SEMICONDUCTOR DEVICE AND PACKAGE STRUCTURE
    11.
    发明申请

    公开(公告)号:US20200152836A1

    公开(公告)日:2020-05-14

    申请号:US16680214

    申请日:2019-11-11

    Abstract: A semiconductor device and a package structure are provided. The semiconductor device includes a substrate, a light-emitting structure, a first semiconductor layer, a second semiconductor layer and a first electrode. The light-emitting structure is on the substrate. The first semiconductor layer is on the light-emitting structure. The second semiconductor layer is between the first semiconductor layer and the light-emitting structure. The first electrode is on the second semiconductor layer. At least a portion of the first electrode is separated from the first semiconductor layer.

    SEMICONDUCTOR DEVICE
    12.
    发明申请

    公开(公告)号:US20200152831A1

    公开(公告)日:2020-05-14

    申请号:US16680207

    申请日:2019-11-11

    Abstract: A semiconductor device includes a conductive layer, a semiconductor stack, a first contact structure, an intermediate structure, a second contact structure, a first electrode and a second electrode. The semiconductor stack is disposed on the conductive layer. The first contact structure is disposed on the semiconductor stack. The intermediate structure encloses the first contact structure. The second contact structure is between the conductive layer and the semiconductor stack. The first electrode is on the conductive layer and separated from the semiconductor stack. The second electrode is on the intermediate structure.

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