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    SUBSTRATE STRUCTURE WITH HIGH REFLECTANCE AND METHOD FOR MANUFACTURING THE SAME
    11.
    发明申请
    SUBSTRATE STRUCTURE WITH HIGH REFLECTANCE AND METHOD FOR MANUFACTURING THE SAME 有权

    公开(公告)号：US20210385943A1

    公开(公告)日：2021-12-09

    申请号：US17406078

    申请日：2021-08-19

    Applicant: UNIFLEX Technology Inc.

    Inventor： Cheng-I Tu ,  Ying-Hsing Chen ,  Meng-Huan Chia ,  Hsin-Ching Su ,  Yi-Chun Liu ,  Cheng-Chung Lai ,  Yuan-Chih Lee

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/28

    Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

    MANUFACTURING METHOD FOR FORMING SUBSTRATE STRUCTURE COMPRISING VIAS
    13.
    发明申请
    MANUFACTURING METHOD FOR FORMING SUBSTRATE STRUCTURE COMPRISING VIAS 审中-公开

    公开(公告)号：US20190008049A1

    公开(公告)日：2019-01-03

    申请号：US15834066

    申请日：2017-12-07

    Applicant: UNIFLEX Technology Inc.

    Inventor： Yi-Chun Liu ,  Yuan-Chih Lee ,  Hung-Tai Ting

    IPC: H05K3/00 ,  H01L21/48 ,  H05K3/42 ,  C23F1/00

    Abstract: A manufacturing method of a substrate structure including vias includes the following steps. A substrate is provided, wherein a material of the substrate includes polyimide. An etching stop layer is formed on the substrate, wherein the etching stop layer covers two opposite surfaces of the substrate. A patterned process is performed on the etching stop layer to form a plurality of openings exposing a part of the substrate. An etching process is performed on the substrate to remove the part of the substrate exposed by the openings and form a plurality of vias.

    Flexible printed circuit board structure
    14.
    发明授权
    Flexible printed circuit board structure 有权

    公开(公告)号：US10104778B2

    公开(公告)日：2018-10-16

    申请号：US15438634

    申请日：2017-02-21

    Applicant: UNIFLEX Technology Inc.

    Inventor： Yi-Chun Liu ,  Pei-Hao Hung ,  Wen-Chien Hsu ,  Meng-Huan Chia ,  Min-Ming Tsai ,  Shan-Yi Tseng ,  Yuan-Chih Lee

    IPC: H05K1/18 ,  H05K1/02

    Abstract: A flexible printed circuit board structure includes a spiral flexible printed circuit board and a protection cover capable of providing functions of extensibility and retractility. The spiral flexible printed circuit board includes a flexible substrate curling up spirally, a patterned circuit layer and a plurality of electrical contacts. The patterned circuit layer is disposed on the flexible substrate. The electrical contacts are disposed on an end of the flexible substrate and electrically connected to the patterned circuit layer. The protection cover at least covers a part of the spiral flexible printed circuit board.

    Package structure for backlight module
    17.
    发明授权
    Package structure for backlight module 有权

    公开(公告)号：US10580951B2

    公开(公告)日：2020-03-03

    申请号：US16040546

    申请日：2018-07-20

    Applicant: UNIFLEX Technology Inc.

    Inventor： Yi-Chun Liu ,  Ying-Hsing Chen ,  Bo-Hua Chen ,  Yuan-Chih Lee

    IPC: H01L33/58 ,  H01L33/62 ,  H01L33/60 ,  H01L33/48

    Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

    PACKAGE STRUCTURE FOR BACKLIGHT MODULE
    18.
    发明申请
    PACKAGE STRUCTURE FOR BACKLIGHT MODULE 审中-公开

    公开(公告)号：US20190305200A1

    公开(公告)日：2019-10-03

    申请号：US16040546

    申请日：2018-07-20

    Applicant: UNIFLEX Technology Inc.

    Inventor： Yi-Chun Liu ,  Ying-Hsing Chen ,  Bo-Hua Chen ,  Yuan-Chih Lee

    IPC: H01L33/62 ,  H01L33/48 ,  H01L33/60

    Abstract: A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.

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