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    OUT-OF-PLANE MICRONEEDLE MANUFACTURING PROCESS
    13.
    发明申请
    OUT-OF-PLANE MICRONEEDLE MANUFACTURING PROCESS 有权
    超平面麦克风制造工艺

    公开(公告)号：US20100280458A1

    公开(公告)日：2010-11-04

    申请号：US12808334

    申请日：2008-10-17

    Applicant: Astrid Cachemaille ,  Francois Cannehan

    Inventor： Astrid Cachemaille ,  Francois Cannehan

    IPC: A61M5/00 ,  B23P17/04

    CPC classification number: A61M37/0015 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00111 ,  Y10T29/49826 ,  Y10T428/24479

    Abstract: Out-of-plane microneedle manufacturing process comprising the simultaneous creation of a network of microneedles and the creation of a polygonal shaped hat (2) above each microneedle (1) under formation, said process comprising the following steps: providing bridges (3) between the hats (3), maintaining the bridges (3) during the remaining microneedle manufacturing steps, removing the bridges (3), together with the hats (2), when the microneedles (1) are formed.

    Abstract translation: 面外微型制造工艺包括同时创建微针网络并在形成每个微针（1）上方形成多边形帽（2），所述方法包括以下步骤：提供桥 （3），在剩余的微针制造步骤期间保持桥（3），当形成微针（1）时，与帽子（2）一起移除桥（3）。

    METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING
    14.
    发明申请
    METHOD FOR PRODUCING MICRONEEDLE STRUCTURES EMPLOYING ONE-SIDED PROCESSING 审中-公开
    生产采用单面加工的微结构结构的方法

    公开(公告)号：US20100224590A1

    公开(公告)日：2010-09-09

    申请号：US12160444

    申请日：2008-05-20

    Applicant: Yehoshua Yeshurun ,  Meint de Boer ,  J.W. Berenschot

    Inventor： Yehoshua Yeshurun ,  Meint de Boer ,  J.W. Berenschot

    IPC: B81C1/00

    CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B81B2201/055

    Abstract: A method for forming a hollow microneedle structure includes processing the front side of a wafer to form at least one microneedle projecting from a substrate and a through-bore passing through the microneedle and through a thickness of the substrate. An entire length of the through-bore is formed by a dry etching process performed from the front side of the wafer. Most preferably, upright surfaces of the microneedle structure and the through bore of the structure are formed by dry etching performed via a single mask with differing depths obtained by harnessing aspect ratio limitations of the dry etching process.

    Abstract translation: 用于形成中空微针结构的方法包括处理晶片的前侧以形成从基底突出的至少一个微针和穿过微针并穿过基底的厚度的通孔。 通孔的整个长度通过从晶片的前侧进行的干蚀刻工艺形成。 最优选地，微针结构的直立表面和结构的通孔通过经由通过利用干蚀刻工艺的纵横比限制而获得的不同深度的单个掩模执行的干蚀刻形成。

    Wet etch processing
    15.
    发明授权
    Wet etch processing 失效
    湿式蚀刻处理

    公开(公告)号：US07651946B2

    公开(公告)日：2010-01-26

    申请号：US11637020

    申请日：2006-12-12

    Applicant: Nicolle Wilke ,  Anthony Morrissey

    Inventor： Nicolle Wilke ,  Anthony Morrissey

    IPC: H01L21/311

    CPC classification number: A61M37/0015 ,  A61M2037/003 ,  A61M2037/0046 ,  A61M2037/0053 ,  B81B2201/055 ,  B81C1/00626 ,  B81C99/0065 ,  B81C2201/0133 ,  B81C2201/0138

    Abstract: A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.

    Abstract translation: 湿蚀刻的方法产生用于医疗应用的高精度微针阵列。 该方法通过精确地识别蚀刻时间终点，通过使用氢氧化钾（KOH）溶液对硅进行湿蚀刻，在单晶片或批次水平上实现了微针制造的精确过程控制。 因此，实现了精确要求的高度，形状，锐度和表面质量的微针。 结果是可靠，可重现，稳健且相对便宜的微针制作工艺。 通过KOH湿蚀刻形成的微针具有非常光滑的表面，并且对其干蚀刻的对应物表现出优异的机械和结构坚固性。 这些性能为这种硅微针提供了额外的可靠性，使其成为医疗应用的理想选择。 针也可以是中空的。 湿法蚀刻的硅微针可用作主机，通过模制复制其他材料（如聚合物）中改进的表面和结构性能。

    Method of manufacturing hollow micro-needle structures
    16.
    发明申请
    Method of manufacturing hollow micro-needle structures 有权
    中空微针结构的制造方法

    公开(公告)号：US20070275521A1

    公开(公告)日：2007-11-29

    申请号：US11798884

    申请日：2007-05-17

    Applicant: Chien-Chung Fu

    Inventor： Chien-Chung Fu

    IPC: H01L21/8234 ,  H01L21/336

    CPC classification number: B29C35/0894 ,  A61M37/0015 ,  A61M2037/0053 ,  B29C2035/0827 ,  B81B2201/055 ,  B81C1/00111

    Abstract: A method of manufacturing a hollow micro-needle structure includes the steps of: disposing a first mask layer and a second mask layer respectively aside a first substrate and aside a rear surface of the first substrate, wherein the first substrate is transparent to predetermined light; forming a photoresist layer on the front surface of the first substrate and the first mask layer; providing the predetermined light to illuminate the first substrate in a direction from the rear surface to the front surface so as to expose the photoresist layer to form an exposed portion and an unexposed portion; and removing the unexposed portion to form the micro-needle structure, which is formed by the exposed portion. The micro-needle structure has an inclined sidewall and a through hole surrounded by the inclined sidewall.

    Abstract translation: 一种中空微针结构体的制造方法，其特征在于，包括：将第一掩模层和第二掩模层分别配置在第一基板的外侧，将第一基板的背面放置在第一基板的背面， 在所述第一基板和所述第一掩模层的前表面上形成光致抗蚀剂层; 提供所述预定光以在从所述后表面到所述前表面的方向上照亮所述第一基板，以暴露所述光致抗蚀剂层以形成暴露部分和未曝光部分; 并且去除未曝光部分以形成由暴露部分形成的微针结构。 微针结构具有倾斜侧壁和由倾斜侧壁包围的通孔。

    Flexible substrate structure for microneedle arrays and its manufacturing method
    17.
    发明授权
    Flexible substrate structure for microneedle arrays and its manufacturing method 有权
    微针阵列柔性基片结构及其制造方法

    公开(公告)号：US07273474B2

    公开(公告)日：2007-09-25

    申请号：US10462628

    申请日：2003-06-17

    Applicant: Kai-Cheng Chang ,  Guang-Chyeng Fan

    Inventor： Kai-Cheng Chang ,  Guang-Chyeng Fan

    IPC: A61M5/32

    CPC classification number: B81C1/00111 ,  A61M37/00 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  B81B2201/055

    Abstract: The present invention is related to a flexible substrate structure for microneedle arrays and its manufacturing method, whose structure mainly comprising: tapered shape objects and flexible substrate. Wherein, structure of the tapered shape object is composed of a tip, sidewalls, and a base. Meanwhile, the flexible substrate winds tightly around sidewalls of tapered shape objects and is set up on, yet covers the base surface of tapered shape object which faces the tip of tapered shape object. Because the structure applies a flexible substrate along with tapered shape objects, hence, the fit-to-body capability is increased and allows thereof more appropriate for backside drug delivery, as well as sufficiently bring the characteristic of large-area manufacturing into full play.

    Abstract translation: 本发明涉及一种用于微针阵列的柔性衬底结构及其制造方法，其结构主要包括：锥形形状物体和柔性衬底。 其中，锥形物体的结构由尖端，侧壁和基部构成。 同时，柔性基板紧紧地卷绕在锥形形状物体的侧壁周围，并且被设置在其上，同时覆盖面对锥形物体的尖端的锥形物体的基面。 由于该结构与锥形物体一起应用柔性基板，因此，适合身体的能力增加，并且允许其适合于背侧药物递送，并且充分地充分发挥了大面积制造的特征。

    Intracutaneous microneedle array apparatus
    19.
    发明授权
    Intracutaneous microneedle array apparatus 有权

    公开(公告)号：US06931277B1

    公开(公告)日：2005-08-16

    申请号：US09580819

    申请日：2000-05-26

    Applicant: Vadim Vladimirovich Yuzhakov ,  Faiz Feisal Sherman ,  Grover David Owens ,  Vladimir Garstein

    Inventor： Vadim Vladimirovich Yuzhakov ,  Faiz Feisal Sherman ,  Grover David Owens ,  Vladimir Garstein

    IPC: A61M5/00 ,  A61M5/172 ,  A61M37/00 ,  A61N1/30 ,  A61M5/32

    CPC classification number: B81C99/0085 ,  A61M5/1723 ,  A61M37/0015 ,  A61M2037/0023 ,  A61M2037/003 ,  A61M2037/0053 ,  A61M2037/0061 ,  A61N1/30 ,  B81B2201/055

    Abstract: Improved microneedle arrays are provided having a sufficiently large separation distance between each of the individual microneedles to ensure penetration of the skin while having a sufficiently small separation distance to provide high transdermal transport rates. A very useful range of separation distances between microneedles is in the range of 100–300 microns, and more preferably in the range of 100–200 microns. The outer diameter and microneedle length is also very important, and in combination with the separation distance will be crucial as to whether or not the microneedles will actually penetrate the stratum corneum of skin. For circular microneedles, a useful outer diameter range is from 20–100 microns, and more preferably in the range of 20–50 microns. For circular microneedles that do not have sharp edges, a useful length for use with interstitial fluids is in the range of 50–200 microns, and more preferably in the range of 100–150 microns; for use with other biological fluids, a useful length is in the range of 200 microns–3 mm, and more preferably in the range of 200–400 microns. For circular microneedles having sharp side edges, a useful length for use with interstitial fluids is in the range of 50–200 microns, and more preferably in the range of 80–150 microns; for use with other biological fluids, a useful length is again in the range of 200 microns–3 mm, and more preferably in the range of 200–400 microns. For solid microneedles having a star-shaped profile with sharp edges for its star-shaped blades, a useful length for use with interstitial fluids is in the range of 50–200 microns, and more preferably in the range of 80–150 microns; for use with other biological fluids, a useful length is again in the range of 200 microns–3 mm, and more preferably in the range of 200–400 microns, while the radius of each of its blades is in the range of 10–50 microns, and more preferably in the range of 10–15 microns.

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