公开(公告)号：US20150036302A1

公开(公告)日：2015-02-05

申请号：US14142180

申请日：2013-12-27

Applicant: California Institute of Technology

Inventor： Yu-Chong Tai ,  Han-Chieh Chang

IPC: H05K5/06 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K3/4038 ,  A61F9/0017 ,  H01L23/3135 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/032 ,  H05K3/0041 ,  H05K3/281 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/381 ,  H05K2201/017 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0139 ,  H05K2203/0514 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1338 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

Abstract translation: 本发明提供一种微封装装置，包括：用于固定装置的基板; 附着在所述基板上的腐蚀屏障; 可选地，至少一个馈通设置在所述衬底中，以允许至少一个输入和/或至少一个输出线进入所述微封装装置; 以及被配置为封装所述微封装设备的封装材料层。