公开(公告)号：US09184360B2

公开(公告)日：2015-11-10

申请号：US14715581

申请日：2015-05-18

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yi-Fan Li ,  Han-Min Wu ,  Kuan-Chieh Huang ,  Tung-Lin Chuang ,  Sheng-Yuan Sun

IPC: H01L33/00 ,  H01L33/64 ,  H01L33/60 ,  H01L33/50 ,  H01L33/48

CPC classification number: H01L33/642 ,  F21K9/64 ,  F21V29/74 ,  F21Y2115/10 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/641

Abstract: A light-emitting device of the invention includes a base, at least one light-emitting element, a wavelength transferring cover and a heat-conducting structure. The light-emitting element is disposed on the base and electrically connected to the base. The wavelength transferring cover is disposed on the base and covers the light-emitting element. The heat-conducting structure is disposed on the base and directly contacts the wavelength transferring cover.

公开(公告)号：US09165909B2

公开(公告)日：2015-10-20

申请号：US14248343

申请日：2014-04-09

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen ,  Yun-Li Li ,  Po-Jen Su

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L24/14 ,  H01L27/156 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

Abstract: A light source module including a substrate, a plurality of first light emitting diode (LED) chips, and at least one second LED chip is provided. The substrate has an upper surface. The plurality of first LED chips are disposed on the upper surface and electrically connected to the substrate. The second LED chip is disposed on the upper surface and electrically connected to the substrate. A first distance is between a top surface of each of the first LED chips away from the upper surface of the substrate and the upper surface, a second distance is between a top surface of the second LED chip away from the upper surface of the substrate and the upper surface, and the second distance is greater than each of the first distances.

Abstract translation: 提供了包括基板，多个第一发光二极管（LED）芯片和至少一个第二LED芯片的光源模块。 基板具有上表面。 多个第一LED芯片设置在上表面上并电连接到基板。 第二LED芯片设置在上表面上并电连接到基板。 第一距离在离开基板的上表面的每个第一LED芯片的顶表面和上表面之间，第二距离在距离基板的上表面的第二LED芯片的顶表面之间;第二距离在第二LED芯片的顶表面之间， 上表面和第二距离大于每个第一距离。

公开(公告)号：US20150292710A1

公开(公告)日：2015-10-15

申请号：US14684416

申请日：2015-04-12

Applicant: Genesis Photonics Inc.

Inventor： Cheng-Yen Chen

IPC: F21V7/00 ,  F21K99/00 ,  F21V17/10 ,  F21V3/04 ,  F21V29/70

CPC classification number: F21V7/0066 ,  F21K9/60 ,  F21V7/0025 ,  F21V7/22 ,  F21V29/70 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L21/02107

Abstract: A lamp structure is disclosed. The lamp structure includes: a lamp cover having a bottom side and light-emitting side opposing to the bottom side, a reflection layer being disposed on the bottom layer; a substrate disposed on the bottom side of the lamp cover; at least one light-emitting unit disposed on the substrate to emit a plurality of light beams; and a reflection member disposed above the light-emitting unit. The light beams are at least reflected by the reflection layer of the lamp cover, and are emitted from the light-emitting side of the lamp cover.

Abstract translation: 公开了一种灯结构。 灯结构包括：具有底侧和与底侧相对的发光侧的灯罩，反射层设置在底层上; 设置在灯罩底部的基板; 设置在所述基板上以发射多个光束的至少一个发光单元; 以及设置在发光单元上方的反射构件。 光束至少被灯罩的反射层反射，并从灯罩的发光侧发射。

公开(公告)号：US20140103367A1

公开(公告)日：2014-04-17

申请号：US13835367

申请日：2013-03-15

Applicant: GENESIS PHOTONICS INC.

Inventor： Cheng-Hung Lin ,  Yu-Yun Lo ,  Cheng-Yen Chen ,  Yu-Hung Lai

IPC: H01L33/36 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L33/36 ,  H01L27/15 ,  H01L33/005 ,  H01L33/0095 ,  H01L2933/0025

Abstract: A method of forming light emitting diode dies includes: forming an epitaxial layered structure that defines light emitting units on a front surface of a substrate wafer; forming a photoresist layer over a back surface of the substrate wafer; aligning the substrate wafer and patterning the photoresist layer so as to form openings in the photoresist layer, each of the openings having an area less than a projected area of the respective light emitting unit; forming a solder layer on the photoresist layer such that the solder layer fills the openings in the photoresist layer; removing the photoresist layer and a portion of the solder layer that covers the photoresist layer from the substrate wafer; and dicing the substrate wafer.

Abstract translation: 一种形成发光二极管管芯的方法包括：形成在衬底晶片的前表面上限定发光单元的外延层状结构; 在所述衬底晶片的背面上形成光致抗蚀剂层; 对准衬底晶片并图案化光致抗蚀剂层以在光致抗蚀剂层中形成开口，每个开口具有小于相应发光单元的投影面积的面积; 在光致抗蚀剂层上形成焊料层，使得焊料层填充光致抗蚀剂层中的开口; 从衬底晶片去除光致抗蚀剂层和覆盖光致抗蚀剂层的焊料层的一部分; 并切割衬底晶片。