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公开(公告)号：US10983558B2
公开(公告)日：2021-04-20
申请号：US16945971
申请日：2020-08-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyun Woo Kim , Ji Hoon Park , Ji Hun Heo , Joo Han Kim , Jin Man Kim , Bong Jae Rhee , Se Young Jang
IPC: G06K9/00 , G06F3/042 , G06F1/16 , H05K1/18 , H05K5/00 , G06F3/041 , H04M1/02 , H05K1/02 , H05K5/03 , H05K1/14 , H01L27/146 , H01L23/00 , H01L27/32
Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.
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公开(公告)号：US10957620B2
公开(公告)日：2021-03-23
申请号：US16811944
申请日：2020-03-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Ho Chung , Soo Ho Noh , Jin Seok Yoon Park , Se Young Jang
IPC: H01L23/427 , H01L23/367 , C09K5/14 , G06F1/20 , H05K9/00 , H05K7/20 , H05K1/02 , H01L23/373
Abstract: An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
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公开(公告)号：US10579847B2
公开(公告)日：2020-03-03
申请号：US15631472
申请日：2017-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyu Sang Cho , Hee Cheul Moon , Hyung Dal Kim , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Myung Su Kang , Heung Sik Shin
Abstract: An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
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公开(公告)号：US20170372114A1
公开(公告)日：2017-12-28
申请号：US15631472
申请日：2017-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyu Sang Cho , Hee Cheul Moon , Hyung Dal Kim , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Myung Su Kang , Heung Sik Shin
CPC classification number: G06K9/00006 , G01J1/0219 , G01J1/0233 , G01J1/0266 , G01J1/08 , G01J1/58 , G01J5/10 , G01J2001/0257 , G01N2201/061 , G01N2201/0638 , G06F3/0412 , G06F3/0421 , G06F2203/04109 , G06K9/00033 , G06K9/00114 , G06K9/00161 , G06T11/003 , G06T2207/10 , G06T2207/10008 , G06T2207/10048
Abstract: An electronic device is provided which includes a light emitting module that radiates infrared light, a window disposed on the light emitting module and having a specific refractive index with respect to the infrared light, wherein the window includes a refraction part that totally reflects the infrared light inside the window in correspondence with the specific refractive index, and a fingerprint sensor disposed under the window and obtaining a fingerprint of a user based on a user input on the window by using scattered light of the infrared light.
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15.发明申请公开(公告)号：US20170358544A1
公开(公告)日：2017-12-14
申请号：US15617973
申请日：2017-06-08
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki Cheol BAE , Chul Woo Park , Kwang Sub Lee , Sang Gyun Lee , Se Young Jang , Chi Hyun Cho
CPC classification number: H01L23/645 , H01L23/3128 , H01L23/642 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/16 , H01L25/18 , H01L28/40 , H01L2224/0401 , H01L2224/04042 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/48091 , H01L2224/48195 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2224/83851 , H01L2224/92247 , H01L2225/1023 , H01L2225/1041 , H01L2225/1058 , H01L2225/1076 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1438 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/19041 , H01L2924/19105 , H01L2924/30101 , H01L2924/30107 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.
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Patent Agency Ranking
公开(公告)号：US11650624B2
公开(公告)日：2023-05-16
申请号：US17729104
申请日：2022-04-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyun Woo Kim , Ji Hoon Park , Ji Hun Heo , Joo Han Kim , Jin Man Kim , Bong Jae Rhee , Se Young Jang
IPC: G06F3/042 , G06K9/00 , H04M1/02 , G06F1/16 , H05K1/18 , H05K5/00 , G06F3/041 , G06V40/13 , H05K1/02 , H05K5/03 , H05K1/14 , H01L27/146 , H01L23/00 , H01L27/32
CPC classification number: G06F1/1626 , G06F1/1643 , G06F1/1684 , G06F3/042 , G06F3/0412 , G06F3/0414 , G06F3/0421 , G06V40/1306 , G06V40/1318 , G06V40/1329 , H04M1/026 , H04M1/0266 , H04M1/0277 , H05K1/181 , H05K1/189 , H05K5/0017 , H05K5/0086 , G06F2203/04109 , H01L24/32 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/14625 , H01L27/14636 , H01L27/323 , H01L27/3234 , H01L27/3276 , H01L2224/32225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/73265 , H05K1/0203 , H05K1/147 , H05K5/03 , H05K2201/066 , H05K2201/10128 , H05K2201/10151 , H01L2224/73265 , H01L2224/32225 , H01L2224/48227 , H01L2924/00
Abstract: A display device includes a display panel, a cover glass disposed on the display panel, and a biometric sensor device disposed below the display panel. The biometric sensor device includes a printed circuit board, a biometric sensor disposed on the printed circuit board, and a housing disposed on the printed circuit board and in which an opening is formed. The biometric sensor is disposed in the opening of the housing and is attached to a surface of the display panel through the housing.
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公开(公告)号：US11113504B2
公开(公告)日：2021-09-07
申请号：US16202247
申请日：2018-11-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yun Jang Jin , Jeong Hoo Kim , Kyung Hoon Song , Bong Jae Rhee , Se Young Jang , Chi Hyun Cho
Abstract: Disclosed is an electronic device including a transparent member, a display, wherein at least part of the display is disposed under the transparent member, wherein the display includes an active area, in which a plurality of pixels capable of outputting light to display contents, a biometric sensor, wherein at least part of the biometric sensor is disposed in a first area outside the active area, and a reflector positioned to direct light reflected by an external object in contact with at least a partial area of the transparent member to the biometric sensor through at least a portion of the transparent member, wherein at least some of the plurality of pixels are positioned to irradiate the external object, thereby resulting in the light reflected by the external object.
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18.发明授权公开(公告)号：US11037890B2
公开(公告)日：2021-06-15
申请号：US16696917
申请日：2019-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ki Cheol Bae , Chui Woo Park , Kwang Sub Lee , Sang Gyun Lee , Se Young Jang , Chi Hyun Cho
Abstract: A semiconductor assembly with a package on package (POP) structure includes a first semiconductor package having a first lower substrate, a first upper substrate facing the first lower substrate, and a first semiconductor chip mounted on an area of the first lower substrate. The POP structure further includes a second semiconductor package having a second lower substrate stacked on the first semiconductor package and spaced apart from the first semiconductor package, and a second semiconductor chip mounted in an area of the second lower substrate. At least one passive element is disposed in one of the first upper substrate and the second lower substrate and electrically connected to the second semiconductor chip.
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19.发明授权公开(公告)号：US11031788B2
公开(公告)日：2021-06-08
申请号：US15849031
申请日：2017-12-20
Applicant: Samsung Electronics Co., Ltd.
Inventor： Chul Woo Park , Sang Hyun Ryu , Ku Chul Jung , Se Young Jang , Chi Hyun Cho
Abstract: An electronic device is disclosed, and includes a battery supplying power to the electronic device, a charging circuit charging the battery, and a processor. The processor is configured to obtain context information associated with charging of the battery, if the context information satisfies a first specified condition, to set a timer associated with a charging time of the charging circuit to a first time, if the context information satisfies a second specified condition, to set the timer to a second time different from the first time, and to charge the battery by using the charging circuit during the first time corresponding to the first specified condition or the second time corresponding to the second specified condition.
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公开(公告)号：US10754938B2
公开(公告)日：2020-08-25
申请号：US15609383
申请日：2017-05-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yun Jang Jin , Kyung Hoon Song , Kwang Sub Lee , Se Young Jang , Chi Hyun Cho
IPC: G06K9/00 , G06F21/32 , H04L29/06 , H04L9/32 , H04W12/06 , G06F21/81 , G06F3/041 , G06F3/0481 , G06F3/0488 , H04W12/00
Abstract: An electronic device is provided. The electronic device includes a housing, a touch display, a pressure sensing circuit, a fingerprint sensor, a processor, and a memory. The memory is configured to store fingerprint data associated with a plurality of reference fingerprints. The processor is configured to, when pressure is applied by the finger in the fingerprint sensing area, receive first data associated with the pressure from the pressure sensing circuit and receive second data associated with the fingerprint of the finger from the fingerprint sensor, identify a selected function corresponding to the second data based on comparing result of the second data and the reference fingerprint data, and execute the selected function.
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