公开(公告)号：US20230155453A1

公开(公告)日：2023-05-18

申请号：US17917509

申请日：2021-01-29

Applicant: Hitachi Astemo, Ltd.

Inventor： Masanori SAWAHATA ,  Masahiro HORI ,  Hideaki GOTO ,  Takeshi TOKUYAMA

IPC: H02K9/193 ,  H02K3/50 ,  H02K7/116 ,  H02K11/33

CPC classification number: H02K9/193 ,  H02K3/50 ,  H02K7/116 ,  H02K11/33 ,  H02K2203/09

Abstract: An object of the present invention is to improve cooling capability of a bus bar with a simple system.
An electric system includes a motor unit including a stator and a rotor, the motor unit being cooled by a refrigerant, an inverter unit that supplies electric power to a winding of the stator, a wiring portion that transmits electric power output from the inverter unit to the motor unit, and a pipe that supplies or discharges a refrigerant to or from the motor unit. The pipe is provided at a position at which the wiring portion can exchange heat with an oily medium cooled by the pipe.

公开(公告)号：US20230135773A1

公开(公告)日：2023-05-04

申请号：US17911914

申请日：2021-01-15

Applicant: Hitachi Astemo, Ltd.

Inventor： Takashi HIRAO ,  Takeshi TOKUYAMA ,  Noriyuki MAEKAWA

IPC: H02M7/00 ,  H02M1/14 ,  H02M1/08 ,  H02M1/32 ,  H05K7/20

Abstract: A power conversion device can be miniaturized.
A power conversion device includes a power module that performs switching operation, a smoothing capacitor that smooths a voltage ripple caused by the switching operation, a circuit board that controls driving of the power module, a housing that accommodates the power module and the smoothing capacitor, a first fixing member for fixing the power module to the housing, and a second fixing member for fixing the smoothing capacitor to the housing. The circuit board straddles between the power module and the smoothing capacitor, and is fixed by the first fixing member and the second fixing member.

公开(公告)号：US20220338370A1

公开(公告)日：2022-10-20

申请号：US17760729

申请日：2020-07-31

Applicant: HITACHI ASTEMO, LTD.

Inventor： Takashi HIRAO ,  Takeshi TOKUYAMA ,  Noriyuki MAEKAWA ,  Akira MATSUSHITA ,  Toshiya SATOH

IPC: H05K7/20 ,  H02M7/00 ,  H02K9/00

Abstract: No consideration is given to heat transferred from a semiconductor module to a capacitor via a bus bar module. The heat generated by a semiconductor module (1) is transferred to a bus bar module (3) via a DC terminal (1A) of the semiconductor module (1). As illustrated in FIG. 4(B), the heat transferred to the bus bar module 3 is then transferred to the pressing member 5 via the annular conductor 8 and the bolt 5A. Since the pressing member 5 is in close contact with the second cooler 2B, the heat transferred to the pressing member 5 is cooled by the second cooler 2B. On the other hand, the heat transferred to the convex portion 6A of the housing 6 is transferred to the first cooler 2A via the housing 6 and cooled. As a result, in the configuration in which a capacitor (4) is connected to the semiconductor module (1) via the bus bar module (3), the heat transferred from the semiconductor module (1) to the capacitor (4) can be suppressed.

公开(公告)号：US20250157937A1

公开(公告)日：2025-05-15

申请号：US18840588

申请日：2023-03-16

Applicant: HITACHI ASTEMO, LTD.

Inventor： Takahiro ARAKI ,  Takeshi TOKUYAMA ,  Shigehisa AOYAGI ,  Hideki MIYAZAKI

IPC: H01L23/538 ,  H01L23/373 ,  H01L25/18 ,  H10D1/68 ,  H10D80/30

Abstract: This power conversion device comprises a plurality of circuit bodies, a wiring board, and a smoothing capacitor, wherein: the wiring board has a plurality of stacked wiring parts to which the plurality of circuit bodies and the plurality of smoothing capacitors are respectively connected; and inter-phase wiring parts respectively formed between the plurality of stacked wiring parts; in the stacked wiring parts, positive electrode wires and negative electrode wires are stacked to overlap each other; in the inter-phase wiring parts, a plurality of the positive electrode wires and a plurality of the negative electrode wires are stacked to be separated from each other on a plane of the wiring board; and the inter-phase wiring parts have a via passing therethrough in the thickness direction of the wiring board.

公开(公告)号：US20240042867A1

公开(公告)日：2024-02-08

申请号：US18266307

申请日：2021-09-29

Applicant: HITACHI ASTEMO, LTD.

Inventor： Takafumi HARA ,  Toshiyuki AJIMA ,  Kyoshiro ITAKURA ,  Takeshi TOKUYAMA ,  Takahiro ARAKI ,  Shigehisa AOYAGI

IPC: B60L15/20 ,  B60L15/00 ,  H02P27/06

CPC classification number: B60L15/20 ,  B60L15/007 ,  H02P27/06 ,  B60L2210/40

Abstract: A motor control device connected to a power converter that performs power conversion from DC power to AC power and controls driving of an AC motor that is driven by using the AC power includes a voltage command generation unit that generates a three-phase voltage command; and a gate signal generation unit that performs pulse width modulation on the three-phase voltage command and generates a gate signal for controlling an operation of the power converter, in which the voltage command generation unit adjusts the three-phase voltage command by using a zero-phase voltage based on a power factor of the AC power in an overmodulation region in which a modulation factor according to a voltage amplitude ratio between the DC power and the AC power exceeds a predetermined threshold value, and the gate signal generation unit generates the gate signal by performing pulse width modulation on the adjusted three-phase voltage command.

公开(公告)号：US20240040702A1

公开(公告)日：2024-02-01

申请号：US18268364

申请日：2021-09-30

Applicant: HITACHI,ASTEMO, LTD.

Inventor： Takeshi TOKUYAMA ,  Takahiro ARAKI ,  Shigehise AOYAGI

IPC: H05K1/18 ,  H01L25/18 ,  H02M7/00 ,  H01L23/495 ,  H02M7/537 ,  H01L23/00

CPC classification number: H05K1/186 ,  H01L25/18 ,  H02M7/003 ,  H05K2201/10787 ,  H05K2201/10931 ,  H05K2201/09072 ,  H05K2201/10901 ,  H01L2224/40225 ,  H01L23/49524 ,  H05K2201/10946 ,  H05K2201/10174 ,  H02M7/537 ,  H01L24/40 ,  H05K2201/10166

Abstract: A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

公开(公告)号：US20230283131A1

公开(公告)日：2023-09-07

申请号：US18019058

申请日：2021-05-10

Applicant: Hitachi Astemo, Ltd.

Inventor： Masahiro HORI ,  Takeshi TOKUYAMA ,  Noriaki HINO ,  Masanori SAWAHATA

IPC: H02K1/28 ,  H02K1/276 ,  H02K15/03 ,  H02K15/12

CPC classification number: H02K1/28 ,  H02K1/276 ,  H02K15/03 ,  H02K15/12

Abstract: An object of the present invention is to provide a structure capable of stably holding a bonded magnet into a magnet insertion part of a rotor core. A rotor of a rotating electrical machine includes a bonded magnet 112, an elastic member 113 having a bent part 113a, and a rotor core provided with a magnet storage part storing the bonded magnet 112 and the elastic member 113. The elastic member 113 is embedded in the bonded magnet 112 in a state where at least a part of the bent part 113a is exposed from the bonded magnet 112, and an exposed part 113c of the bent part 113a from the bonded magnet 112 comes into contact with an inner wall of the magnet storage part 114 and elastically deforms.