公开(公告)号：US11462467B2

公开(公告)日：2022-10-04

申请号：US16929018

申请日：2020-07-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu Huang ,  Chun Chen Chen ,  Wei Chih Cho ,  Shao-Lun Yang ,  Yu-Shun Hsieh

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/31 ,  H01L23/00 ,  H01L23/495

Abstract: A lead frame includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion and an outer lead portion connecting to the inner lead portion. The inner lead portion is adjacent to and spaced apart from the die paddle. A bottom surface of the inner lead portion is higher than a bottom surface of the outer lead portion. The bottom surface of the inner lead portion includes one or more supporting members disposed thereon. The one or more supporting members have a convex surface facing away from the inner lead portion.

公开(公告)号：US11443997B2

公开(公告)日：2022-09-13

申请号：US16933806

申请日：2020-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Chih Cho ,  Chun Chen Chen ,  Shao-Lun Yang

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065

Abstract: A semiconductor package and a method of manufacturing the same are provided. The semiconductor package includes a first substrate, a second substrate, and a barrier structure. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface facing the second surface of the first substrate. The first substrate electrically bonds to the second substrate through a conductive terminal disposed between the second surface of the first substrate and the first surface of the second substrate. The barrier structure is disposed adjacent to the first surface of the first substrate.

公开(公告)号：US20210013585A1

公开(公告)日：2021-01-14

申请号：US16506654

申请日：2019-07-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01Q1/22 ,  H01L23/66

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.