公开(公告)号：US20180294100A1

公开(公告)日：2018-10-11

申请号：US15938561

申请日：2018-03-28

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

Abstract: An electronic device includes a chip component and an external terminal. The chip component includes a terminal electrode formed on an end surface of a ceramic element body containing an internal electrode. The external terminal includes a first end electrically connected with the terminal electrode and a second end disposed opposite to the first end and connected with a mounting surface. The external terminal includes a first metal and a second metal different from the first metal. The first metal and the second metal are alternately exposed on a surface of the external terminal.

公开(公告)号：US20210358690A1

公开(公告)日：2021-11-18

申请号：US17243961

申请日：2021-04-29

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI ,  Norihisa ANDO ,  Kenya TAMAKI ,  Kayou MATSUNAGA

IPC: H01G4/232 ,  H05K3/34 ,  H01G4/005 ,  H01G2/06 ,  H01G4/30

Abstract: An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

公开(公告)号：US20190080841A1

公开(公告)日：2019-03-14

申请号：US16121719

申请日：2018-09-05

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Kenichi INOUE ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G2/06 ,  H01G4/01 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/38 ,  H05K3/34

CPC classification number: H01G2/065 ,  H01G4/01 ,  H01G4/12 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H01G4/38 ,  H05K3/341 ,  H05K2201/10431

Abstract: A method of manufacturing an electronic device includes preparing a chip component with a terminal electrode. A terminal plate is prepared. A connection member is placed between an end surface of the terminal electrode and an inner surface of the terminal plate. The terminal plate and the terminal electrode are joined using the connection member by bringing a press head into contact with an outer surface of the terminal plate and pressing and heating the terminal plate against the terminal electrode.

公开(公告)号：US20180286584A1

公开(公告)日：2018-10-04

申请号：US15928752

申请日：2018-03-22

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Katsumi KOBAYASHI ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/12 ,  H01G4/005 ,  H01G4/232 ,  H01G2/06

CPC classification number: H01G4/1227 ,  H01G2/06 ,  H01G2/065 ,  H01G4/005 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: A ceramic electronic device includes a chip component and a pair of metal terminals. The component includes a rectangular-parallelepiped element body having dielectrics and internal electrodes and a pair of terminal electrodes covering end surfaces of the body and a part of side surfaces of the body. The pair of metal terminals respectively has an engagement arm portion configured to hold the component. The terminal electrode includes first and second side surfaces. The first side surface has a predetermined side-surface electrode thickness. The second side surface is disposed farther from the end surface of the body than the first side surface and has the side-surface electrode thickness which is smaller than that of the first side surface. The arm portion contacts with the component at a position that is farther from the end surface of the body than the first side surface.

公开(公告)号：US20180182553A1

公开(公告)日：2018-06-28

申请号：US15854523

申请日：2017-12-26

Applicant: TDK CORPORATION

Inventor： Kosuke YAZAWA ,  Norihisa ANDO ,  Masahiro MORI ,  Sunao MASUDA ,  Kayou MATSUNAGA

IPC: H01G4/248 ,  H01G4/224 ,  H01G4/38

CPC classification number: H01G4/248 ,  H01G4/1227 ,  H01G4/224 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/38

Abstract: A ceramic electronic device includes a chip component, a pair of metal terminal portions, and a case. The metal terminal portion includes a terminal connection portion and a mount portion. The terminal connection portion faces a chip end surface and is connected with a terminal electrode. The mount portion is electrically connected with the terminal connection portion, extends toward a center substantially vertically to the chip end surface, and faces the chip component with a predetermined space. The case has a pair of case end walls sandwiching the pair of metal terminal portions from both sides and holding the chip component between the pair of metal terminal portions.

公开(公告)号：US20170186539A1

公开(公告)日：2017-06-29

申请号：US15391312

申请日：2016-12-27

Applicant: TDK CORPORATION

Inventor： Sunao MASUDA ,  Katsumi KOBAYASHI ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Norihisa ANDO

IPC: H01G4/248 ,  H01G4/232 ,  H01G4/30

CPC classification number: H01G4/248 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/30

Abstract: An electronic device includes a chip component with a terminal electrode formed on an end surface of a ceramic element body including an internal electrode and an external terminal electrically connected to the terminal electrode. The external terminal includes a terminal electrode connection part arranged to face the terminal electrode and a mounting connection part connectable to a mounting surface. The terminal electrode connection part includes a multilayer structure of a first metal connected to the terminal electrode, a second metal arranged outside the first metal, and a third metal arranged outside the second metal. A thermal expansion coefficient of the external terminal is smaller than that of the ceramic element body.

公开(公告)号：US20210366654A1

公开(公告)日：2021-11-25

申请号：US17322079

申请日：2021-05-17

Applicant: TDK CORPORATION

Inventor： Toshihiro IGUCHI ,  Norihisa ANDO ,  Kenya TAMAKI ,  Kayou MATSUNAGA

IPC: H01G4/012 ,  H01G4/30 ,  H01G4/12 ,  H01G4/008 ,  H01G2/06

Abstract: An electronic component according to the present invention is an electronic component including: a ceramic element body including an internal electrode; and an external electrode formed on an outer surface of the ceramic element body. The external electrode includes: a first electrode layer electrically connected to at least a part of the internal electrode; and a second electrode layer formed on an outside of the first electrode layer. The first electrode layer has a first conductor region containing copper, and the second electrode layer has a second conductor region including a matrix phase containing silver and palladium and copper particles dispersed in the matrix phase.

公开(公告)号：US20200043652A1

公开(公告)日：2020-02-06

申请号：US16414873

申请日：2019-05-17

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA ,  Jin MURAKAMI

IPC: H01G2/06 ,  H01G4/228 ,  H01G4/12 ,  H01G4/38

Abstract: An electronic device includes a plurality of chip components, an intermediate metal terminal, and an outer metal terminal. The intermediate metal terminal connects end surfaces of terminal electrodes of the chip components. The outer metal terminal is connectable to the terminal electrode positioned opposite to the terminal electrode connectable to the intermediate metal terminal.

公开(公告)号：US20190318875A1

公开(公告)日：2019-10-17

申请号：US16452042

申请日：2019-06-25

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/232 ,  H01G4/30 ,  H01G2/06 ,  H01G4/38

Abstract: An electronic device includes a chip component and a metal terminal. The chip component has an element body where internal electrodes are laminated inside and a terminal electrode formed outside the element body and connected with end parts of the internal electrodes. The metal terminal is connected with the terminal electrode of the chip component. The metal terminal includes an electrode face portion and a mount portion. The electrode face portion is arranged correspondingly with an end surface of the terminal electrode. The mount portion is mounted on a mount surface. The electrode face portion is provided with an opening portion so that a part of the terminal electrode corresponding with at least a part of the internal electrodes is exposed to the outside.

公开(公告)号：US20190304692A1

公开(公告)日：2019-10-03

申请号：US16351060

申请日：2019-03-12

Applicant: TDK CORPORATION

Inventor： Norihisa ANDO ,  Sunao MASUDA ,  Masahiro MORI ,  Kayou MATSUNAGA ,  Kosuke YAZAWA

IPC: H01G4/248 ,  H01G4/38

Abstract: An electronic device includes a chip component and a metal terminal. The chip component includes a terminal electrode formed on an element body. The metal terminal is connectable with the terminal electrode of the chip component. The metal terminal includes a terminal body and a pair of holding pieces. The terminal body faces an end surface of the terminal electrode of the chip component. The pair of holding pieces is formed on the terminal body. One of the pair of holding pieces is formed at one end of the terminal body. An adjustment portion is formed in a boundary region between the holding piece and the end of the terminal body.