公开(公告)号：US20140057091A1

公开(公告)日：2014-02-27

申请号：US13948398

申请日：2013-07-23

Applicant: tesa SE

Inventor： Thorsten Krawinkel ,  Alexander Prenzel ,  Minyoung Bai

IPC: C09J7/02

CPC classification number: C09J7/38 ,  C09J7/22 ,  C09J7/26 ,  C09J7/383 ,  C09J2409/00 ,  C09J2425/00 ,  C09J2433/006 ,  C09J2453/00 ,  Y10T428/249971 ,  Y10T428/249983

Abstract: An adhesive tape, with a carrier material, has an acrylate-based foam layer bearing at least one layer of pressure-sensitive adhesive. The pressure-sensitive adhesive (a) being composed of a mixture of at least two different synthetic rubbers, more particularly based on vinylaromatic block copolymers, (b) comprising a resin which is not soluble in the acrylates forming the foam layer, and (c) being chemically uncrosslinked.

Abstract translation: 具有载体材料的胶带具有至少一层压敏粘合剂的基于丙烯酸酯的泡沫层。 压敏粘合剂（a）由至少两种不同的合成橡胶，特别是基于乙烯基芳族嵌段共聚物的混合物组成，（b）包含不溶于形成泡沫层的丙烯酸酯的树脂，和（c ）在化学上是未交联的。

公开(公告)号：US11084958B2

公开(公告)日：2021-08-10

申请号：US14653498

申请日：2013-12-05

Applicant: TESA SE

Inventor： Thorsten Krawinkel ,  Lesmona Scherf ,  Anika Petersen ,  Thilo Dollase

IPC: C09J153/02 ,  C09J7/22 ,  C09J7/38 ,  C09J7/25 ,  C08K5/01

Abstract: The invention relates to an adhesive film strip comprising at least two, particularly three, layers, which adhesive film strip can be detached without residues and nondestructively by expansive stretching substantially in the adhesion plane, with a carrier on which a first external adhesive compound layer is present on at least one side, wherein • the adhesive compound layer consists of adhesive compound formed on the basis of vinyl aromatic block copolymers and adhesive resins, wherein at least 75% of the resin (relative to the overall resin content) is selected with a DACP (diacetone alcohol cloud point) of greater than −20° C., preferably greater than 0° C., and • the carrier has at least one layer consisting of a polyurethane with an elongation at break of at least 100% and a restoring power of more than 50%. A nonpolar hydrocarbon resin or a polyterpene resin is particularly used as the tackifier for the adhesive compound(s).

公开(公告)号：US20150079389A1

公开(公告)日：2015-03-19

申请号：US14389596

申请日：2013-03-25

Applicant: tesa SE

Inventor： Thorsten Krawinkel ,  Klaus Keite-Telgenbüsher ,  Judith Grünauer ,  Jan Ellinger

IPC: C09J153/02 ,  C09J5/06 ,  C09J5/02 ,  C09J7/02

CPC classification number: C09J153/025 ,  C08F8/36 ,  C08K5/0091 ,  C08K5/07 ,  C08L53/025 ,  C08L91/00 ,  C08L2205/02 ,  C09J5/02 ,  C09J5/06 ,  C09J7/20 ,  C09J7/35 ,  C09J7/387 ,  C09J11/06 ,  C09J153/00 ,  C09J193/04 ,  C09J2203/318 ,  C09J2453/00 ,  H01L51/5246 ,  H01L2924/0002 ,  Y10T428/2852 ,  H01L2924/00

Abstract: Adhesive compound as a permeant barrier, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of the coupling reagent, n is a whole number between 2 and 10, A is a polymer made of a vinyl aromatic compound and B is a polymer block made of an alkene or diene, wherein this polymer block can also be hydrated, with the condition that at least part of the A blocks is sulfonated, optionally with two-block copolymers in the form of A-B as an admixture component, and (ii) at least one tackifier resin.

Abstract translation: 粘合剂作为渗透屏障，包括（i）嵌段共聚物，其具有结构ABA，（AB）n，（AB）nX或（ABA）nX，其中X是偶联剂的基团，n是 如图2和10所示，A是由乙烯基芳族化合物制成的聚合物，B是由烯烃或二烯制成的聚合物嵌段，其中该聚合物嵌段也可以水合，条件是至少部分A嵌段被磺化， 任选地以AB作为混合组分的形式的双嵌段共聚物，和（ii）至少一种增粘树脂。

公开(公告)号：US09598614B2

公开(公告)日：2017-03-21

申请号：US14397955

申请日：2013-04-05

Applicant: TESA SE

Inventor： Lesmona Scherf ,  Thorsten Krawinkel ,  Alexander Fischer

IPC: H01B1/02 ,  H01B1/22 ,  C09J9/02 ,  C09J7/00 ,  C08L21/00

CPC classification number: C09J9/02 ,  C08L21/00 ,  C09J7/00 ,  C09J7/10 ,  H01L2224/83851

Abstract: The invention relates to an adhesive film comprising a layer of an adhesive compound as well as conductive particles that are added to the adhesive compound, characterized in that a portion of the conductive particles are fibrous and a portion of the particles are in the form of dendritic structures.

公开(公告)号：US09422466B2

公开(公告)日：2016-08-23

申请号：US14389529

申请日：2013-03-25

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbüsher ,  Jan Ellinger ,  Judith Grünauer ,  Thorsten Krawinkel

IPC: C09J7/02 ,  C09J153/00 ,  C09J11/06 ,  C09J153/02 ,  B05D3/02 ,  C08K5/00

CPC classification number: C09J153/00 ,  B05D3/0218 ,  B05D3/0254 ,  C08K5/0025 ,  C08K5/0091 ,  C09J7/387 ,  C09J11/06 ,  C09J153/025 ,  C09J2453/00 ,  Y10T428/2857

Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.

Abstract translation: 温度稳定的粘合剂化合物，其包含（i）具有结构ABA，（AB）n，（AB）nX或（ABA）nX的嵌段共聚物，其中X是偶联试剂的基团，n是2和 10，A是乙烯基芳族化合物的聚合物嵌段，B是烯烃或二烯的聚合物嵌段，至少一些A嵌段被磺化，和任选的AB型的二嵌段共聚物，和（ii）至少一种增粘剂 树脂，和（iii）至少一种具有可取代的络合剂的金属络合物。

公开(公告)号：US20150129812A1

公开(公告)日：2015-05-14

申请号：US14397955

申请日：2013-04-05

Applicant: TESA SE

Inventor： Lesmona Scherf ,  Thorsten Krawinkel ,  Alexander Fischer

IPC: C09J9/02

CPC classification number: C09J9/02 ,  C08L21/00 ,  C09J7/00 ,  C09J7/10 ,  H01L2224/83851

Abstract: The invention relates to an adhesive film comprising a layer of an adhesive compound as well as conductive particles that are added to the adhesive compound, characterized in that a portion of the conductive particles are fibrous and a portion of the particles are in the form of dendritic structures.

Abstract translation: 本发明涉及一种粘合剂膜，其包括粘合剂化合物层以及添加到粘合剂化合物中的导电颗粒，其特征在于，导电颗粒的一部分是纤维状的，并且一部分颗粒呈树枝状 结构。

公开(公告)号：US11142672B2

公开(公告)日：2021-10-12

申请号：US16369406

申请日：2019-03-29

Applicant: tesa SE

Inventor： Klaus Keite-Telgenbüscher ,  Christian Schuh ,  Bernd Lühmann ,  Thilo Dollase ,  Minyoung Bai ,  Thorsten Krawinkel

IPC: C09J125/08 ,  C09J7/38 ,  C09J153/00 ,  C09J153/02 ,  C08L63/00 ,  B82Y30/00 ,  B82Y40/00 ,  H01L51/52

Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.

公开(公告)号：US10717906B2

公开(公告)日：2020-07-21

申请号：US16172061

申请日：2018-10-26

Applicant: TESA SE

Inventor： Daniel Schmitz-Stapela ,  Thorsten Krawinkel ,  Thilo Dollase ,  Anika Petersen ,  Tanja Altenwegner ,  Andreas Westphal

IPC: C09J153/02 ,  C09J11/06 ,  B32B7/12 ,  C09J7/38 ,  C08L53/02 ,  C08L57/02 ,  C08K5/105 ,  C08K5/3435 ,  C08K5/3475

Abstract: A single- or double-sidedly bonding adhesive-sheet strip having a self-adhesive composition comprising a) at least one elastomer, at least one type of polybutadiene block copolymer being used as an elastomer, b) at least one partially hydrogenated hydrocarbon resin having a softening temperature of at least 90° C., c) at least one additional hydrocarbon resin, a terpene phenol resin and/or a colophonium resin having a softening temperature of at least 90° C., d) an optional soft resin, and e) additional additives as applicable.

公开(公告)号：US10040975B2

公开(公告)日：2018-08-07

申请号：US15009003

申请日：2016-01-28

Applicant: TESA SE

Inventor： Thorsten Krawinkel ,  Andreas Junghans

IPC: B32B7/06 ,  C09J7/02 ,  B32B5/04 ,  B32B43/00 ,  C09J7/38 ,  C09J7/26 ,  C09J7/29 ,  C09J153/02 ,  C09J183/04

CPC classification number: C09J7/387 ,  B32B5/04 ,  B32B43/006 ,  C09J7/26 ,  C09J7/29 ,  C09J7/381 ,  C09J153/02 ,  C09J183/04 ,  C09J2201/134 ,  C09J2201/162 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2201/618 ,  C09J2400/243 ,  C09J2423/105 ,  C09J2453/00 ,  C09J2467/006 ,  C09J2483/00 ,  Y10T156/1142 ,  Y10T428/249983 ,  Y10T428/2848

Abstract: A method of separating two substrates bonded with a redetachable, at least single-sidedly pressure-sensitive adhesive strip composed at least of a) a core layer which has a breaking extension of at least 300%, b) an outer carrier layer which has a breaking extension of not more than 120% and which at least sectionally is connected to the core layer such that it separates from the core layer when the latter is extensionally stretched, and c) a first adhesive layer which is applied at least sectionally to the side of the outer carrier layer that is opposite the side connected to the core layer, in which the core layer is stretched in the direction of the bond plane, starting from a region which has been made nonadhesive, until the core layer releases from at least one of the outer carrier layers so that the two substrates are separated from one another.

公开(公告)号：US20140322526A1

公开(公告)日：2014-10-30

申请号：US14353179

申请日：2012-10-19

Applicant: tesa SE

Inventor： Thilo Dollase ,  Thorsten Krawinkel ,  Minyoung Bai

IPC: C09J153/02 ,  C09J135/02 ,  C09J7/02

CPC classification number: C09J153/02 ,  B32B17/064 ,  C03C27/10 ,  C08L35/02 ,  C08L53/00 ,  C08L93/00 ,  C08L2205/03 ,  C09J7/22 ,  C09J7/38 ,  C09J135/02 ,  C09J153/00 ,  C09J193/00 ,  C09J193/04 ,  H01L2924/0002 ,  Y10T428/266 ,  Y10T428/2891 ,  H01L2924/00

Abstract: The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40° C.; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40° C., preferably less than 20° C.; and (d) at least one type of photoinitiator for initiating radical curing.

Abstract translation: 本发明涉及一种粘合剂物质，特别是用于将电子组件封装在渗透物上，所述物质包括：（a）至少一种至少含有异丁烯或丁烯作为共聚单体类型的共聚物和至少一种共聚单体类型，当被认为是 假定的均聚物，其软化温度大于40℃。 （b）至少一种类型的至少部分氢化的粘合剂树脂; （c）至少一种丙烯酸酯或甲基丙烯酸酯类型的反应性树脂，其软化温度低于40℃，优选小于20℃。 和（d）至少一种用于引发自由基固化的光引发剂。