公开(公告)号：US12052814B2

公开(公告)日：2024-07-30

申请号：US18051289

申请日：2022-10-31

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcom Parker Brown ,  Jose Juarez ,  Emily Hernandez ,  Joseph Pratt ,  Peter Stone ,  Vidya Viswanath ,  Will Findlay

IPC: H05K1/02 ,  H01B7/08 ,  H01B11/00 ,  H05K1/03

CPC classification number: H05K1/0219 ,  H01B11/00 ,  H05K1/0237 ,  H05K1/028 ,  H05K1/0326 ,  H05K2201/0145

Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

公开(公告)号：US20200137882A1

公开(公告)日：2020-04-30

申请号：US16667133

申请日：2019-10-29

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Jose Juarez ,  Emily Hernandez ,  Joseph Pratt ,  Peter Stone ,  Vidya Viswanath ,  Will Findlay

IPC: H05K1/02 ,  H01B11/00

Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

公开(公告)号：US10446956B2

公开(公告)日：2019-10-15

申请号：US16371708

申请日：2019-04-01

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01B7/04 ,  H01R12/59 ,  H01B7/08 ,  H05K1/02 ,  B60J5/04 ,  B60R16/02 ,  H01B7/00 ,  H01R43/20 ,  H01R12/69 ,  H01B7/42 ,  H01B13/012

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US20180301832A1

公开(公告)日：2018-10-18

申请号：US15952773

申请日：2018-04-13

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H01R12/69 ,  H01B7/08 ,  H01B7/04 ,  H01R43/20 ,  H01B7/00 ,  H05K1/02 ,  B60R16/02 ,  B60J5/04

CPC classification number: H01R12/592 ,  B60J5/0413 ,  B60R16/0215 ,  B60Y2410/115 ,  H01B7/0045 ,  H01B7/04 ,  H01B7/08 ,  H01B7/421 ,  H01B13/01254 ,  H01R12/69 ,  H01R43/205 ,  H01R2201/26 ,  H05K1/0201 ,  H05K1/028 ,  H05K2201/052

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US20220078902A1

公开(公告)日：2022-03-10

申请号：US17455386

申请日：2021-11-17

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Parker Brown ,  Jose Juarez ,  Emily Hernandez ,  Joseph Pratt ,  Peter Stone ,  Vidya Viswanath ,  Will Findlay

IPC: H05K1/02 ,  H01B11/00

Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

公开(公告)号：US10153570B2

公开(公告)日：2018-12-11

申请号：US15952773

申请日：2018-04-13

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H01R12/69 ,  H01B7/08 ,  H01B7/04 ,  H01R43/20 ,  H01B7/00 ,  H05K1/02 ,  B60R16/02 ,  B60J5/04 ,  H01B7/42

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.