公开(公告)号：US08850891B2

公开(公告)日：2014-10-07

申请号：US13288750

申请日：2011-11-03

Applicant: Jochen Reinmuth

Inventor： Jochen Reinmuth

IPC: G01P15/125 ,  B81B3/00 ,  G01P15/18 ,  G01P15/08

CPC classification number: G01P15/125 ,  B81B3/0078 ,  B81B2201/0235 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0831 ,  Y10T29/49826

Abstract: A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material.

Abstract translation: 一种具有固定点和抗震重量的微机械部件，其通过至少一个弹簧连接到所述固定点并且至少部分地由第一材料制成，所述第一材料是半导体材料，所述地震重量另外制成 并且所述第二材料具有比所述第一材料更高的密度。 此外，提供了一种用于微机械部件的制造方法，具有至少部分地由第一材料形成地震重量的步骤，第一材料是半导体材料，将地震重量连接到微机械部件的固定点 使用至少一个弹簧，并且从第一材料和至少一个具有比第一材料更高密度的第二材料形成地震重量。

公开(公告)号：US20140117472A1

公开(公告)日：2014-05-01

申请号：US14061887

申请日：2013-10-24

Applicant: Julian Gonska ,  Jochen Reinmuth ,  Kathrin Gutsche ,  Jens Frey ,  Heribert Weber

Inventor： Julian Gonska ,  Jochen Reinmuth ,  Kathrin Gutsche ,  Jens Frey ,  Heribert Weber

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81C1/00285 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/096 ,  B81C2203/0118 ,  B81C2203/035

Abstract: A micromechanical component includes a first space in which a first sensor is situated and a second space in which a second sensor is situated, different pressures prevailing in the first and second spaces, one of the two spaces extending via a third space to a first lattice structure which is situated in an edge region of the component and is essentially hermetically sealed.

Abstract translation: 微机械部件包括第一传感器所在的第一空间和第二传感器所在的第二空间，在第一和第二空间中存在不同的压力，两个空间中的一个通过第三空间延伸到第一格子 结构位于组件的边缘区域中，并且基本上被气密地密封。

公开(公告)号：US08587095B2

公开(公告)日：2013-11-19

申请号：US13004638

申请日：2011-01-11

Applicant: Jochen Reinmuth ,  Eckhard Graf

Inventor： Jochen Reinmuth ,  Eckhard Graf

IPC: H01L23/552 ,  H01L21/764

CPC classification number: B81C1/00071 ,  B81B2207/07 ,  B81B2207/096 ,  H01L21/764 ,  H01L21/7682 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/4855 ,  H01L23/552 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02321 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/024 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/48463 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for establishing and closing at least one trench of a semiconductor component, in particular a micromechanical or electrical semiconductor component, having the following steps: applying at least one metal layer over the trench to be formed; forming a lattice having lattice openings in the at least one metal layer over the trench to be formed; forming the trench below the metal lattice, and closing the lattice openings over the trench.

Abstract translation: 一种用于建立和闭合半导体部件，特别是微机电或电半导体部件的至少一个沟槽的方法，具有以下步骤：在要形成的沟槽上施加至少一个金属层; 在要形成的沟槽上的所述至少一个金属层中形成具有格子孔的格子; 在金属晶格下面形成沟槽，并且关闭沟槽上方的格子孔。

公开(公告)号：US20130042681A1

公开(公告)日：2013-02-21

申请号：US13586226

申请日：2012-08-15

Applicant: Johannes Classen ,  Jochen Reinmuth ,  Sebastian Guenther ,  Pia Bustian-Todorov

Inventor： Johannes Classen ,  Jochen Reinmuth ,  Sebastian Guenther ,  Pia Bustian-Todorov

IPC: H05K13/00 ,  G01P3/44

CPC classification number: G01C19/5783 ,  B81B2201/025 ,  B81C1/00182 ,  G01P15/0802 ,  G01P2015/0882

Abstract: A method for manufacturing a micromechanical structure, and a micromechanical structure. The micromechanical structure encompasses a first micromechanical functional layer, made of a first material, that comprises a buried conduit having a first end and a second end; a micromechanical sensor structure having a cap in a second micromechanical functional layer that is disposed above the first micromechanical functional layer; an edge region in the second micromechanical functional layer, such that the edge region surrounds the sensor structure and defines an inner side containing the sensor structure and an outer side facing away from the sensor structure; such that the first end is located on the outer side and the second end on the inner side.

Abstract translation: 微机械结构的制造方法和微机械结构。 微机械结构包括由第一材料制成的第一微机械功能层，其包括具有第一端和第二端的埋管; 微机械传感器结构，其具有位于第一微机械功能层上方的第二微机械功能层中的盖; 所述第二微机械功能层中的边缘区域使得所述边缘区域围绕所述传感器结构并限定包含所述传感器结构的内侧和远离所述传感器结构的外侧; 使得第一端位于内侧的外侧和第二端。

公开(公告)号：US08347721B2

公开(公告)日：2013-01-08

申请号：US12783307

申请日：2010-05-19

Applicant: Jochen Reinmuth

Inventor： Jochen Reinmuth

IPC: G01P15/125 ,  G01P15/00

CPC classification number: G01P15/125 ,  G01P2015/0831

Abstract: A micromechanical acceleration sensor includes a substrate with a substrate surface arranged in one plane, a first counter-electrode arranged on the substrate surface, a second counter-electrode arranged on the substrate surface, and a rocking mass arranged above the first counter-electrode and the second counter-electrode. The rocking mass is in this case connected to the substrate via a torsion spring which permits tilting of the rocking mass about an axis of rotation. Further provided are a first compensation counter-electrode arranged on the substrate surface and a second compensation counter-electrode arranged on the substrate surface. In addition, a first compensation electrode is arranged above the first compensation counter-electrode and a second compensation electrode is arranged above the second compensation counter-electrode.

Abstract translation: 微机械加速度传感器包括：基板表面布置在一个平面中的基板，布置在基板表面上的第一对置电极，布置在基板表面上的第二对置电极和布置在第一对置电极上方的摆动块; 第二个对电极。 在这种情况下，摇摆质量块通过扭转弹簧连接到基板，该扭簧允许摇摆块围绕旋转轴线倾斜。 还提供了布置在基板表面上的第一补偿对置电极和布置在基板表面上的第二补偿对置电极。 另外，第一补偿电极配置在第一补偿对置电极的上方，第二补偿电极配置在第二补偿对置电极的上方。

公开(公告)号：US08334534B2

公开(公告)日：2012-12-18

申请号：US12590585

申请日：2009-11-10

Applicant: Jochen Reinmuth ,  Neil Davies ,  Simon Armbruster ,  Ando Feyh

Inventor： Jochen Reinmuth ,  Neil Davies ,  Simon Armbruster ,  Ando Feyh

IPC: H01L31/101

CPC classification number: G01J5/20 ,  G01J5/08 ,  G01J5/0853 ,  H01L27/14649

Abstract: A sensor includes at least one micro-patterned diode pixel that has a diode implemented in, on, or under a diaphragm, and the diaphragm in turn being implemented above a cavity. The diode is contacted via supply leads that are implemented at least in part in, on, or under the diaphragm, and the diode is implemented in a polycrystalline semiconductor layer. The diode is implemented by way of two low-doped diode regions or at least one low-doped diode region. At least parts of the supply leads are implemented by way of highly doped supply lead regions of the shared polycrystalline semiconductor layer.

Abstract translation: 传感器包括至少一个微图案化的二极管像素，其具有在隔膜内，上或下面实现的二极管，并且隔膜依次在空腔上方实现。 二极管通过至少部分地在隔膜中，上或下面实现的电源引线接触，并且二极管实现在多晶半导体层中。 二极管通过两个低掺杂二极管区域或至少一个低掺杂二极管区域实现。 供电线的至少一部分通过共享多晶半导体层的高掺杂电源引线区实现。

公开(公告)号：US20120167681A1

公开(公告)日：2012-07-05

申请号：US13288750

申请日：2011-11-03

Applicant: Jochen Reinmuth

Inventor： Jochen Reinmuth

IPC: G01C19/56 ,  B23P11/00

CPC classification number: G01P15/125 ,  B81B3/0078 ,  B81B2201/0235 ,  G01P15/0802 ,  G01P15/18 ,  G01P2015/0831 ,  Y10T29/49826

Abstract: A micromechanical component having a fixing point and a seismic weight, which is connected to the fixing point by at least one spring and is made at least partially out of a first material, the first material being a semiconductor material, the seismic weight being additionally made out of at least one second material, and the second material having a higher density than the first material. In addition, a manufacturing method for a micromechanical component is provided, having the steps of forming a seismic weight at least partially out of a first material, the first material being a semiconductor material, connecting the seismic weight to a fixing point of the micromechanical component, using at least one spring, and forming the seismic weight from the first material and at least one second material, which has a higher density than the first material.

Abstract translation: 一种具有固定点和抗震重量的微机械部件，其通过至少一个弹簧连接到所述固定点并且至少部分地由第一材料制成，所述第一材料是半导体材料，所述地震重量另外制成 并且所述第二材料具有比所述第一材料更高的密度。 此外，提供了一种用于微机械部件的制造方法，其具有至少部分地由第一材料形成地震重量的步骤，第一材料是半导体材料，将地震重量连接到微机械部件的固定点 使用至少一个弹簧，并且从第一材料和至少一个具有比第一材料更高密度的第二材料形成地震重量。

公开(公告)号：US08196474B2

公开(公告)日：2012-06-12

申请号：US12846423

申请日：2010-07-29

Applicant: Jochen Reinmuth ,  Peter Schmollngruber ,  Hans Artmann

Inventor： Jochen Reinmuth ,  Peter Schmollngruber ,  Hans Artmann

IPC: G01L7/00

CPC classification number: G01L19/148 ,  G01L19/0061 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A simple to implement contacting variant makes it possible to create a reliable electrical connection between the sensor element and the evaluation electronics of a pressure sensor, including at least one media-resistant sensor element, evaluation electronics in the form of at least one additional component connected electrically to the sensor element, and a multipart housing, the sensor element being situated in a first housing area having at least one pressure connection, and the evaluation electronics being situated in a second sealed housing area which is separated from the first housing area by a separating wall. The electrical connection between the sensor element and the evaluation electronics is implemented in the form of media-resistant bonding wires which are guided from the first into the second housing area through the bonded joint area between the separating wall and an additional housing part.

Abstract translation: 简单实现接触变体使得可以在传感器元件和压力传感器的评估电子器件之间创建可靠的电连接，包括至少一个耐介质传感器元件，至少一个附加部件连接形式的评估电子器件 电传送到传感器元件和多部分壳体，传感器元件位于具有至少一个压力连接的第一壳体区域中，并且评估电子设备位于第二密封壳体区域中，该第二密封壳体区域与第一壳体区域分离 分隔墙。 传感器元件和评估电子元件之间的电连接以不受介质影响的接合线的形式实现，该接合线通过隔离壁和附加壳体部分之间的接合接合区域从第一壳体引导到第二壳体区域。

公开(公告)号：US20120068356A1

公开(公告)日：2012-03-22

申请号：US13199748

申请日：2011-09-07

Applicant: Marcus Ahles ,  Jochen Reinmuth ,  Hubert Benzel ,  Simon Armbruster

Inventor： Marcus Ahles ,  Jochen Reinmuth ,  Hubert Benzel ,  Simon Armbruster

IPC: H01L23/48 ,  H01L21/768

CPC classification number: H01L21/76898 ,  B81B2201/0264 ,  B81C1/00095 ,  H01L21/764 ,  H01L21/7682 ,  H01L23/481 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/131 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A component having a via includes: (i) a first layer having a first via portion, a first trench structure, and a first surrounding layer portion, the first via portion being separated by the first trench structure from the first surrounding layer portion; (ii) a second layer having a second via portion, a second trench structure, and a second surrounding layer portion, the second via portion being separated by the second trench structure from the second surrounding layer portion; (iii) an insulation layer disposed between the first and the second layer, the insulation layer having an opening so that the first and the second via portions of the first and the second layers are directly connected to one another in the region of the opening. The first via portion and the second surrounding layer portion at least partially overlap.

Abstract translation: 具有通孔的部件包括：（i）具有第一通孔部分，第一沟槽结构和第一环绕层部分的第一层，所述第一通孔部分由所述第一沟槽结构与所述第一环绕层部分分离; （ii）具有第二通孔部分，第二沟槽结构和第二包围层部分的第二层，所述第二通孔部分由所述第二沟槽结构与所述第二环绕层部分分离; （iii）设置在第一和第二层之间的绝缘层，绝缘层具有开口，使得第一和第二层的第一和第二通孔部分在开口区域中彼此直接连接。 第一通孔部分和第二周围层部分至少部分重叠。

公开(公告)号：US20110009904A1

公开(公告)日：2011-01-13

申请号：US12886245

申请日：2010-09-20

Applicant: Markus Froehlich ,  Jochen Reinmuth

Inventor： Markus Froehlich ,  Jochen Reinmuth

IPC: A61B17/70 ,  A61B17/88

CPC classification number: A61B17/7065

Abstract: A spacer for maintaining separation between adjacent spinous processes having a first and second end support, a connecting member, and a central member positioned between the first and second end supports. The spacer is adjustable between a collapsed configuration and an expanded configuration such that when the connection member is pulled to bring the first and second end supports closer together, the central member expands into the expanded configuration to contact and support adjacent spinous processes.

Abstract translation: 用于保持具有第一和第二端部支撑件的相邻棘突之间的间隔件，连接构件和位于第一和第二端部支撑件之间的中心构件。 间隔件在折叠构型和扩张构型之间是可调节的，使得当连接构件被拉动以使第一和第二端部支撑件更靠近在一起时，中心构件膨胀成扩展构型以接触和支撑相邻棘突。