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    ELECTRONIC COMPONENT
    11.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20140016242A1

    公开(公告)日：2014-01-16

    申请号：US14027685

    申请日：2013-09-16

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H01G4/01

    CPC classification number: H01G4/12 ,  H01G2/06 ,  H01G4/01 ,  H01G4/224 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

    Abstract translation: 多层陶瓷电容器包括层叠的扁平状内部电极。 插入器包括比多层陶瓷电容器的轮廓大的绝缘基板。 安装多层陶瓷电容器的第一安装电极位于绝缘基板的第一主表面上，以及用于连接到位于第二主表面上的外部电路板的第一外部连接电极。 多层陶瓷电容器以这样的方式安装到内插器上，使得内部电极的主表面平行或基本上平行于中介层的主表面，即绝缘基板的第一和第二主表面。

    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR
    13.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR 审中-公开

    公开(公告)号：US20190228914A1

    公开(公告)日：2019-07-25

    申请号：US16372469

    申请日：2019-04-02

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

    IPC: H01G4/40 ,  H01C1/14 ,  H01C1/012

    Abstract: A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.

    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR DEVICE
    15.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND RESISTOR DEVICE 审中-公开

    公开(公告)号：US20180075974A1

    公开(公告)日：2018-03-15

    申请号：US15697503

    申请日：2017-09-07

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO ,  Shinichiro KUROIWA

    IPC: H01G4/40 ,  H01G4/38

    CPC classification number: H01G4/40 ,  H01G4/385 ,  H01L21/84

    Abstract: A composite electronic component includes a capacitor device and a resistor device stacked together in a height direction. The capacitor device includes a capacitor body and first and second external electrodes. The resistor device includes a base, a resistive element, first and second upper surface conductors, first and second lower surface conductors, a first connection conductor, and a second connection conductor. The upper surface of the base of the resistor device faces the lower surface of the capacitor body of the capacitor device, the first upper surface conductor is electrically connected to the first external electrode, and the second upper surface conductor is electrically connected to the second external electrode.

    CAPACITOR COMPONENT
    17.
    发明申请
    CAPACITOR COMPONENT 有权
    电容元件

    公开(公告)号：US20160027584A1

    公开(公告)日：2016-01-28

    申请号：US14797298

    申请日：2015-07-13

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/224 ,  H01G4/01

    CPC classification number: H01G4/30 ,  H01G4/12 ,  H01G4/224 ,  H01G4/232

    Abstract: A capacitor component includes an element assembly, a first external electrode, and a second external electrode. The element assembly includes first and second internal electrode layers, a first connecting conductive layer extending along a fifth outer surface of the element assembly and connected to each of the first internal electrode layers, a first covering insulating layer covering the first connecting conductive layer, a second connecting conductive layer extending along a sixth outer surface of the element assembly and connected to each of the second internal electrode layers, and a second covering insulating layer covering the second connecting conductive layer. Only a portion of the first internal electrode layers are extended to the third outer surface and connected to the first external electrode, and only a portion of the internal electrode layers are extended to the fourth outer surface and connected to the second external electrode.

    Abstract translation: 电容器部件包括元件组件，第一外部电极和第二外部电极。 元件组件包括第一和第二内部电极层，沿着元件组件的第五外表面延伸并连接到每个第一内部电极层的第一连接导电层，覆盖第一连接导电层的第一覆盖绝缘层， 第二连接导电层，沿着元件组件的第六外表面延伸并连接到每个第二内部电极层;以及第二覆盖绝缘层，覆盖第二连接导电层。 仅第一内部电极层的一部分延伸到第三外部表面并且连接到第一外部电极，并且仅一部分内部电极层延伸到第四外部表面并且连接到第二外部电极。

    ELECTRONIC COMPONENT
    18.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20150270066A1

    公开(公告)日：2015-09-24

    申请号：US14731521

    申请日：2015-06-05

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H01G4/12 ,  H01G4/30 ,  H01G4/224

    CPC classification number: H01G4/12 ,  H01G2/06 ,  H01G4/01 ,  H01G4/224 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: A multilayer ceramic capacitor includes flat-shaped inner electrodes that are laminated. An interposer includes an insulating substrate that is larger than contours of the multilayer ceramic capacitor. A first mounting electrode that mounts the multilayer ceramic capacitor is located on a first principal surface of the insulating substrate, and a first external connection electrode for connection to an external circuit board located on a second principal surface. The multilayer ceramic capacitor is mounted onto the interposer in such a way that the principal surfaces of the inner electrodes are parallel or substantially parallel to the principal surface of the interposer, that is, the first and second principal surfaces of the insulating substrate.

    Abstract translation: 多层陶瓷电容器包括层叠的扁平状内部电极。 插入器包括比多层陶瓷电容器的轮廓大的绝缘基板。 安装多层陶瓷电容器的第一安装电极位于绝缘基板的第一主表面上，以及用于连接到位于第二主表面上的外部电路板的第一外部连接电极。 多层陶瓷电容器以这样的方式安装到内插器上，使得内部电极的主表面平行或基本上平行于中介层的主表面，即绝缘基板的第一和第二主表面。

    ELECTRONIC COMPONENT
    19.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号：US20140116768A1

    公开(公告)日：2014-05-01

    申请号：US14147795

    申请日：2014-01-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/228 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An electronic component includes an interposer, and a multilayer ceramic capacitor. The interposer includes a substrate including front and back surfaces that are parallel or substantially parallel to each other. Two first mounting electrodes and two second mounting electrodes are located on the front surface of the substrate, on opposite end portions in the longitudinal direction. Recesses are located in the longitudinal side surface of the insulating substrate. Connecting conductors are each provided in the side wall surface of each of the recesses. The connecting conductors connect a first external connection electrode and a second external connection electrode that are located on the back surface of the substrate, and first mounting electrodes and second mounting electrodes.

    Abstract translation: 电子部件包括插入件和多层陶瓷电容器。 插入器包括包括彼此平行或基本平行的前表面和后表面的基板。 两个第一安装电极和两个第二安装电极位于基板的前表面上，在纵向上的相对端部上。 凹部位于绝缘基板的纵向侧面。 连接导体各自设置在每个凹部的侧壁表面中。 连接导体连接位于基板的背面的第一外部连接电极和第二外部连接电极以及第一安装电极和第二安装电极。

    MOUNTING LAND STRUCTURE AND MOUNTING STRUCTURE FOR LAMINATED CAPACITOR
    20.
    发明申请
    MOUNTING LAND STRUCTURE AND MOUNTING STRUCTURE FOR LAMINATED CAPACITOR 有权
    用于层压电容器的安装土地结构和安装结构

    公开(公告)号：US20140041914A1

    公开(公告)日：2014-02-13

    申请号：US13959949

    申请日：2013-08-06

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kazuo HATTORI ,  Isamu FUJIMOTO

    IPC: H05K1/18

    CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

    Abstract: A mounting land structure and a mounting structure include land patterns to be bonded to outer electrodes of a laminated ceramic capacitor. Each of the land patterns includes a first conductor pattern and a second conductor pattern separated from each other in a width direction and a third conductor pattern connecting the first conductor pattern and the second conductor pattern. The first conductor pattern and the second conductor pattern include respective portions to be bonded to first ridgeline portions of the laminated ceramic capacitor provided with the outer electrodes. The third conductor pattern is arranged at a position overlapping the corresponding outer electrode as viewed in a height direction, when the laminated ceramic capacitor is mounted.

    Abstract translation: 安装平台结构和安装结构包括与层压陶瓷电容器的外部电极接合的焊盘图案。 每个焊盘图案包括在宽度方向上彼此分离的第一导体图案和第二导体图案，以及连接第一导体图案和第二导体图案的第三导体图案。 第一导体图案和第二导体图案包括要被接合到设置有外部电极的层叠陶瓷电容器的第一脊线部分的各个部分。 当安装层叠陶瓷电容器时，第三导体图案被布置在与高度方向相对的相应的外部电极重叠的位置。

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