公开(公告)号：US11744010B2

公开(公告)日：2023-08-29

申请号：US17573588

申请日：2022-01-11

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Ya-Han Chang

IPC: H05K1/02 ,  G02B7/02 ,  G02B7/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0274 ,  G02B7/006 ,  G02B7/02 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the surface of the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, a light-permeable sheet, and a top shielding layer. The circuit board has no slot recessed in the surface thereof. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip. The top shielding layer is formed on an outer surface of the light-permeable sheet and has an opening that is located above a sensing region of the sensor chip.

公开(公告)号：US11735562B2

公开(公告)日：2023-08-22

申请号：US17205463

申请日：2021-03-18

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Chen-Pin Peng

IPC: H02H1/00 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L24/48 ,  H01L2224/48227

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of electrical connection members electrically connecting the sensor chip to the substrate, a supporting adhesive layer formed on the sensor chip, and a light-permeable sheet disposed on the supporting adhesive layer. Each of the electrical connection members includes a head solder disposed on a connecting pad of the sensor chip, a wire having a first end and a second end, and a tail solder. The first end of the wire extends from the head solder so as to connect the second end onto a soldering pad of the substrate, and the wire has a first bending portion arranged adjacent to the head solder. The head solder and the first bending portion of each of the electrical connection members are embedded in the supporting adhesive layer.

公开(公告)号：US10916511B1

公开(公告)日：2021-02-09

申请号：US16784299

申请日：2020-02-07

Applicant: KINGPAK Technology Inc.

Inventor： Fu-Chou Liu ,  Chien-Chen Lee ,  Ya-Han Chang

IPC: H01L23/00

Abstract: A method for reducing warpage occurred to a substrate strip after a molding process is provided. First, several dies are mounted on a top surface of a substrate strip. Then, a base having a top surface with a surface curvature is provided, and the top surface of the base is contacted against a bottom surface of the substrate strip to bend the substrate strip. Next, under the status that the top surface of the base is contacted against the bottom surface of the substrate strip, a molding compound is wrapped around each die. Finally, the molding compound is cooled to a room temperature. Accordingly, the molding process is performed on the substrate strip reversely bent in a direction opposite to a warpage direction. Therefore, the warpage originally caused by the molding process is offset by the reverse bending.

公开(公告)号：US10700111B2

公开(公告)日：2020-06-30

申请号：US16294436

申请日：2019-03-06

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Li-Chun Hung ,  Chien-Chen Lee ,  Hsiu-Wen Tu

IPC: H01L27/146 ,  H01L23/31 ,  H01L23/528 ,  H01L23/498 ,  H01L23/00

Abstract: Disclosed is an optical sensor including a substrate, a redistribution chip structure disposed on the substrate, a sensor chip disposed on the redistribution chip structure, a light-permeable sheet arranged above the sensor chip, metal wires electrically connecting the substrate and the sensor chip, and a package body disposed on the substrate. The redistribution chip structure includes an insulating body, a first electronic chip embedded in the insulating body, and a redistribution layer (RDL) connected to bottoms of the insulating body and the first electronic chip. The RDL is fixed onto the substrate in a flip-chip manner. A projected region defined by orthogonally projecting a sensing area of the sensor chip onto the redistribution chip structure is located inside outer edges of the redistribution chip structure. The redistribution chip structure, the sensor chip, a part of the light-permeable sheet, and the metal wires are embedded in the package body.

公开(公告)号：US12174446B2

公开(公告)日：2024-12-24

申请号：US17688976

申请日：2022-03-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Li-Chun Hung ,  Chien-Yuan Wang

IPC: G02B7/02 ,  H04N23/54 ,  H04N23/55 ,  H05K1/18

Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed on the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupled to the sensor chip and the circuit board, and a cover that overcovers the sensor chip and the wires. The cover includes a light-permeable sheet and an opaque frame. The light-permeable sheet has a ring-shaped notch recessed in an edge of an inner surface thereof. The opaque frame is formed on the ring-shaped notch and is disposed on the circuit board, the light-permeable sheet and the sensor chip are spaced apart from each other, and the sensor chip and the wires are arranged in a space that is defined by the light-permeable sheet and the opaque frame.

公开(公告)号：US11792497B2

公开(公告)日：2023-10-17

申请号：US17667625

申请日：2022-02-09

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Jui-Hung Hsu

IPC: H04N5/335 ,  H04N23/54 ,  H04N23/51 ,  H04N23/55

CPC classification number: H04N23/54 ,  H04N23/51 ,  H04N23/55

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof. The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 μm. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

公开(公告)号：US11723147B2

公开(公告)日：2023-08-08

申请号：US17667486

申请日：2022-02-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Jui-Hung Hsu

IPC: G02B7/00 ,  H05K1/11 ,  G02B7/02 ,  H05K1/02

CPC classification number: H05K1/111 ,  G02B7/006 ,  G02B7/02 ,  H05K1/0274 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an electronic chip assembled to the circuit board, a sensor chip, a die attach film (DAF) pre-bonded onto the sensor chip, a plurality of wires electrically coupling the electronic chip and the sensor chip to the circuit board, a supporting adhesive layer, a light-permeable sheet, and an optical module that is fixed to the circuit board for surrounding the above components. The sensor chip is adhered to the electronic chip through the DAF such that a sensing region of the sensor chip is perpendicular to a central axis of the optical module. The supporting adhesive layer is in a ringed shape and is disposed on a top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

公开(公告)号：US11552120B2

公开(公告)日：2023-01-10

申请号：US16928193

申请日：2020-07-14

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Fu-Chou Liu ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H01L27/146 ,  H01L21/22 ,  H01L31/02 ,  H01L31/0203

Abstract: A chip-scale sensor package structure includes a sensor chip, a first package body surrounding and connected to an outer lateral side of the sensor chip, a ring-shaped support disposed on a top side of the first package body, a light permeable member disposed on the ring-shaped support, and a redistribution layer (RDL) disposed on a bottom surface of the sensor chip and a bottom side of the first package body. The sensor chip includes a sensing region arranged on the top surface thereof, a plurality of internal contacts, and a plurality of conductive paths respectively connected to the internal contacts and electrically coupled to the sensing region. The sensing region is spaced apart from the ring-shaped support by a distance less than 300 μm. A bottom surface of the RDL has a plurality of external contacts electrically coupled to the internal contacts.

公开(公告)号：US11257964B2

公开(公告)日：2022-02-22

申请号：US16910399

申请日：2020-06-24

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Fu-Chou Liu ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H01L27/146 ,  H01L31/0224 ,  H01L23/538 ,  H01L31/02 ,  H01L25/04

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an opaque support (e.g., a ring-shaped solder mask) disposed on the sensor chip, and a light permeable layer disposed on the opaque support. The sensor chip includes a sensing region. The opaque support surrounds the sensing region, and inner lateral sides of the opaque support form a light-scattering loop wall. The light permeable layer, the light-scattering loop wall of the opaque support, and the sensor chip jointly define an enclosed space therein. When light passes through the light permeable layer and impinges onto the light-scattering loop wall at an incident angle, the light-scattering loop wall scatters the light into multiple rays at angles different from the incident angle.

公开(公告)号：US11133348B2

公开(公告)日：2021-09-28

申请号：US16744845

申请日：2020-01-16

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Li-Chun Hung ,  Chien-Chen Lee ,  Jian-Ru Chen ,  Chen-Pin Peng

IPC: H01L27/146 ,  H01L23/00

Abstract: A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ⅓ of the first distance.