公开(公告)号：US09206308B2

公开(公告)日：2015-12-08

申请号：US13637629

申请日：2011-03-22

Applicant: Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

Inventor： Tomoaki Iwami ,  Masaaki Matsumoto ,  Tomoyuki Abe ,  Tatsuo Yonemoto ,  Hiroaki Fujiwara

IPC: H05K1/03 ,  B32B27/04 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  C08K3/10 ,  C08K3/22 ,  C08L63/00 ,  C08G59/22 ,  C08G59/30 ,  C08G59/38 ,  C08G59/62 ,  C08G59/40 ,  C08J5/24 ,  C08K9/02 ,  C08K5/5313 ,  C08K5/5397

CPC classification number: C08L63/00 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/10 ,  C08K3/22 ,  C08K5/5313 ,  C08K5/5397 ,  C08K9/02 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0263

Abstract: The problem to be solved by the invention is to provide an epoxy resin composition for a prepreg, which is used in the manufacture of a printed circuit board containing a multilayer printed circuit board, wherein the epoxy resin composition for a prepreg is characterized by containing as essential components, a phosphorus compound that has 1.8 or more and less than 3 on average of a phenolic hydroxyl group that is reactive to an epoxy resin in the molecule, and that has 0.8 or more on average of a phosphorus element; a bifunctional epoxy resin that has 1.8 or more and less than 2.6 on average of epoxy groups in the molecule; a multi-functional epoxy resin that contains 2.8 or more on average of epoxy groups in one molecule; a hardening agent; an inorganic filler; and a molybdenum compound, wherein the epoxy resin composition for a prepreg is obtained by blending a pre-reacted epoxy resin, which is obtained by reacting at least the phosphorus compound with the bifunctional epoxy resin and the multi-functional epoxy resin, or the bifunctional epoxy resin only in advance, the bifunctional epoxy resin or the multi-functional epoxy resin, the hardening agent, the inorganic filler, and the molybdenum compound, which is excellent in flame retardance, heat resistance, thermal stiffness, and excellent in hole position accuracy without the production of a harmful substance at the time of combustion, a prepreg using the epoxy resin composition for a prepreg, and a multilayer printed circuit board using the prepreg.

Abstract translation: 本发明要解决的问题是提供一种用于预浸料的环氧树脂组合物，其用于制造含有多层印刷电路板的印刷电路板，其中预浸料的环氧树脂组合物的特征在于含有 必要成分，平均分子中与环氧树脂反应的酚羟基平均为1.8以上且小于3的磷化合物，平均为磷成分为0.8以上的磷化合物; 分子中环氧基团平均为1.8以上且小于2.6的双官能环氧树脂; 在一个分子中含有2.8个或更多个平均环氧基的多官能环氧树脂; 硬化剂; 无机填料; 和钼化合物，其中预浸料用环氧树脂组合物通过将至少使磷化合物与双官能环氧树脂和多官能环氧树脂反应获得的预反应环氧树脂或双官能团 环氧树脂仅提前，双功能环氧树脂或多功能环氧树脂，硬化剂，无机填料和钼化合物，其阻燃性，耐热性，热刚度优异，孔位精度优异 在燃烧时不产生有害物质，使用该预浸料坯用环氧树脂组合物的预浸料坯和使用该预浸料坯的多层印刷电路板。

公开(公告)号：US08642894B2

公开(公告)日：2014-02-04

申请号：US12689353

申请日：2010-01-19

Applicant: Tomoyuki Abe ,  Norikazu Ozaki

Inventor： Tomoyuki Abe ,  Norikazu Ozaki

IPC: H05K1/09

CPC classification number: H05K1/167 ,  H05K3/108 ,  H05K3/243 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4641 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0369 ,  H05K2203/0597 ,  H05K2203/1184 ,  H05K2203/1476

Abstract: Provided is a circuit board including a resin base, and a resistance element formed above the resin base. The resistance element includes a resistance pattern including an electrode portion and an extending portion, and an electrode formed on the electrode portion of the resistance pattern and including a foot portion reduced in thickness toward the extending portion.

Abstract translation: 提供了一种电路板，包括树脂基底和形成在树脂基底上方的电阻元件。 电阻元件包括电阻图案，其包括电极部分和延伸部分，以及电极，形成在电阻图案的电极部分上，并且包括朝向延伸部分减小厚度的脚部分。

公开(公告)号：US08250680B2

公开(公告)日：2012-08-28

申请号：US12172176

申请日：2008-07-11

Applicant: Kensuke Murata ,  Masayuki Nagaishi ,  Tomoyuki Abe ,  Hiroshi Tsuboi

Inventor： Kensuke Murata ,  Masayuki Nagaishi ,  Tomoyuki Abe ,  Hiroshi Tsuboi

IPC: E03D13/00

CPC classification number: G01V3/12 ,  E03D5/105 ,  E03D13/00

Abstract: A urinal includes: a urinal body; a high-frequency sensor which radiates a radio beam obliquely passing through an upper surface of the urinal body toward a bowl and receives a reflected wave from an object so as to generate a detection signal; and a valve which discharges or stops flushing water to the urinal body in response to the detection signal. An angle formed between a first plane including the upper surface of the urinal body and a second plane including a radiation surface of an antenna of the high-frequency sensor is in a range of more than 0 degree to less than 90 degree. A cross line where the first plane and the second plane intersect with each other is substantially parallel to a horizontal direction of the urinal body. The radio beam is a linearly-polarized wave. An excitation direction of the radio beam intersects with the cross line. An intensity of the radio beam passing through the urinal body is larger than that of the radio beam reflected by the upper surface.

Abstract translation: 小便池包括：小便器; 高频传感器，其将倾斜地通过小便器的上表面的无线电束朝向碗体辐射，并从物体接收反射波，以产生检测信号; 以及响应于检测信号而将冲洗水排出或停止到小便器体的阀。 在包括小便器的上表面的第一平面和包括高频传感器的天线的辐射表面的第二平面之间形成的角度在大于0度至小于90度的范围内。 第一平面和第二平面彼此交叉的交叉线基本上平行于小便器的水平方向。 无线电波束是线性偏振波。 无线电波束的激发方向与交叉线相交。 通过小便器的无线电波的强度大于由上表面反射的无线电波束的强度。

公开(公告)号：US08119925B2

公开(公告)日：2012-02-21

申请号：US12390010

申请日：2009-02-20

Applicant: Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano

Inventor： Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano

IPC: H05K1/00

CPC classification number: H05K3/4641 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/09809 ,  Y10T428/24331

Abstract: The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.

Abstract translation: 核心基材的芯层由浸渍有树脂的碳纤维制成。 当芯层的温度升高时，由于树脂的热膨胀，芯层的厚度增加。 芯层夹在包含玻璃纤维的绝缘层之间。 绝缘层用于抑制由芯层的热膨胀产生的芯层的厚度的增加。 核心基板中的热应力被抑制。

公开(公告)号：US08110749B2

公开(公告)日：2012-02-07

申请号：US12390168

申请日：2009-02-20

Applicant: Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano

Inventor： Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano

IPC: H05K1/16

CPC classification number: H05K3/445 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09809

Abstract: Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.

Abstract translation: 在印刷电路板的芯层中形成大尺寸的通孔。 大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料填充大尺寸通孔的内部空间。 小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。 小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。 这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

公开(公告)号：US07799604B2

公开(公告)日：2010-09-21

申请号：US11822084

申请日：2007-07-02

Applicant: Tomoyuki Abe ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Motoaki Tani

IPC: H01L21/44

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49833 ,  H01L23/5389 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3511

Abstract: A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.

Abstract translation: 半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片， 穿过所述支撑体和所述第二基板的开口部。 第一基板包括第一电介质层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括 由与第一电介质层基本相同的材料制成的第二电介质层。

公开(公告)号：US07448825B2

公开(公告)日：2008-11-11

申请号：US11698531

申请日：2007-01-26

Applicant: Atsushi Kasahara ,  Shunsuke Ushio ,  Kojiro Ogata ,  Hiroshi Inamitsu ,  Fumio Goto ,  Tomoyuki Abe ,  Hiroaki Irie ,  Isami Fujii ,  Kazuo Onoda ,  Hideo Ikeda ,  Eisuke Nagai ,  Atsuki Gomi ,  Masaki Tsunabuchi

Inventor： Atsushi Kasahara ,  Shunsuke Ushio ,  Kojiro Ogata ,  Hiroshi Inamitsu ,  Fumio Goto ,  Tomoyuki Abe ,  Hiroaki Irie ,  Isami Fujii ,  Kazuo Onoda ,  Hideo Ikeda ,  Eisuke Nagai ,  Atsuki Gomi ,  Masaki Tsunabuchi

IPC: E01C23/12 ,  E01C7/32

CPC classification number: E01C23/065

Abstract: A method for recycling in place an asphalt mixture layer of a paved road continuously, while moving a self-propelled vehicle system, which comprises a step of heating and softening the asphalt mixture layer, a step of scraping and breaking said hot and softened asphalt mixture layer and keeping the softened mixture at a temperature sufficient not to form an aggregate, to prepare an asphalt mixture having a single-grained structure, a sieving step of classifying said asphalt mixture having a single-grained structure into a plurality of grain size groups, a step of designing mix proportions for converting said asphalt mixture to a recycled asphalt mixture by the use of said plurality of grain size groups classified, a step of mixing uniformly said recycled asphalt mixtures having designed mix proportions, and a step of spreading and compacting said recycled asphalt mixtures having been mixed uniformly, to thereby form a recycled asphalt mixtures layer.

Abstract translation: 一种用于在移动自行车辆系统的同时循环使用铺路的沥青混合物层的方法，其包括加热和软化沥青混合物层的步骤，刮削和破碎所述热和软化沥青混合物的步骤 将软化混合物保持在足够不形成骨料的温度下，制备具有单一颗粒结构的沥青混合料，将具有单一颗粒结构的沥青混合料分级成多个粒度组的筛分步骤， 设计混合比例的步骤，通过使用分级的所述多个粒度组将所述沥青混合物转化为再循环沥青混合物，将所述具有设计的混合比例的再循环沥青混合物均匀混合的步骤，以及将所述沥青混合物扩展和压实所述 再循环沥青混合物已经均匀混合，从而形成再循环沥青混合物层。

公开(公告)号：US07400035B2

公开(公告)日：2008-07-15

申请号：US11023044

申请日：2004-12-28

Applicant: Tomoyuki Abe ,  Motoaki Tani

Inventor： Tomoyuki Abe ,  Motoaki Tani

IPC: H01L23/04 ,  H01L21/48

CPC classification number: H01L21/4857 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49833 ,  H01L23/5389 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3511

Abstract: A semiconductor device includes a support body, a first substrate provided on a surface at one side of the support body, a second substrate provided on a surface at the other side of the support body, and a semiconductor chip provided on the first substrate exposed to an opening part piercing the support body and the second substrate. The first substrate includes a first dielectric layer and a wiring layer, a plurality of first electrodes connected to the semiconductor chip which first electrodes are provided on a first surface of the first substrate exposed to an inside of the opening part, and the second substrate includes a second dielectric layer made of a material substantially the same as the first dielectric layer.

Abstract translation: 半导体器件包括支撑体，设置在支撑体的一侧的表面上的第一基板，设置在支撑体的另一侧的表面上的第二基板和设置在第一基板上的半导体芯片， 穿过所述支撑体和所述第二基板的开口部。 第一基板包括第一介电层和布线层，多个与半导体芯片连接的第一电极，第一电极设置在暴露于开口部的内部的第一基板的第一表面上，第二基板包括 由与第一电介质层基本相同的材料制成的第二电介质层。

公开(公告)号：US20060175084A1

公开(公告)日：2006-08-10

申请号：US11138467

申请日：2005-05-27

Applicant: Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

Inventor： Keishiro Okamoto ,  Tomoyuki Abe ,  Motoaki Tani ,  Nobuyuki Hayashi

IPC: H05K1/11 ,  H05K3/42

CPC classification number: H05K3/445 ,  H05K1/056 ,  H05K3/426 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/09581 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The wiring board comprises a plate-shaped conductive core material 10 with a through-hole 12 formed in, an insulation layer 14 formed on the surface of the conductive core material 10 and on the inside wall of the through-hole 12, a resin 18 buried in the through-hole 12 with the insulation layer 14 formed in, wirings 22a, 22b formed on the upper surface and the undersurface of the conductive core material 10 with the insulation layer 14 formed on, and an wiring 22d formed in the through-hole 20 formed in the resin 18 and electrically connected to the wirings 22a, 22b.

Abstract translation: 布线板包括具有形成在其中的通孔12的板状导电芯材10，形成在导电芯材10的表面上的绝缘层14和通孔12的内壁上的树脂18 埋置在通孔12中，其中形成有绝缘层14，形成在形成有绝缘层14的导电芯材10的上表面和下表面上的布线22a，22b以及形成在其中的布线22d 通孔20形成在树脂18中并电连接到布线22a，22b。

公开(公告)号：US20060108147A1

公开(公告)日：2006-05-25

申请号：US11320965

申请日：2005-12-30

Applicant: Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

Inventor： Tomoyuki Abe ,  Nobuyuki Hayashi ,  Motoaki Tani ,  Kenichiro Abe ,  Kenji Iida

IPC: H05K1/11 ,  H01R12/04

CPC classification number: G01R1/07314 ,  G01R1/44 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/117 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4688 ,  H05K2201/0323 ,  H05K2201/0919 ,  H05K2201/09536 ,  H05K2201/09845 ,  H05K2203/061

Abstract: A printed wiring board is made of first and second substrates superimposed on each other. The first and second substrates respectively include a core layer made of resin containing carbon fibers. The second substrate has the outline different from that of the first substrate. A stepped surface is defined on the front surface at least of the first substrate. Electrodes can be formed on the stepped surface as well as on the back surface of the first substrate and the front surface of the second substrate. This structure enables detection of an electric signal from the stepped surface. A further flexibility can thus be achieved in locating electrodes as compared with a conventional printed wiring board having uniform substrates simply superimposed on each other. This results in an expanded use or purpose for a printed wiring board.

Abstract translation: 印刷电路板由彼此重叠的第一和第二基板制成。 第一和第二基板分别包括由含有碳纤维的树脂制成的芯层。 第二基板具有与第一基板的轮廓不同的轮廓。 至少在第一基板的表面上限定有台阶面。 电极可以形成在台阶表面以及第一基板的背面和第二基板的前表面上。 该结构能够检测来自台阶表面的电信号。 因此与具有简单地叠加的均匀基板的传统印刷线路板相比，可以在定位电极方面实现更大的灵活性。 这导致印刷电路板的使用或目的的扩大。