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公开(公告)号：US09993871B2
公开(公告)日：2018-06-12
申请号：US15500192
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
CPC classification number: B22F1/0062 , B22F1/0014 , B22F1/0074 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B22F2998/10 , C09C1/62 , C09C3/08 , C09C3/10 , C09D5/24 , C09D7/61 , H01B1/22
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D90−D10)/D50] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
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公开(公告)号：US20180158564A1
公开(公告)日：2018-06-07
申请号：US15859909
申请日：2018-01-02
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Hiroshi Kamiga
IPC: H01B1/22 , H01L31/0224 , C09D5/24 , C09D101/28 , B22F1/00 , C08K9/04
CPC classification number: H01B1/22 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2302/45 , B22F2998/10 , C08K9/04 , C08K2201/001 , C09D5/24 , C09D101/28 , H01L31/022425 , Y02E10/50 , B22F2001/0066
Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
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公开(公告)号：US20170232510A1
公开(公告)日：2017-08-17
申请号：US15501880
申请日：2015-08-21
Applicant: Dowa Electronics Materials Co., Ltd.
Inventor： Noriaki Nogami , Hiroshi Kamiga
IPC: B22F1/02 , C25D3/48 , C25D5/34 , C25D7/00 , H01L31/0224 , C23C18/16 , B05D3/02 , B05D1/26 , B05D7/00 , B22F1/00 , C23C18/44
CPC classification number: B22F1/025 , B05D1/26 , B05D3/0254 , B05D7/00 , B22F1/0014 , B22F1/0059 , B22F2301/10 , B22F2301/255 , B22F2302/45 , B22F2303/01 , B22F2304/10 , B22F2998/10 , B22F2999/00 , C09D11/037 , C09D11/52 , C22C1/0425 , C23C18/1635 , C23C18/1637 , C23C18/1653 , C23C18/44 , C23C18/54 , C25D3/48 , C25D5/34 , C25D7/00 , H01L31/022425 , H01L31/068 , H05K1/095 , H05K3/4007 , H05K2201/0218 , Y02E10/547 , B22F9/082 , C22C5/00 , B22F9/24
Abstract: There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.
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公开(公告)号：US20170206998A1
公开(公告)日：2017-07-20
申请号：US15326536
申请日：2015-07-24
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Hiroshi Kamiga
IPC: H01B1/22 , H01L31/0224 , C09D101/28 , B22F1/00 , C09D5/24
CPC classification number: H01B1/22 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2302/45 , B22F2998/10 , C08K9/04 , C08K2201/001 , C09D5/24 , C09D101/28 , H01L31/022425 , B22F2001/0066
Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
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公开(公告)号：US10580910B2
公开(公告)日：2020-03-03
申请号：US16071578
申请日：2017-01-26
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Hiroshi Kamiga , Noriaki Nogami , Aiko Hirata
Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a cyanide solution, such as a potassium silver cyanide solution, a potassium gold cyanide solution, a potassium cyanide solution or a sodium cyanide solution, to cause the copper powder coated with the silver containing layer to contain 3 to 3000 ppm of cyanogen.
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Patent Agency Ranking
公开(公告)号：US20190027620A1
公开(公告)日：2019-01-24
申请号：US16071578
申请日：2017-01-26
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Hiroshi Kamiga , Noriaki Nogami , Aiko Hirata
IPC: H01L31/0224 , B22F1/02 , H01B1/22
Abstract: There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a cyanide solution, such as a potassium silver cyanide solution, a potassium gold cyanide solution, a potassium cyanide solution or a sodium cyanide solution, to cause the copper powder coated with the silver containing layer to contain 3 to 3000 ppm of cyanogen.
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公开(公告)号：US20180272425A1
公开(公告)日：2018-09-27
申请号：US15542464
申请日：2016-01-06
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Noriaki Nogami , Hiroshi Kamiga
IPC: B22F1/02 , H01B1/02 , H01B1/22 , H01L31/0224
CPC classification number: B22F1/025 , B22F2301/255 , H01B1/02 , H01B1/22 , H01L31/0224 , H01L31/022425 , H05K1/092 , H05K2201/0218
Abstract: A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a silver supporting solution of a potassium silver cyanide solution (or a potassium silver cyanide solution containing at least one selected from the group consisting of potassium pyrophosphate, boric acid, tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid) to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of silver to be supported on the surface of the copper powder coated with the silver containing layer.
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公开(公告)号：US20180240566A1
公开(公告)日：2018-08-23
申请号：US15754467
申请日：2016-08-22
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Naoki Tahara , Hiroshi Kamiga
CPC classification number: H01B1/22 , B22F1/0062 , B22F1/02 , B22F9/24 , B22F2301/255
Abstract: To provide a silver powder including alkenylsuccinic anhydride and/or alkenylsuccinic acid on a surface of the silver powder.
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公开(公告)号：US09984788B2
公开(公告)日：2018-05-29
申请号：US15326536
申请日：2015-07-24
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiyuki Michiaki , Hiroshi Kamiga
IPC: H01B1/22 , H01L31/0224 , C09D101/28 , B22F1/00 , C09D5/24 , C08K9/04
CPC classification number: H01B1/22 , B22F1/0062 , B22F9/24 , B22F2301/255 , B22F2302/45 , B22F2998/10 , C08K9/04 , C08K2201/001 , C09D5/24 , C09D101/28 , H01L31/022425 , B22F2001/0066
Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
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公开(公告)号：US20170259334A1
公开(公告)日：2017-09-14
申请号：US15500192
申请日：2015-07-27
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Taro Nakanoya , Hiroshi Kamiga
CPC classification number: B22F1/0062 , B22F1/0014 , B22F1/0074 , B22F9/24 , B22F2009/245 , B22F2301/255 , B22F2302/45 , B22F2304/10 , B22F2998/10 , C09C1/62 , C09C3/08 , C09C3/10 , C09D5/24 , C09D7/61 , H01B1/22
Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 μm or more but 6.0 μm or less, and a ratio of [(D90−D10)/D5o] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
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