from dissimilar materials.

Abstract translation: 一种喷头组件，包括具有前表面，后表面和连接前表面和后表面的多个第一通孔的前板，具有前表面，后表面和后表面的多个第二通孔， 前表面和后表面，以及将前板的后表面和后板的前表面接合的粘合剂层。 多个第一通孔与多个第二通孔对准，前板和后板由不同的材料形成。

公开(公告)号：US20240363315A1

公开(公告)日：2024-10-31

申请号：US18307931

申请日：2023-04-27

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Lu LIU ,  Toan Q. TRAN ,  Daniel NGUYEN

IPC: H01J37/32 ,  H01L21/683

CPC classification number: H01J37/32697 ,  H01J37/32724 ,  H01L21/6833 ,  H01J2237/2007 ,  H01J2237/20235 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/3321 ,  H01J2237/3327

Abstract: Aspects of the present disclosure generally relate to apparatus and methods for an adjustable de-chucking voltage associated with an electrostatically charged substrate in a processing chamber. An example method of de-chucking a substrate disposed in a process chamber includes processing a substrate in a chamber body, the substrate being coupled to a substrate support comprising a chucking electrode. The method further includes monitoring a property associated with a lift pin assembly movable relative to the chucking electrode via an actuator. The method further includes adjusting a first voltage level applied to the chucking electrode in response to the property associated with the lift pin assembly satisfying one or more criteria.

公开(公告)号：US20240087859A1

公开(公告)日：2024-03-14

申请号：US17940513

申请日：2022-09-08

Applicant: Applied Materials, Inc.

Inventor： Kartik RAMASWAMY ,  Andrew NGUYEN ,  Yang YANG ,  Sathya GANTA ,  Fernando SILVEIRA ,  Yue GUO ,  Lu LIU

IPC: H01J37/32

CPC classification number: H01J37/32862 ,  H01J37/32082 ,  H01J2237/334

Abstract: Methods and apparatus for forming plasma in a process chamber use an annular exciter formed of a first conductive material with a first end electrically connected to an RF power source that provides RF current and a second end connected to a ground and an annular applicator, physically separated from the annular exciter, formed of a second conductive material with at least one angular split with an angle forming an upper overlap portion and a lower overlap portion separated by a high K dielectric material which is configured to provide capacitance in conjunction with an inductance of the annular applicator to form a resonant circuit that is configured to resonate when the annular exciter flows RF current that inductively excites the annular applicator to a resonant frequency which forms azimuthal plasma from the annular applicator.

公开(公告)号：US20220139679A1

公开(公告)日：2022-05-05

申请号：US17088407

申请日：2020-11-03

Applicant: Applied Materials, Inc.

Inventor： Job George KONNOTH JOSEPH ,  Sathya Swaroop GANTA ,  Kallol BERA ,  Andrew NGUYEN ,  Jay D. PINSON, II ,  Akshay DHANAKSHIRUR ,  Kaushik Comandoor ALAYAVALLI ,  Canfeng LAI ,  Ren-Guan DUAN ,  Jennifer Y. SUN ,  Anil Kumar KALAL ,  Abhishek PANDEY

IPC: H01J37/32 ,  H01J37/20

Abstract: A plasma chamber includes a chamber body having a processing region therewithin, a liner disposed on the chamber body, the liner surrounding the processing region, a substrate support disposed within the liner, a magnet assembly comprising a plurality of magnets disposed around the liner, and a magnetic-material shield disposed around the liner, the magnetic-material shield encapsulating the processing region near the substrate support.

公开(公告)号：US20220090686A1

公开(公告)日：2022-03-24

申请号：US17539372

申请日：2021-12-01

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Yogananda Sarode VISHWANATH ,  Xue CHANG ,  Anilkumar RAYAROTH ,  Chetan NAIK ,  Balachandra Jatak NARAYAN

IPC: F16K1/42 ,  F16K1/36

Abstract: Embodiments of symmetric flow valves for use in a substrate processing chamber are provided herein. In some embodiments, a symmetric flow valve includes a valve body having sidewalls, a bottom plate, and a top plate that together define an interior volume, wherein the top plate includes one or more axisymmetrically disposed openings; a poppet disposed in the interior volume, wherein the poppet includes a central opening and a plurality of portions configured to selectively seal the one or more axisymmetrically disposed openings of the top plate when the symmetric flow valve is in a closed position; and a first actuator coupled to the poppet to position the poppet within the interior volume in at least an open position, where the poppet is spaced apart from the top plate to allow flow through the one or more axisymmetrically disposed openings of the top plate, and the closed position.

公开(公告)号：US20210343508A1

公开(公告)日：2021-11-04

申请号：US16863541

申请日：2020-04-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Andrew NGUYEN ,  Xue Yang CHANG ,  Yu LEI ,  Xianmin TANG ,  John C. FORSTER ,  Yogananda Sarode VISHWANATH ,  Abilash SAINATH ,  Tza-Jing GUNG

IPC: H01J37/32 ,  C23C16/44

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a chamber liner having a tubular body with an upper portion and a lower portion; a confinement plate coupled to the lower portion of the chamber liner and extending radially inward from the chamber liner, wherein the confinement plate includes a plurality of slots; a shield ring disposed within the chamber liner and movable between the upper portion of the chamber liner and the lower portion of the chamber liner; and a plurality of ground straps coupled to the shield ring at a first end of each ground strap of the plurality of ground straps and to the confinement plate at a second end of each ground strap to maintain electrical connection between the shield ring and the chamber liner when the shield ring moves.

公开(公告)号：US20190148121A1

公开(公告)日：2019-05-16

申请号：US16248294

申请日：2019-01-15

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Yogananda SARODE VISHWANATH ,  Tom K. CHO

IPC: H01J37/32 ,  C23C16/458

Abstract: The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.

公开(公告)号：US20150218697A1

公开(公告)日：2015-08-06

申请号：US14612263

申请日：2015-02-02

Applicant: Applied Materials, Inc.

Inventor： Andrew NGUYEN ,  Yogananda SARODE VISHWANATH ,  Tom K. CHO

IPC: C23C16/458 ,  C23C16/455 ,  C23C16/50

CPC classification number: H01J37/32834 ,  C23C16/458 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32623

Abstract: The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.

Abstract translation: 本公开一般涉及在处理室中的电场，气流和热分布中的对称性以实现工艺均匀性的装置和方法。 本公开的实施例包括具有等离子体源，基板支撑组件和沿着相同中心轴对准的真空泵的等离子体处理室，以在等离子体处理室中产生基本上对称的流动路径，电场和热分布，从而改善 工艺均匀性和倾斜度降低。