公开(公告)号：US20210276860A1

公开(公告)日：2021-09-09

申请号：US17330245

申请日：2021-05-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang HSIAO ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Chia-Hung SHEN

IPC: B81C3/00 ,  B81C1/00

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

公开(公告)号：US20210082835A1

公开(公告)日：2021-03-18

申请号：US16569228

申请日：2019-09-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che HUANG ,  Lu-Ming LAI

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.

公开(公告)号：US20210036658A1

公开(公告)日：2021-02-04

申请号：US17074618

申请日：2020-10-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Hui-Chung LIU ,  Kuo-Hua LAI ,  Cheng-Ling HUANG

IPC: H03B5/04 ,  H01L23/13 ,  H01L23/00 ,  H01L23/36 ,  H03B5/30 ,  H01L23/14 ,  B81B7/00 ,  H03B5/36 ,  H03L1/04 ,  H03B1/02

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

公开(公告)号：US20200259058A1

公开(公告)日：2020-08-13

申请号：US16862447

申请日：2020-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Lu-Ming LAI ,  Yu-Ying LEE ,  Yung-Yi CHANG

IPC: H01L33/62 ,  B81C1/00 ,  H01L33/48

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

公开(公告)号：US20200080841A1

公开(公告)日：2020-03-12

申请号：US16683117

申请日：2019-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US20190267298A1

公开(公告)日：2019-08-29

申请号：US16282147

申请日：2019-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin Lin WU ,  Yu-Hsuan TSAI ,  Chang Chin TSAI ,  Lu-Ming LAI ,  Ching-Han HUANG

IPC: H01L23/20 ,  H01L23/043 ,  H01L23/053 ,  H01L23/10 ,  H01L23/26 ,  H01L21/48

Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.

公开(公告)号：US20160187530A1

公开(公告)日：2016-06-30

申请号：US14975036

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ruei-Bin MA ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: G01V8/12 ,  H01L31/18 ,  H01L31/167 ,  H01L25/16 ,  H01L31/0232

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.

Abstract translation: 光学模块包括载体，设置在载体上的发光部件，设置在载体上的光学传感器，壳体和透镜。 壳体设置在载体上并且包围发光部件和光学传感器。 壳体限定第一容纳空间，其包括第一孔和位于第一孔下方的第二孔。 壳体包括围绕第一孔的第一侧壁，围绕第二孔的第二侧壁和第一支撑部分，其中第一侧壁的底端和第二侧壁的顶端相交。 透镜位于第一孔中并由第一支撑部分支撑。 发光组件或光学传感器中的一个位于第一容纳空间中。

公开(公告)号：US20250115473A1

公开(公告)日：2025-04-10

申请号：US18984988

申请日：2024-12-17

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang HSIAO ,  Lu-Ming LAI ,  Ching-Han HUANG ,  Chia-Hung SHEN

IPC: H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/18

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.

公开(公告)号：US20220404908A1

公开(公告)日：2022-12-22

申请号：US17352125

申请日：2021-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chi Sheng TSENG ,  Lu-Ming LAI ,  Hui-Chung LIU ,  I Hung WU ,  Kai-Sheng PAI

IPC: G06F3/01 ,  H01Q1/27 ,  G06K19/077 ,  G01S13/75

Abstract: The present disclosure provides a body-part tracking device and a body-part tracking method. The body-part tracking device includes a first electronic component and a first antenna element. The first antenna element is electrically connected to the first electronic component and configured to receive a first wave. The first electronic component is configured to, in response to the first wave, transmit a second wave.

公开(公告)号：US20220187068A1

公开(公告)日：2022-06-16

申请号：US17684374

申请日：2022-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.