公开(公告)号：US20220407200A1

公开(公告)日：2022-12-22

申请号：US17846971

申请日：2022-06-22

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Jacob W. Kooi ,  Choonsup Lee ,  Sofia Rahiminejad ,  Subash Khanal

IPC: H01P1/22 ,  H01P11/00 ,  H04B1/04 ,  H04B1/16

Abstract: A waveguide based variable attenuator device including one or more attenuators each including a porous dielectric material; and a metal coating on the top of the dielectric material; and an actuator coupled to the attenuator. The actuator is configured to position, with nanometer resolution, the one or more attenuators in a waveguide configured and dimensioned to guide an electromagnetic wave having a frequency in a range of 100 gigahertz (GHz) to 1 terahertz (THz). The actuator controls at least one of a position or a volume of the one attenuator inserted in the waveguide to achieve a variable or pre-determined attenuation of the electromagnetic wave transmitted through waveguide.

公开(公告)号：US09461352B2

公开(公告)日：2016-10-04

申请号：US14253541

申请日：2014-04-15

Applicant: California Institute of Technology

Inventor： Cecile Jung-Kubiak ,  Theodore Reck ,  Goutam Chattopadhyay ,  Jose Vicente Siles Perez ,  Robert H. Lin ,  Imran Mehdi ,  Choonsup Lee ,  Ken B. Cooper ,  Alejandro Peralta

IPC: G02B6/136 ,  H01P3/16 ,  H01P11/00

CPC classification number: H01P3/16 ,  H01P11/002 ,  H01P11/006

Abstract: A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

Abstract translation: 已经开发了多步硅蚀刻工艺来制造基于硅的太赫兹（THz）波导部件。 该技术通过批处理功能提供跨多个蚀刻深度的精确尺寸控制。 已经制造了非线性和无源部件，例如混频器和乘法器波导，混合器，OMT和扭曲器并集成到小型硅封装中。 这种制造技术使得晶片堆叠架构能够在太赫兹范围内提供超紧凑的多像素接收机前端。

公开(公告)号：US10693210B2

公开(公告)日：2020-06-23

申请号：US13869292

申请日：2013-04-24

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Imran Mehdi ,  Choonsup Lee ,  John J. Gill ,  Cecile D. Jung-Kubiak ,  Nuria Llombart

IPC: H01P11/00 ,  H01Q15/08 ,  H01Q19/06

Abstract: A set of antenna geometries for use in integrated arrays at terahertz frequencies are described. Two fabrication techniques to construct such antennas are presented. The first technique uses an advanced laser micro-fabrication, allowing fabricating advanced 3D geometries. The second technique uses photolithographic processes, allowing the fabrication of arrays on a single wafer in parallel.

公开(公告)号：US09791321B2

公开(公告)日：2017-10-17

申请号：US13902529

申请日：2013-05-24

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Ken B. Cooper ,  Emmanuel Decrossas ,  John J. Gill ,  Cecile Jung-Kubiak ,  Choonsup Lee ,  Robert Lin ,  Imran Mehdi ,  Alejandro Peralta ,  Theodore Reck ,  Jose Siles

IPC: G01J5/20 ,  G01S7/02 ,  G01S13/88 ,  G01S13/89 ,  G01J5/00 ,  G01S7/03

CPC classification number: G01J5/20 ,  G01J2005/0077 ,  G01J2005/204 ,  G01S7/02 ,  G01S7/036 ,  G01S13/887 ,  G01S13/89

Abstract: A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.

公开(公告)号：US20150280321A1

公开(公告)日：2015-10-01

申请号：US14675319

申请日：2015-03-31

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Adrian J. Tang ,  Nacer E. Chahat ,  Goutam Chattopadhyay ,  Choonsup Lee

IPC: H01Q3/46

CPC classification number: H01Q3/46

Abstract: A system for wirelessly communicating between a base station and a mobile device, including a reflector integrated with a mobile device, wherein the reflector reflects carrier radiation transmitted from a base station, to form a reflection of the carrier radiation, and input data from the mobile device modulates a reflection coefficient of the reflector, thereby modulating the reflection such that the reflection of the carrier radiation carries the input data to the base station.

Abstract translation: 一种用于在基站和移动设备之间进行无线通信的系统，包括与移动设备集成的反射器，其中所述反射器反射从基站发送的载波辐射，以形成载波辐射的反射，并且从移动台输入数据 器件调制反射器的反射系数，从而调制反射，使得载波辐射的反射将输入数据传送到基站。