公开(公告)号：US20220187068A1

公开(公告)日：2022-06-16

申请号：US17684374

申请日：2022-03-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US20220068747A1

公开(公告)日：2022-03-03

申请号：US17006664

申请日：2020-08-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che HUANG ,  Lu-Ming LAI ,  Ying-Chung CHEN

IPC: H01L23/32 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.

公开(公告)号：US20200328322A1

公开(公告)日：2020-10-15

申请号：US16384847

申请日：2019-04-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Chen TSAI ,  Lu-Ming LAI ,  Hsun-Wei CHAN ,  Ying-Chung CHEN

IPC: H01L31/12 ,  H01L31/0232 ,  H01L31/0203

Abstract: An optical module and a method of manufacturing an optical module are provided. The optical module includes a carrier, an electronic component, a lid, a diffuser and a bonding layer. The electronic component is disposed on the carrier. The lid is disposed on the carrier. The lid has a first cavity to accommodate the electronic component. The lid defines a first aperture over the first cavity. The diffuser is disposed within the first aperture. The bonding layer is disposed between the diffuser and a sidewall of the first aperture.

公开(公告)号：US20170294560A1

公开(公告)日：2017-10-12

申请号：US15466502

申请日：2017-03-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying HO ,  Hsun-Wei CHAN ,  Ying-Chung CHEN ,  Lu-Ming LAI

IPC: H01L33/48 ,  H01L33/62 ,  H01L31/18 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02 ,  H01L33/58 ,  H01L33/00

Abstract: At least some embodiments of the present disclosure relate to a lid for covering an optical device. The lid includes a metal member and a transparent encapsulant. The metal member includes a top surface, a first bottom surface, and a second bottom surface between the top surface and the first bottom surface. The transparent encapsulant is surrounded by the metal member and covers at least a portion of the second bottom surface.

公开(公告)号：US20240243207A1

公开(公告)日：2024-07-18

申请号：US18096355

申请日：2023-01-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsiang-Cheng TSAI ,  Ying-Chung CHEN ,  Kuo-Hua LAI

IPC: H01L31/0203 ,  H01L31/0216

CPC classification number: H01L31/0203 ,  H01L31/02164

Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.

公开(公告)号：US20220406762A1

公开(公告)日：2022-12-22

申请号：US17349784

申请日：2021-06-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/34 ,  H04R1/10 ,  H04R29/00

Abstract: A semiconductor package device, a wearable device, and a temperature detection method are provided. The semiconductor package includes a substrate, an optical module, and a temperature module. The optical module is disposed on the substrate. The temperature module is disposed on the substrate and adjacent to the optical module. The temperature module comprises a semiconductor element and a temperature sensor stacked on the semiconductor element. The optical module is configured to detect a distance between the optical module and an object.

公开(公告)号：US20220115425A1

公开(公告)日：2022-04-14

申请号：US17066412

申请日：2020-10-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Ling HUANG ,  Lu-Ming LAI ,  Ying-Chung CHEN

IPC: H01L27/146

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

公开(公告)号：US20210257246A1

公开(公告)日：2021-08-19

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling MA ,  Ying-Chung CHEN ,  Hsin-Ying HO ,  Cheng-Ling HUANG ,  Chang Chin TSAI

IPC: H01L21/683 ,  H01L21/82 ,  H01L31/18 ,  H01L33/00

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US20200080841A1

公开(公告)日：2020-03-12

申请号：US16683117

申请日：2019-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung CHEN ,  Hsun-Wei CHAN ,  Lu-Ming LAI ,  Kuang-Hsiung CHEN

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US20170108357A1

公开(公告)日：2017-04-20

申请号：US14884065

申请日：2015-10-15

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Yung-Yi CHANG ,  Ying-Chung CHEN

IPC: G01D5/34

CPC classification number: G01D5/34

Abstract: The present disclosure provides an optical module and a manufacturing process thereof. The optical module includes a carrier, a light source, a light detector, a molding compound and a lid. The light source is disposed adjacent to a surface of the carrier. The light detector is disposed adjacent to the surface of the carrier. The molding compound encapsulates the light source and the light detector, and includes at least one guiding structure. The lid is disposed between the light source and the light detector, and surrounds the light source and the light detector.